• Journal of Powder Materials
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• v.19 no.6
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• pp.405-411
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• 2012

Recovery of copper powder from copper chloride solution used in $MoO_3$ leaching process was carried out using a cementation method. Cementation is a simple and economical process, necessitating less energy compared with other recovery methods. Cementation utilizes significant difference in standard reduction potential between copper and iron under standard condition. In the present research, Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated using bench-scale cementation reaction system. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRF, SEM-EDS and laser diffraction and scattering methods. Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99.65% purity and average $1{\mu}m$ in size.

• Membrane and Water Treatment
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• v.7 no.5
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• pp.403-416
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• 2016

The possibility of using carica papaya leaf powder for removal of copper from wastewater as a low cost adsorbent was explored. Different parameters that affect the adsorption process like initial concentration of metal ion, time of contact, adsorbent quantity and pH were evaluated and the outcome of the study was tested using adsorption isotherm models. A maximum of 90%-94.1% copper removal was possible from wastewater having low concentration of the metal using papaya leaf powder under optimum conditions by conducting experimental studies. The biosorption of copper ion was influenced by pH and outcome of experimental results indicate the optimum pH as 7.0 for maximum copper removal. Copper distribution between the solid and liquid phases in batch studies was described by isotherms like Langmuir adsorption and Freundlich models. The adsorption process was better represented by the Freundlich isotherm model. The maximum adsorption capacity of copper was measured to be 24.51 mg/g through the Langmuir model. Pseudo-second order rate equation was better suited for the adsorption process. A dynamic mode study was also conducted to analyse the ability of papaya leaf powder to remove copper (II) ions from aqueous solution and the breakthrough curve was described by an S profile. Present study revealed that papaya leaf powder can be used for the removal of copper from the wastewater and low cost water treatment techniques can be developed using this adsorbent.

• Journal of the Korea Furniture Society
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• v.19 no.5
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• pp.358-364
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• 2008

Wood-inorganic material composite (WIC) was prepared by impregnating wood with copper sulfate ($CuSO_4\;5H_2O$) solution and by immersed wood in sodium carbonate($Na_2CO_3$) solution in order to introduce insoluble copper compounds {copper carbonate hydroxide, $CuCO_3\;Cu(OH)_2$} into the wood to give fungicidal effects in treated-wood. The weight percent gains (WPGs) of treated wood reached maximum value by impregnation of 20% copper sulfate solution and immersion in about 15% sodium carbonate solution for 24 hrs. Inorganic substances were present mainly in the lumina and cross-field pitting of tracheides. These substances were proved to be the insoluble copper carbonate hydroxide against water by the energy dispersive X-ray analyzer in conjunction with a scanning electron microscope (SEM-EDXA). The treated specimens showed high preservative effectiveness because the weight losses were hardly occurred by the fungi degradation test.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• Journal of the Korean institute of surface engineering
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• v.47 no.1
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• pp.1-6
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• 2014

The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).

• Restorative Dentistry and Endodontics
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• v.14 no.1
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• pp.199-204
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• 1989

The purpose of this study was to observe the anodic polarization curve from 4 kinds of low copper amalgam (Fine cut alloy, Spheralloy, Aristalloy and Amalcap) and 4 kinds of high copper amalgam (Dispersalloy, Sybraloy Orosphere and Tytin) obtained by using the potentiostat. The specimen made as the direction of manufacturer was stored at room temperature for about 7 days. The standard surface preparation was routinely carried out. The 0.9% saline solution was used as electrolyte in pH 6.8-7.0 at $37^{\circ}C$. The open circuit potential was determined after 30 minutes' immersion of specimen. The scan rate was 1mV/sec and the surface area of amalgam exposed to the solution was 0.785$cm^2$ for each specimen. All potentials reported are with respect to Ag/AgCl eelctrode. The following results were obtained. 1. The corrosion potential of high copper amalgams was higher than one of low copper amalgams, and the current density of high copper amalgam was lower than one of low copper amalgams. 2. The low copper amalgams had the similar pattern of polarization curve, but the high copper amalgams had the different pattern one another. 3. The polarization curve of Orosphere amalgam which is the admixed type was similar to one of low copper amalgam.

