• 제목/요약/키워드: Copper(11) sulfate

검색결과 40건 처리시간 0.03초

Characteristics of Material Damage Caused by Acid Deposition in East Asia

  • Yoo, Young-Eok;Maeda, Yasuaki
    • 한국환경과학회지
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    • 제11권5호
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    • pp.445-454
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    • 2002
  • Material exposure experiments were performed to evaluate the relationship between air pollution and material corrosion rates based on collaboration with researchers in China, Japan, and Korea. Qualitative and quantitative atmospheric corrosion was estimated from damage caused to bronze, copper, steel, marble, cedar, cypress, and lacquer plates exposed to outdoor and indoor conditions in certain East Asian cities. The effects of atmospheric and meteorological factors on the damage to the copper plates and marble pieces were estimated using a regression analysis. The results indicated that sulfur dioxide produced the most destruction of the materials, especially in South Korea and China. In Japan, the copper plates were damaged as a result of natural conditions and sea salt. Copper was also found to be damaged by the surface deposition of sulfur and chlorine. Meanwhile, marble was substantially degraded by gaseous sulfur dioxide, yet sulfate ions in rain had no effect. Accordingly, the analysis of air pollution from the perspective of material damage was determined to be very useful in evaluating and substantiating the intensity of air pollution in East Asia.

미세 배선 성형을 위한 전주용 동도금액의 특성 (Characteristics of Copper Plating Solutions for Electroforming of Microcircuit)

  • 박해덕;장도연;강성군
    • 한국재료학회지
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    • 제11권10호
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    • pp.820-832
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    • 2001
  • In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.

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Effect of Surface Roughness, Thickness and Current Density on Surface Resistance of Electro-deposited Copper Layer

  • Kim, Y.M.;Cho, S.K.;Choi, Y.;Lee, J.Y.;Kim, M.
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2013년도 춘계학술대회 논문집
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    • pp.179-179
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    • 2013
  • Surface resistance of electro-deposited copper with its thickness, current density and surface roughness was determined by using a 4-point probe analyzer. The copper was prepared electrochemically on 316 stainless steel substrate in copper sulfate solution at the condition of $1A/dm^2$, 298 K, and 6.5 cm-electrode distance. The surface resistance of the copper sheet in the range of $0.93-0.97{\Omega}$ increased with the copper thickness in the range of $21-70{\mu}m$. The surface resistance in the range of $0.963-1.009{\Omega}$ also increased with current density in the range of $0.5-2A/dm^2$. The increased surface resistances corresponded to 11% for thickness and 25% for current density, respectively.

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In vitro Solubility of Copper(II) Sulfate and Dicopper Chloride Trihydroxide for Pigs

  • Park, C.S.;Kim, B.G.
    • Asian-Australasian Journal of Animal Sciences
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    • 제29권11호
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    • pp.1608-1615
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    • 2016
  • This study was conducted to determine the solubility of copper (Cu) in two sources of copper(II) sulfate ($CuSO_4$) including monohydrate and pentahydrate and three sources of dicopper chloride trihydroxide (dCCTH) including ${\alpha}$-form (dCCTH-${\alpha}$), ${\beta}$-form (dCCTH-${\beta}$), and a mixture of ${\alpha}$- and ${\beta}$-form (dCCTH-${\alpha}{\beta}$) at different pH and a 3-step in vitro digestion assay for pigs. In Exp. 1, Cu sources were incubated in water-based buffers at pH 2.0, 3.0, 4.8, and 6.8 for 4 h using a shaking incubator at $39^{\circ}C$. The $CuSO_4$ sources were completely dissolved within 15 min except at pH 6.8. The solubility of Cu in dCCTH-${\alpha}$ was greater (p<0.05) than dCCTH-${\beta}$ but was not different from dCCTH-${\alpha}{\beta}$ during 3-h incubation at pH 2.0 and during 2-h incubation at pH 3.0. At pH 4.8, there were no significant differences in solubility of Cu in dCCTH sources. Copper in dCCTH sources were non-soluble at pH 6.8. In Exp. 2, the solubility of Cu was determined during the 3-step in vitro digestion assay for pigs. All sources of Cu were completely dissolved in step 1 which simulated digestion in the stomach. In Exp. 3, the solubility of Cu in experimental diets including a control diet and diets containing 250 mg/kg of additional Cu from five Cu sources was determined during the in vitro digestion assay. The solubility of Cu in diets containing additional Cu sources were greater (p<0.05) than the control diet in step 1. In conclusion, the solubility of Cu was influenced by pH of digesta but was not different among sources based on the in vitro digestion assay.

