• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.164-169
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• 2017

Ni-Cr-X ternary interlayers were investigated to improve the adhesion of Cu/Ni-Cr/Polyimide flexible copper clad laminates. The ternary compounds are sputtered Ni-Cr-X films (where X is one of Nb, V, Mo, or Ti), and the effect of third elements on the adhesion was evaluated and investigated chemically and mechanically. The feel strength was higher in the order of Ni-Cr-Nb > Ni-Cr-V > Ni-Cr > Ni-Cr-Mo > Ni-Cr-Ti. Nb, which has a comparable standard electrode potential to Cr, increased the adhesion, while Ti, with a low standard electrode potential, degraded the adhesion. The Ni-Cr-Nb interlayer was amorphous, while Ni-Cr-Ti was partially crystalline. The similar morphology structure of the Ni-Cr-Nb interlayer with polyimide resulted in a better adhesion.

• Polymer(Korea)
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• v.31 no.2
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• pp.130-135
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• 2007

To enhance the thermo-mechanical properties of polyimide films which have potential application for the FCCL, we have synthesized the poly (amic acid) s composed of 4-components PMDA/BTDA and PDA/ODA as monomer system, u4 then they were effectively converted into 4-component polyimide films by thermal imidization process. It has been found that CTE values in the range of $100\sim200^{\circ}C$ decreased with the amount of PDA, which also caused 36% and 59% increases in tensile modulus and strength respectively. And also, peel test results on 3-layered copper clad laminate using 4-component polyimide films showed excellent adhesion strength above 1.8 kgf/cm. On the basis of obtained results it can be concluded that 4-component polyimide films may be applied for the high performance FCCL base films.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.67-72
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• 2012

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.

• Journal of Korean Society of Environmental Engineers
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• v.29 no.9
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• pp.1013-1019
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• 2007

Electronic wastes have increased tremendously. However, any reliable treatment methodologies have rarely been established. Electronic wastes have posed serious disposal problem due to their physico-chemical stability. This paper investigated the application possibility of pyrolysis for the purpose of recycling the p-CCL(phenol based Copper Clad Laminate). Thermogravimetric analysis(TGA) was used to investigate the thermal decomposition pattern of p-CCL. We elucidated the characteristics of pyrolysis by-products at operating temperatures of 280, 350 and $600^{\circ}C$. GC/MS and FT-IR were used to characterize the liquid by-products along with general characterization methods such as Ultimate Analysis, Proximate Analysis and Heating Value, whereas general characterization methods were only introduced for the solid by-products. At a heating rate of $5^{\circ}C$/min, TGA curves exhibited three decomposition stages: (1) low-temperature decomposition region$(<280^{\circ}C)$, (2) medium temperature region$(280\sim350^{\circ}C)$ and (3) high-temperature region$(>350^{\circ}C)$. The major compounds of liquid by-products at low- and medium-temperatures were accounted for by water and phenol, whereas branched phenols and furans were major compounds at high-temperatures. As the temperature increases, volatile quantities decreased but the fixed carbon increased. High heating values of solid by-products($7,400\sim7,600$ kcal/kg) would suggest that the solid by-products could be applicable as fuel. In addition, high fixed carbon but low ash content of the solid by-products offered an implication that they are capable of being upgradable for adsorbent after applying appropriate activating process.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.69-76
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• 2014

In this study, we developed an ultra-thin flexible printed circuit board(FPCB) using the sputtered flexible copper clad laminate. In order to enhance the adhesion between copper and polyimide substrate, a NiMoNb addition layer was applied. The mechanical durability and flexibility of the ultra-thin FPCB were characterized by stretching, twisting, bending fatigue test, and peel test. The stretching test reveals that the ultra-thin FPCB can be stretched up to 7% without failure. The twisting test shows that the ultra-thin FPCB can withstand an angle of up to $120^{\circ}$. In addition, the bending fatigue test shows that the FPCB can withstand 10,000 bending cycles. Numerical analysis of the stress and strain during stretching indicates the strain and the maximum von Mises stress of the ultra-thin FPCB are comparable to those of the conventional FPCB. Even though the ultra-thin FPCB shows slightly lower durability than the conventional FPCB, the ultra-thin FPCB has enough durability and robustness to apply in industry.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.345.1-345.1
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• 2016