• Resources Recycling
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• v.10 no.6
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• pp.15-21
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• 2001

Shape-controlled copper oxides have been recovered from copper-containing waste etchant by neutralization with alkalihydroxide. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. In recycling process of copper oxide from the waste etchant, reaction temperature controls shapes and sizes of the products. Copper oxide recovered below reaction temperature $40^{\circ}C$ was of a needle shape, while copper oxide comes in a platy shape above $40 ^{\circ}C$ . Physical properties of samples have been characterized using SEM, XRD, TGA and Atomic absorption spectroscopy.

• Corrosion Science and Technology
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• v.17 no.4
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• pp.147-153
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• 2018

Copper is used in various applications in environments favoring and enabling formation of biofilms by naturally occurring microbes. Copper is also the chosen corrosion barrier for nuclear waste in Finland. The copper canisters should have lifetimes of 100,000 years. Copper is commonly considered to be resistant to corrosion in oxygen-free water. This is an important argument for using copper as a corrosion protection in the planned canisters for spent nuclear-fuel encapsulation. However, microbial biofilm formation on metal surfaces can increase corrosion in various conditions and provide conditions where corrosion would not otherwise occur. Microbes can alter pH and redox potential, excrete corrosion-inducing metabolites, directly or indirectly reduce or oxidize the corrosion products, and form biofilms that create corrosive microenvironments. Microbial metabolites are known to initiate, facilitate, or accelerate general or localized corrosion, galvanic corrosion, and intergranular corrosion, as well as enable stress-corrosion cracking. Sulfate-reducing bacteria (SRB) are present in the repository environment. Sulfide is known to be a corrosive agent for copper. Here we show results from corrosion of copper in anoxic simulated ground water in the presence of SRB enriched from the planned disposal site.

• Journal of Powder Materials
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• v.9 no.4
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• pp.227-234
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• 2002

For the austenitic stainless steel (304L) manufactured by metal injection molding(MIM), the effects of copper content and sintering temperature on the mechanical properties, antibacterial activities, corrosion resistance, and electric resistances were investigated. The specimens were prepared by injection molding of the premixed powders of water-atomized 304 L and Cu with poly-acetyl binders. The green compacts were prepared with various copper contents from 0 to 10 wt.% Cu, which were debound thermally at 873 K for 7.2 ks in $N_2$gas atmosphere and subsequently sintered at various temperatures from 1323 K to 1623 K for 7.2 ks in Ar gas atmosphere. The relative density and tensile strength of the sintered compacts showed the minimum values at 5 and 8 wt.% Cu, respectively. Both the relative density and the tensile strength of the specimen with 10 wt.% Cu sintered at 1373 K showed the highest values, higher than those of copper-free specimen. Antibacterial activities investigated by the plastic film contact printing method for bacilli and the quantitative analysis of copper ion dissolved in water increased as the increase of the copper content to stainless steels. It was also verified by the measurement of pitting potential that the copper addition in 304 L could improve the corrosion resistance. Furthermore the electric conductivity increased with the increase of copper content.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.191-196
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• 2007

This paper presents the measuring technique for local heat transfer coefficients using a copper sensor in a rod bundle with mixing vanes. A copper sensor consists of a cartridge heater and four pieces of thermocouple. The Heater is located at the center of the copper sensor and thermocouples measure the surface temperature of the copper sensor. Unheated copper sensor and heated copper sensor are able to measure the local heat transfer coefficient at the position where the heated copper sensor is installed. However the entire region of a rod bundle is actually not heated, the decay of local heat transfer coefficients measured represents overestimated value rather than an actual value. The calibration curve for local heat transfer coefficients is presented using the correction factor calculated by CFD.