황산구리 전해욕의 전착피막에 미치는 콜로이달실리카의 영향 (Effect of Colloidal Silica on Electredeposited Film from Copper sulfate Bath)

  • 이상백;김병일;윤정모;박정현
    • 한국재료학회지
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    • 제11권5호
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    • pp.413-418
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    • 2001
  • 황산구리 전해욕에 분산제인 콜리이달 실리카($SiO_2$현탁액)를 첨가시키는 분산도금의 방법을 이용하여 음극에 석출하는 전해 석출물의 결정구조, 표면형상, 결정방향 등의 변화를 검토하였고 내식성, 물리적 특성 또한 조사하였다. 콜로이달 실리카를 분산시킨 구리 전해욕의 석출피막의 특성에 대해서 조사한 결과, 다음과 같은 결론을 얻었다. 전해 석출피막의 결정입자가 미세화 되고, 균일하게 성장됨은 물론, 결정 수가 증가하였으며, 콜로이달 실리카의 분산 효과에 의해서 전해 석출피막의 경도가 대략 16%까지 상승하였다. 또한 콜로이달 실리카를 분산시킨 극리 전착층의 X-선 회절패턴이 (111)면, (200)면과 (311)면이 거의 소멸되어 우선 방위가 (111)에서 (110)면으로 변화되었다. 부식전위의 측면에서도 콜로이달 실리카의 흡착 효과에 의해서 구리 전착층의 전위가 귀하게 이동하는 효과를 얻을 수 있었다.

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농약이 오이흰가루병 방제용 중복기생균 Ampelomyces quisqualis 94013의 균사생장 및 포자발아에 미치는 영향 (Effect of agrochemicals on mycelial growth and spore germination of a hyperparasite, Ampelomyces quisqualis 94013 for controlling cucumber powdery mildew)

  • 이상엽;이상범;김용기;김홍기
    • 농약과학회지
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    • 제8권1호
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    • pp.71-78
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    • 2004
  • 흰가루병 방제를 위하여 다양한 작물에서 발생한 흰가루병균을 채집하여, 흰가루병균에 기생되어 있는 Ampelomyces quisqualis를 분리하여 오이흰가루병방제에 우수균주로 선발된 A. quisqualis 94013(AQ 94013)에 대하여 오이에 등록되어 있는 살균제와 살충제가 AQ94013의균사생장 및 포자발아율에 미치는 영향을 조사하였다. 그리고 AQ94013이 기생력을 증진시킬 수 있는 전착제를 선발하기 위하여 전착제와 혼용 시험을 수행하였다. AQ94013의 포자발아 및 균사생장정도는 공시한 34종의 살균제를 첨가한 배지에서 검정한 결과, 흰가루병 약 triadimefon, pyrazophos, 노균병약 dimethomorph, kasugamycin+copper oxychloride, dichlofluanid + copper oxychloride, copper hydroxide, tribasic copper sulfate, 이외에 잿빛곰팡이병약 iprodione, vinclozolin, procymidon 과 공시한 11종의 살충제중에서 immidacloprid, teflubenzuron, bifenthrin, ethofenprox, deltamethrin, phenthoate이 AQ94013의 포자발아와 균사생장에 영향을 적게 미쳤다. 오이흰가루병균에 대한 A. quisqualis 94013 의 기생력을 증진하는 전착제는 mineral oil로서 방제효과를 7.9%향상시켰다.

구리 전착층에 미치는 콜로이달실리카 및 음극 Pre-Coating의 영향 (Effect of Colloidal Silica and Pre-Coating of Cathode on Copper Electrodeposited Film)

  • 이상백;윤정모;박형호;배인성;김병일
    • 한국재료학회지
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    • 제11권7호
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    • pp.569-574
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    • 2001
  • 황산구리 전해욕에 분산제인 콜로이달 실리카($SiO_2$현탁액)를 첨가시키는 분산도금의 방법과 Au pre-coating을 이용하여 음극에 석출하는 전해 석출물의 결정구조, 표면형상, 결정방향 등의 변화를 검토하였다. 실리카 분산 및 Au pre-coating에 의하여 전해 석출피막의 결정입자가 미세화 되고, 균일하게 성장됨은 물론, 결정 수가 증가하였다. 콜로이달 실리카의 분산 효과에 의해서 전해 석출피막의 경도가 대략 15%까지 상승하였다. 또한 콜로이달 실리카를 분산시킨 구리 전착층의 X-선 회절패턴이 (111)면, (200)면과 (311)면이 거의 소멸되어 우선 방위가 (111)에서 (110)면으로 변화되었다.

