• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1319-1321
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• 2009

Copper phthalocyanine (CuPc) Field-effect transistors (FETs) was successfully fabricated on plastic substrates. Orientation of CuPc crystallites on substrate could be obtained via rubbing process. It was revealed that CuPc crystallites were perpendicularly aligned on PES substrates with the rubbing direction. The performance of FETs was affected by orientation of CuPc on rubbed substrates.

• Journal of Plant Biology
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• v.1 no.1
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• pp.1-6
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• 1958

1. Study was made to investigate effects of desoxyribonucleates on copper-resistance in yeast. 2. It is found that the resistant strain there exists the phenomic lag. 3. In the occurrence of the resistant strain there exists the phenomic lag. 4. Desoxyribonucleate isolated from copper resistant culture is capable of inducing the resistant strain, which is the same type as donor of the resistant type. It accelerated the rate of variation to the resistant, but it is of no effect on the resistant strain. 5. Desoxyribonucleate derived from non-resistant type inhibits growth of the resistant strain and delays the initial phase of growth. However, it is of no effect on the sensitive strain. It is concluded that desoxyribonucleate derived from resistant culture is capable of inducing the resistance, however, nonresistant type desoxyribonucleate is of no effect on inducing the resistance.

• Asian-Australasian Journal of Animal Sciences
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• v.27 no.8
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• pp.1082-1087
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• 2014

Thirty-two lambs were distributed in eight treatments under $2{\times}2{\times}2$ factorial experiment to compare the effects of two levels of selenium (0.2 to 5 mg/kg dry matter [DM]), sulphur (0.25% and 0.37%) and copper (8 and 25 mg/kg DM) levels on selenium concentration in liver and serum of lambs. A liver biopsy was done on all animals and blood samples were collected from the jugular vein prior to the beginning of the treatments. The blood was sampled every thirty days and the liver was sampled after 90 days, at the slaughter. Increasing differences were noticed during the data collection period for the serum selenium concentration, and it was found to be 0.667 mg/L in animals fed with 5 mg Se/kg DM and normal sulphur and copper concentrations in their diet. However, a three-way interaction and a reduction of selenium concentration to 0.483 mg/L was verified when increasing copper and sulphur concentration levels to 25 ppm and 0.37% respectively. The liver selenium concentration was also high for diets containing higher selenium concentrations, but the antagonist effect with the increased copper and sulphur levels remained, due to interactions between these minerals. Therefore, for regions where selenium is scarce, increasing its concentration in animal diets can be an interesting option. For regions with higher levels of selenium, the antagonistic effect of interaction between these three minerals should be used by increasing copper and sulphur dietary concentrations, thus preventing possible selenium poisoning.

• Journal of the East Asian Society of Dietary Life
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• v.12 no.2
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• pp.100-106
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• 2002

The purpose of this study was to investigate the effect of copper and selenium supplementation on lipid contents. Lipid levels in serum and liver were analyzed and compared in rats fed diet with 100, 200 and 400% of copper requirement and 100% and 1000% of selenium requirement for 6 weeks. Feed intake, body weight gain, and feed/weight were not significantly different among the groups. Serum cholesterol was the lowest in the copper-adequate group and sect LDL-cholesterol was significantly lower in the selenium-adequate group compared to the selenium-supplement group. Liver cholesterol was significantly elevated by the supplementation of copper and selenium. Summarizing these results, with the supplementation of copper and selenium, cholesterol levels in serum and liver increased in rats. Therefore, it could be suggested that adequate intake of minerals and well-balanced diet are more desirable than nutrient supplementation.

• Journal of the Korean Chemical Society
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• v.36 no.3
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• pp.412-418
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• 1992

The electrochemical behaviors and analytical application of copper-1,5,9,13-tetrathiacyclohexadecane[16-ane-$S_4$] complex in acetonitrile(AN) solution have been investigated by the use of DC polarography and differential pulse polarography. Thus the formation constant of copper complex was $10^{3.51}$. Copper (Ⅱ) ion was found to form complex of 1-to-1 composition with [16-ane-$S_4$]. In addition, reduction step was irreversible and the reduction current was diffusion controlled. And the effect of concentration of the salting-out reagent and chelating agent and pH of aqueous phase on the determination of copper (Ⅱ) was investigated and diverse ion effect was discussed. By salting-out extraction technique, we can be determined until the concentration of copper (Ⅱ) of 60 ppb.

