• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.21-25
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• 2016

When copper alloy is used in etching process for the production of lead frame, the high concentration of heavy metals, such as iron, nickel and zinc may be included in the etching waste. Those etching waste is classified as a specified one. Therefore a customized design was designed for the purification process of the lead frame etching waste liquid containing high concentrations of heavy metals for the production of an electroplating copper(II) oxide. Since the lead frame etching waste solution contains highly concentrated heavy metal species, an ion exchange method is difficult to remove all heavy metals. In this study, a copper(I) chloride was manufactured by using water solubility difference related to the reduction-oxidation method followed by the reunion of copper(II) chloride using sodium sulfate as an oxidant. The hydrazine was chosen as a reducing agent. The optimum added amount was 1.4 mol per 1.0 mol of copper. In the case of removal of heavy metals by using the combination of reduction-oxidation and ion exchange resin methods, 4.3 ppm of $Fe^{3+}$, 2.4 ppm of $Ni^{2+}$ and 0.78 ppm of $Zn^{2+}$ can be reused as raw materials for electroplating copper(II) oxide when repeated three times.

• Korean Chemical Engineering Research
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• v.43 no.4
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• pp.495-502
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• 2005

Copper was plated on the tungsten substrate by use of a direct copper electroless plating. The optimum deposition conditions were found to be with a concentration of $CuSO_4$ 7.615 g/L, EDTA of 10.258 g/L, and glyoxylic acid of 7 g/L, respectively. The solution temperature was maintained at $60^{\circ}C$. The pH was varied from 11.0 to 12.8. After the deposition, the properties of the copper film were investigated with X-ray diffractometer (XRD), Field emission secondary electron microscope (FESEM), Atomic force microscope (AFM), X-ray photoelectron spectroscope (XPS), and Rutherford backscattering spectroscope (RBS). The best deposition condition was founded to be the solution pH of 11.8. In the case of 10 min deposition at the pH of 11.8, the grain shape was spherical, Cu phase was pure without impurity peak ($Cu_2O$ peak), and the surface root mean square roughness was about 11 nm. The thickness of the film turned out to be 140 nm after deposition for 12 min and the deposition rate was found to be about 12 nm/min. Increase in pH induced a formation of $Cu_2O$ phase with a long rectangular grain shape. The pH control seems to play an important role for the orientation of Cu in electroless deposition. The deposited copper concentration was 99 atomic percent according to RBS. The resulting Cu/W film yielded a good adhesive strength, because Cu/W alloy forms during electroless deposition.

• Journal of Electrochemical Science and Technology
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• v.11 no.2
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• pp.172-179
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• 2020

The impact of effective parameters on the electrodeposition rate optimization of Au-Cu alloy at high thicknesses on the silver substrate was investigated in the present study. After ensuring the formation of gold alloy deposits with the desired and standard percentage of gold with the cartage of 18K and other standard karats that should be observed in the manufacturing of the gold and jewelry artifacts, comparing the rate of gold-copper deposition by direct and pulsed current was done. The rate of deposition with pulse current was significantly higher than direct current. In this process, the duty cycle parameter was effectively optimized by the "one factor at a time" method to achieve maximum deposition rate. Particular parameters in this work were direct and pulse current densities, bath temperature, concentration of gold and cyanide ions in electrolyte, pH, agitation and wetting agent additive. Scanning electron microscopy (SEM) and surface chemical analysis system (EDS) were used to study the effect of deposition on the cross-sections of the formed layers. The results revealed that the Au-Cu alloy layer formed with concentrations of 6gr·L^-1 Au, 55gr·L^-1 Cu, 24 gr·L^-1 KCN and 1 ml·L^-1 Lauryl dimethyl amine oxide (LDAO) in the 0.6 mA·cm^-2 average current density and 30% duty cycle, had 0.841 ㎛·min^-1 Which was the highest deposition rate. The use of electrodeposition of pure and alloy gold thick layers as a production method can reduce the use of gold metal in the production of hallow gold artifacts, create sophisticated and unique models, and diversify production by maintaining standard karats, hardness, thickness and mechanical strength. This will not only make the process economical, it will also provide significant added value to the gold artifacts. By pulsating of currents and increasing the duty cycle means reducing the pulse off-time, and if the pulse off-time becomes too short, the electric double layer would not have sufficient growth time, and its thickness decreases. These results show the effect of pulsed current on increasing the electrodeposition rate of Au-Cu alloy confirming the previous studies on the effect of pulsed current on increasing the deposition rate of Au-Cu alloy.

• Korean Journal of Materials Research
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• v.10 no.2
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• pp.160-165
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• 2000

We have investigated the electrical and diffusion barrier properties of MgO produced on the surface of Cu (Mg) alloy. Also the diffusion barrier property of the interfacial MgO between Cu alloy and $SiO_2$ has been examined. The results show that the $150\;{\AA}$-MgO layer on the surface remains stable up to $700^{\circ}C$, preventing the interdiffusion of C Cu and Si in Si/MgO/Cu(Mg) structure. It also has the breakdown voltage of 4.5V and leakage current density of $10^{-7}A/\textrm{cm}^2/$. In addition, the combined structure of $Si_3N4(100{\AA})/MgO(100{\AA})$ increases the breakdown voltage up to lOV and reduces the leakage current density to $8{\tiems}10^{-7}A/\textrm{cm}^2$. Furthermore, the interfacial MgO formed by the chemical reac­t tion of Mg and $SiO_2$ reduces the diffusion of copper into $SiO_2$ substrate. Consequently, Cu(Mg) alloy can be applied as a g gate electrode in TFT /LCDs, reducing the process steps.