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우리나라에서 분리된 참다래 꽃썩음병 병원세균(Pseudomonas syringae pv. syringae)의 플라스미드와 Cu 저항성 유전자 (Plasmid Profiles of Pseudomonas syringae pv. syringae Isolated from Kiwifruit Plants in Korea and the Copper Resistance Determinant)

  • 박소연;한효심;이영선;고영진;신종섭;정재성
    • 미생물학회지
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    • 제43권4호
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    • pp.337-340
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    • 2007
  • Pseudomonas syringae pv. syringae는 우리나라에서 참다래 꽃썩음병의 원인세균으로 알려져 있다. 본 연구에서는 우리나라의 서로 다른 참다래 과수원에서 분리되어 동정된 11개 균주의 꽃썩음병균이 가지고 있는 플라스미드 양상을 pulsed-field 젤 전기영동으로 조사하였다. 그 결과 전체 균주들은 가지고 있는 플라스미드의 개수와 크기에 따라 6개 그룹으로 나누어 졌다. 플라스미드의 수는 0에서 4개, 크기는 22 kb에서 160 kb로 다양하였다. 이들 중 두 개의 플라스미드를 가지고 있는 그를 III에 속하는 4균주가 Cu에 대한 저항성을 보였다. Southern blot hybridization 결과 Cu 저항성 유전자는 48 kb 크기의 플라스미드에 들어 있었다.

The study of strength behaviour of zeolite in cemented paste backfill

  • Eker, Hasan;Bascetin, Atac
    • Geomechanics and Engineering
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    • 제29권4호
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    • pp.421-434
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    • 2022
  • In the present study, reference samples were prepared using ore preparation facility tailings taken from the copper mine (Kure, Kastamonu), Portland cement (PC) in certain proportions (3 wt%, 5 wt%, 7 wt%, 9wt% and 11 wt%), and water. Then natural zeolite taken from the Bigadic Region was mixed in certain proportions (10 wt%, 20 wt%, 30 wt% and 40 wt%) for each cement ratio, instead of the PC, to prepare zeolite-substituted CPB samples. Thus, the effect of using Zeolite instead of PC on CPB's strength was investigated. The obtained CPB samples were kept in the curing cabinet at a temperature of 25℃ and at least 80% humidity, and they were subjected to the Uniaxial Compressive Strength (UCS) test at the end of the curing periods of 3, 7, 14, 28, 56, and 90 days. Except for the 3 wt% cement ratio, zeolite substitution was observed to increase the compressive strength in all mixtures. Also, the liquefaction risk limit for paste backfill was achieved for all mixtures, and the desired strength limit value (0.7 MPa) was achieved for all mixtures with 28 days of curing time and 7 wt%, 9 wt%, 11 wt% cement ratios and 5% cement - 10% zeolite substituted mixture. Moreover, the limit value (4 MPa) required for use as roof support was obtained only for mixtures with 11% cement - 10% and 20% zeolite content. Generally, zeolite substitution seems to be more effective in early strength (up to 28th day). It has been determined that the long-term strength losses of zeolite-substituted paste backfill mixtures were caused by the reaction of sulfate and hydration products to form secondary gypsum, ettringite, and iron sulfate.

Energy harvesting techniques for remote corrosion monitoring systems

  • Kim, Sehwan;Na, Ungjin
    • Smart Structures and Systems
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    • 제11권5호
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    • pp.555-567
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    • 2013
  • An Remote Corrosion Monitoring (RCM) system consists of an anode with low potential, the metallic structures against corrosion, an electrode to provide reference potential, and a data-acquisition system to ensure the potential difference for anticorrosion. In more detail, the data-acquisition (DAQ) system monitors the potential difference between the metallic structures and a reference electrode to identify the correct potential level against the corrosion of the infrastructures. Then, the measured data are transmitted to a central office to remotely keep track of the status of the corrosion monitoring (CM) system. To date, the RCM system is designed to achieve low power consumption, so that it can be simply powered by batteries. However, due to memory effect and the limited number of recharge cycles, it can entail the maintenance fee or sometimes cause failure to protect the metallic structures. To address this issue, the low-overhead energy harvesting circuitry for the RCM systems has designed to replenish energy storage elements (ESEs) along with redeeming the leakage of supercapacitors. Our developed energy harvester can scavenge the ambient energy from the corrosion monitoring environments and store it as useful electrical energy for powering local data-acquisition systems. In particular, this paper considers the energy harvesting from potential difference due to galvanic corrosion between a metallic infrastructure and a permanent copper/copper sulfate reference electrode. In addition, supercapacitors are adopted as an ESE to compensate for or overcome the limitations of batteries. Experimental results show that our proposed harvesting schemes significantly reduce the overhead of the charging circuitry, which enable fully charging up to a 350-F supercapacitor under the low corrosion power of 3 mW (i.e., 1 V/3 mA).