• 한국표면공학회지
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• 제5권1호
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• pp.1-7
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• 1972

Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${\pm}$5${\mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods and conditions were studied to produced good quality copper foils for printed circuit board applications. The electroplating bath solutions used were a copper-sulfate solution and a concentrated copper fluoborate solution. A surface roughening treatment that improved the adhesive strength of copper foils with an insulating laminate was also developed . A conventional copper sulfate solution containing sulfuric acid was used for the roughening treatment.

• 마이크로전자및패키징학회지
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• 제28권2호
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• pp.59-64
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• 2021

차세대 반도체 기술은 이종소자 집적화(heterogeneous integration)를 이용한 시스템-인-패키징(system-inpackage, SIP) 기술로 발전하고 있고, 저온 Cu 본딩은 SIP 구조의 성능 향상과 미세 피치 배선을 위해서 매우 중요한 기술이라 하겠다. 본 연구에서는 porous한 Ag 나노막을 이용하여 Cu 표면의 산화 방지 효과와 저온 Cu 본딩의 가능성을 조사하였다. 100℃에서 200℃의 저온 영역에서 Ag가 Cu로 확산되는 것보다 Cu가 Ag로 확산되는 것이 빠르게 관찰되었고, 이는 저온에서 Ag를 이용한 Cu간의 고상 확산 본딩이 가능함을 나타내었다. 따라서 Ag 나노막을 이용한 Cu 본딩을 200℃에서 진행하였고, 본딩 계면의 전단 강도는 23.27 MPa로 측정되었다.

• 한국산학기술학회논문지
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• 제7권3호
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• pp.506-511
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• 2006

은은 주조성과 가공성이 뛰어나 장신구 제작에 주된 소재로 채택되어 왔다. 이런 은 소재 자체의 장점을 이용한 전통적인 방법 중 하나인 모꾸메가네는 나뭇결무늬와 같은 자연스러운 금속의 혼합문양을 표현할 수 있어서 부가가치가 높지만 제작 공정이 복잡하고 힘들어서 경제적으로 장신구를 제작하는데 어려움이 있었다. 기존의 모꾸메가네 공정 대신 은과 구리의 융점차를 이용한 변형 주조 방법과 냉간압연으로 구리와 은 두 금속간의 우수한 결합을 유지하면서도 기존의 모꾸메가네와 유사한 표면 장식 효과를 얻을 수 있는 새로운 공정을 제안해 보았다. 직경 3 mm의 구리 그래뉼과 0.5 mm, 1.5 mm 두께의 구리 판재에 순은 용탕을 부어 두 금속간의 확산 접합이 완성된 괴를 만들고, 이후 롤러 압연을 실시하여 두께 1.5 mm의 판재를 만들어서 이를 이용하여 반지 시제품을 제작한 결과, 제안된 공정으로 이종 금속 접합도가 우수하면서 모꾸메가네와 유사한 효과를 성공적으로 낼 수 있었다. 제안된 공정은 기존의 반복된 열간 가공에 의한 복잡한 모꾸메가네 공정에 비해 보다 간단하고 경제적으로 모꾸메가네 효과를 갖는 은 장신구 디자인을 가능하게 함을 확인하였다.

• 한국재료학회지
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• 제24권11호
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• pp.585-590
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• 2014

Microstructural evolution in the thickness direction of an oxygen free copper processed by accumulative rollbonding (ARB) is investigated by electron back scatter diffraction (EBSD) measurement. For the ARB, two copper alloy sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked and roll-bonded by about 50% reduction rolling without lubrication at an ambient temperature. The bonded sheet is then cut to the two pieces of the same dimensions and the same procedure was repeated on the sheets up to eight cycles. The specimen after 1 cycle showed inhomogeneous microstructure in the thickness direction so that the grains near the surface were finer than those near the center. This inhomogeneity decreased with an increasing number of ARB cycles, and the grain sizes of the specimens after 3 cycles were almost identical. In addition, the aspect ratio of the grains decreased with an increasing number of ARB cycles due to the subdivision of the grains by shear deformation. The fraction of grains with high angle grain boundaries also increased with continuing process of the ARB so that it was higher than that of the low angle grain boundaries in specimens after 3 cycles. A discontinuous dynamic recrystallization occurred partially in specimens after 5 cycles.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1993년도 특별강연 및 추계학술발표 개요집
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• pp.45-50
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• 1993

• Bulletin of the Korean Chemical Society
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• 제14권3호
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• pp.344-347
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• 1993

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.225-228
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• 2003

This paper is concerned with pressure welding, which has been known as a main bonding mechanism for the cold and warm clad forming. Bonding characteristics of pressure welding between the copper and aluminum plates are experimentally investigated. Experiments are performed at the cold and warm temperature range with the variation of important factors such as magnitude of pressure, surface roughness of Cu and Al plates, and pressure holding time. It could be concluded that the bonding criterion might be given as a function of bonding pressure and surface roughness for the cold and warm temperature ranges.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.393-395
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• 2005

The bonding for Aluminum and Copper in the air is investigated in this study. This bonding method does not include the special process of removing aluminum oxide films. In case of this bending, each metal Is heated at bonding temperature where is above eutectic temperature of Al-Cu system and below melting point of Aluminum. The liquefaction around the bonding surface occurs after the diffusion at solid state of each metal. This phenomenon is predicted by the temperature range above eutectic temperature of Al-Cu equilibrium phase diagram.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.306-307
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• 2006

The sinter-bonding behavior of iron based powder mixtures was investigated. To produce the green compacts to be joined the following powders based on $H{\ddot{o}}gan{\ddot{a}}s$ AB grade NC 100.24 plain iron powder were used: NC 100.24 as delivered, PNC 30, PNC 60 and NC 100.24 + 4%Cu powder mixtures. Dimensional behaviour of all those materials during the sintering cycle was monitored by dilatometry. Simple ring shaped specimens as the outer parts and cylindrical as the inner parts were pressed. The influence of parts' composition on joining strength was established. Diffusion of alloying elements: copper and phosphorous, across the bonding surface was controlled by metallography, SEM and microanalysis.

• 한국정밀공학회지
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• 제18권6호
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• pp.166-173
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• 2001

Composite materials consists of two or more different material layers. The usefulness of clad metal rods forms the possibilities of combination of properties of different metals. Copper clad aluminum composite materials are being used for economic and structural purpose. In this study, composite billet consists of commercially pure copper and aluminum(A6061) and experimental conditions consist of the combinations of clad thickness, extrusion ratio, and semi-cone angle of die. In order to investigate the influence of these parameters on the hot direct extrudability of the copper clad aluminum composite material rods, the experimental study have been performed with various extrusion temperatures, extrusion ratios, semi-cone angles of die, and composition rate of Cu:Al.