• Journal of Ocean Engineering and Technology
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• v.15 no.3
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• pp.49-57
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• 2001

One of the most important considerations to braze Cu-Al dissimilar materials is control of brittle metallic compound which makes it difficult to obtain a sound brazed joint. Nowdays, several attempts were made to control the metallic compound. But effective method for controlling metallic compound was not established. In this point of view, commercially pure aluminum and copper were used as base metal and Al-Si-X and Zn-Al-X alloy systems were developed as filler metal. Brazing was carried out to find optimum conditions for Cu-Al dissimilar joint. The results obtained in this study were summarized as follows: 1) The joint brazed by Al-Si-X filler metal showed good brazeability and mechanical properties. The tensile strength of the joint brazed over solidus temperature was more than 90% of Al base metal. Especially, the joint brazed at liquidus temperature was fractured in the Al base metal. 2) Fluorides fluxes(a mixture of potassium fluoro-aluminates) were used to improve surface cleanliness of base metal and wettability of Al-Si-X filler metal. It was melted at the temperature about 1$0^{\circ}C$ lower than that of the filler metal, and made appropriate brazing environment. Therefore, it could be a proper selection as flux.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.38-42
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• 2001

A complete quantitative understanding of DT has been difficult because the process represents such a broad field of research. The experimental measurement of tool force is a single area of DT which still covers a wide range of possibilities. There are numerous parameters of the process which affect cutting forces. There are also many turnable materials of current interest. To obtain information toward a better understanding of the process, a few cutting parameters and materials were selected for detail study. It was decided that free-oxygen copper and 6061-T6 alloy aluminum would be the primary test materials. There are materials which other workers have also used because of there wide use in reflective applications. The experimental phase of the research project began by designing tests to isolate certain cutting parameters. The parameters chosen to study were those that affected the cross-sectional area of the uncut chip. The specific parameters which cause this area to vary are the depth of cut and infeed per revolution, or feedrates. Other parameter such a tool nose radius and surface roughness were investigated as they became relevant to the research.

• Food Science and Biotechnology
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• v.18 no.4
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• pp.1022-1026
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• 2009

Cross contamination of foodborne virus via food utensils can be an important route of virus propagation. Bacteriophage MS2 was used as a surrogate for norovirus. The viability loss of bacteriophage MS2 attached to 4 kinds of metal surfaces was investigated at different temperatures and relative humidities (RH). The rate of viability loss was higher at $22^{\circ}C$ than at $10^{\circ}C$ and was higher at 75% RH than at 40% RH. The viability loss of the virus attached to copper or bronze surface was faster than on stainless steel or tin surface. Also the beef juice applied with the virus inoculum on the metal surfaces lowered the rate of viability loss. Although bronze was not as effective as copper in resulting the viability loss, it has been extensively used as a traditional Korean kitchen utensil and could be used more widely to decrease the viral poisoning at food processing environment and hospitals.

• Transactions of Materials Processing
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• v.27 no.4
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• pp.222-226
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• 2018

Severe plastic deformation (SPD) is a promising method for drastically enhancing the mechanical properties of the materials by grain refinement of metallic materials. However, inhomogeneous deformation during the SPD process results in the inhomogeneous microstructure of the SPD-processed material. We manufactured cylindrical copper specimens of 42 mm in diameter with ultrafine grains (UFG) using an equal channel angular pressing (ECAP) to figure out the relationship between homogeneous microstructure and the number of the processing passes. Two specimens, which are ECAP-processed 4 times (4pass) and 6 times (6pass) each with Route Bc, are prepared for comparison of mechanical properties and microstructure. The results show that the mechanical properties of the two specimens (4pass and 6pass) are similar. Moreover, both the specimens show highly enhanced mechanical properties. The 4pass specimen, however, shows inhomogeneity in hardness distribution, while the 6pass specimen shows a homogeneous distribution. Microstructure analysis reveals that the 4pass specimen has an inhomogeneous microstructure with incompletely refined grain structure. This inhomogeneity of the 4pass specimen could be explained by the circumferential rotation during ECAP process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.957-960
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• 1997

A complete quantitative understanding of DT has been difficult because the process represents such s broad field of research. The experimental measurement of tool force is a single area of DT which still covers a wide range of possibilities. Here are numerous parameters of the process which affect cutting forces. There are also many turnable materials of current interest. To obtain information toward a better understanding of the process, a few cutting parameters and materials were selected for detail study. It was decided that free-oxygen copper and 6061-T6 alloy aluminum would be the primary test materials. There are materials which other workers have also used because of there wide use in reflective applications. The experimental phase of the research project began by designing tests to isolate certain cutting parameters. The parameters chosen to study were those that affected the cross-sectional area of the uncut chip. The specific parameters which cause this area to vary are the depth of cut and infeed per revolution, or feedrates. Other parameter such a tool nose radius and surface roughness were investigated as they became relevant to the research.

• Journal of Welding and Joining
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• v.28 no.2
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• pp.47-53
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• 2010

According to the research report for the recent a few years, the dissimilar welding of Cu and STS 304 alloy have been presented that a weldability is very poor. This article present a study on Lap joint by Electron beam welding dissimilar materials. The weld metals was constituted between pure copper and STS 304 steel. The experiment was performed with 125mA welding current, 520mA focusing current. The Vacuum condition of chamber is 5${\times}$10-5torr and welding speed is 300mm/min. Showing the bead shape of weld metal, the thickness of the stainless 304 using as the protect materials is 3mm and the thickness of a copper is 15mm. The analysis about the microstructure were carried out in which it was observed with SEM. The results showed that complex heterogeneous fusion zone microstructure characterized both by rapid cooling and mixing of the molten metal, however the liquation crack was formated in the fusion line.