• The Journal of Natural Sciences
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• v.10 no.1
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• pp.23-26
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• 1998

The efficacy of various concentration of divalent copper and zinc ions was evaluated separately for the infectivity of tobacco mosaic virus. Infectivity of TMV was more enhanced by addition of zinc, while it was decreased by addition of copper. The number of local lesions were more produced on tobacco leaves inoculated with inoculum sap containing zinc than those inoculated with sap only. The effect of copper inhibited the infectivity of TMV is dependent on copper concentration. TMV particles treated with various concentration of zinc and copper, respectively, analyzed by electrophoresis, and appeared to be altered in electrophoretic behavior. When TMV was exposed to zinc concentration at more than 200mM, the viral particles were completely degraded, and at 40-20 mM they were barely detectable, but at 2 mM they were quite stable. When TMV was exposed at less than concentration of 20 mM of copper were degraded.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.51-57
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• 2019

To protect the Cu surface from oxidation in air, a two-step plasma process using Ar and $N_2$ gases was studied to form a copper nitride passivation as an anti-oxidant layer. The Ar plasma removes contaminants on the Cu surface and it activates the surface to facilitate the reaction of copper and nitrogen atoms in the next $N_2$ plasma process. This study investigated the effect of Ar plasma on the formation of copper nitride passivation on Cu surface during the two-step plasma process through the full factorial design of experiment (DOE) method. According to XPS analysis, when using low RF power and pressure in the Ar plasma process, the peak area of copper oxides decreased while the peak area of copper nitrides increased. The main effect of copper nitride formation in Ar plasma process was RF power, and there was little interaction between plasma process parameters.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.3
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• pp.101-108
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• 2016

Each year, more than seven hundred thousand tons of copper slag are generated in Korea as a byproduct during the production of copper. Due to the large amount of copper slag produced, there has been increased interest in the use of copper slag as a construction material. To evaluate the potential of copper slag as a construction material, laboratory evaluations were conducted in this study, and three particle shapes and replacement rates of river sand were selected as experimental variables. Strength, air-void characteristics, and sulfuric acid resistance were the three properties evaluated to assess whether copper slag can be used as a construction material. Test results indicate that the gradation of copper slag has an effect on strength, and the maximum strength was achieved when 60 % of river sand was replaced with copper slag. In addition, when compared with ordinary Portland cement mortar, replacing river sand with copper slag reduced air void size and increased sulfuric acid resistance.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• Asian-Australasian Journal of Animal Sciences
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• v.23 no.5
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• pp.573-579
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• 2010

This study was conducted to determine the effects of different copper (inorganic and organic) and energy (tallow and glycerol) sources on growth performance, nutrient digestibility, gas emission, diarrhea incidence, and fecal copper concentration in growing pigs by using a 2${\times}$2 factorial design. In this trial, 96 pigs (63 d of age) were employed, with an average initial weight of 28.36${\pm}$1.14 kg. The dietary treatments were i) basal diet with 134 ppm copper (Korea recommendation) as $CuSO_4$+tallow; ii) basal diet with 134 ppm Cu as $CuSO_4$+glycerol; iii) basal diet with 134 ppm copper as CuMet+tallow; and iv) basal diet with 134 ppm copper as CuMet+ glycerol. Throughout the entire experimental period, no differences were noted among treatment groups with regard to the magnitude of improvement in ADG (average daily gain), ADFI (average daily feed intake) and G/F (gain:feed) ratios. The nitrogen (N) digestibility of pigs fed on diets containing organic copper was improved as compared with that observed in pigs fed on diets containing inorganic copper (p<0.05). An interaction of copper${\times}$energy was observed in the context of both nitrogen (p<0.05) and energy (p<0.01) digestibility. Ammonia emissions were significantly lower in the organic copper-added treatment groups than in the inorganic copperadded treatment groups (p<0.05). Mercaptan and hydrogen sulfide emissions were reduced via the addition of glycerol (p<0.05). No significant effects of copper or energy source, or their interaction, were observed in reference to diarrhea appearance and incidence throughout the entirety of the experimental period. The copper concentration in the feces was significantly lower in the organic copper source treatment group than was observed in the inorganic copper source treatment group (p<0.05). The results of this experiment show that organic copper substituted for inorganic copper in the diet results in a decreased fecal copper excretion, but exerts no effect on performance. The different energy (tallow and glycerol) sources interact with different copper sources and thus influence nutrient digestibility. Glycerol supplementation may reduce the concentrations of odorous sulfuric compounds with different Cu sources.