구리 피막은 열 및 전기를 잘 전달하는 특성으로 인해 전기 배선이나 Heat Sink 재료 등에 이용되고 있다. 최근에는 전자파 차폐나 FCCL (Flexible Copper Clad Laminate) 등의 피막으로 널리 이용되면서 연속 코팅 및 후막 제조를 위한 고속 소스의 필요성이 증가하고 있다. 연속코팅 설비에 적용하거나 후막을 경제적으로 제조하기 위해서는 정지상태의 기판을 기준으로 시간당 $100{\mu}m$ 이상의 증착 속도가 요구된다. 기존 마그네트론 스퍼터링 소스의 경우 일반적으로 증착율이 시간당 $20{\mu}m$ 이내이며, 고전력을 이용하는 소스의 경우도 $60{\mu}m$를 넘지 못하고 있다. 본 발표에서는 자기장 시뮬레이션을 통해 자석의 배열을 최적화하고 냉각 효율을 고려한 소스 설계를 통해 고속 스퍼터링 소스를 제작하고 그 특성을 평가하였다. 제작된 소스는 구리 코팅을 위한 스퍼터링 공정 조건을 도출하고 다양한 기판에 $20{\mu}m$ 이상의 구리 후막을 코팅하여 미소 형상 및 코팅 조직을 분석하였다.

• The Optical Journal
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• s.120
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• pp.69-73
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• 2009

본 논문에서는 레이저 가공의 문제점인 FPCB에서의 낮은 생산성과 열영향을 보완하기 위한 실험내용을 다루고 있으며 극초단펄스 레이저와 나노초 UV레이저를 이용하여 FPCB의 기반재료인 FCCL(Flexible Copper Clad Laminate)를 절단하며 생산성 및 열영향을 비교하고 있다. 나노초 레이저는 피코초 레이저 경우에 비해 가공속도가 빨라 양산공정에 적합하며 피코초 레이저는 나노초 레이저에 비해 용융물이 적게 발생하여 다층/고집적화에 적합하나 출력이 낮은 단점이 있어 현단계에서의 양산가공으로의 적용이 어렵다는 결론이다. 그러나 여러 선도 업체에서 극초단 펄스레이저의 고출력화에 대한 시도가 이뤄지고 있으므로 생산성의 문제는 빠른 시일 내에 해결될 것으로 판단된다.

• Journal of Korean Society for Quality Management
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• v.25 no.1
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• pp.135-141
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• 1997

The Copper-Clad Laminate (CCL) is a main electronic component of specialtype printed circuit boards (PCBs) such as Silver Through Hole PCB. This CCL should have high reliability under the aging test, and usually the test is done at a higher temperature (110-$150^{\circ}C$) than the normal. Then, this test condition of high temperature may cause such quality problems as hole eccentricity and reduction of distance between part holes. After measuring the CCL shrinkage affected by temperature, the correction factor of a press mold was a, pp.ied to solve these problems. The results showed that the tolerance of hole pitch(${\pm}$$100{\mu}m$) was satisfactory and the internal and external failure costs were reduced by 55%.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.63-67
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• 2014

As the demand for fine-pitch FPCB (Flexible Printed Circuit Board) increases, so do the number of applications of sputtered FCCL (Flexible Copper Clad Laminate). Furthermore, as the width between the circuit patterns decreases, greater defects are observed in the migration phenomenon. In this study we observed changes in ion migration in real circuit-pattern width using sputtered FCCL. We found that as the applied voltage and residue thickness of the NiCr seeds increase, ion migration occurs faster. If the NiCr seed layer thickens due to a high cathode power and long deposition time while being sputtered, the NiCr will form a residue that quickly becomes a factor for incurring ion migration.

• Proceedings of the Optical Society of Korea Conference
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• 1989.02a
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• pp.152-156
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• 1989

Parameters of a microstrip patch antenna such as the resonant frequency, radiation conductance, and the bandwidth are calculated. The rectangular microstrip patch antenna fed by a microstrip transmission line is fabricated and its resonant frequency, radiation pattern, and input voltage standing wave ratio are measured. The measured resonant frequency for 13.0mm$\times$9.7mm copper clad woven PTFE/glass laminate plate is 9.06Ghz, where the calculative is 9.00Ghz. And the measured vswr shows that the bandwidth of the antenna is 225MHz for vswr less then 2.0 which the calculated quality factor of the patch gives the bandwidth OF 280ghZ. The measured radiation pattern for 5 element as well as 4 element patch array shows less then 4dB deviation in the first side lobes from the designed values for both E and H plane pattern. This diviation is believed to be the power division errors of the power divider.