• Title/Summary/Keyword: Cooperation Process

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Protocol Design for Wavelength Routing in Optical Ring Access Networks (광링액세스네트워크에서의 파장 라우팅을 위한 프로토콜 설계)

  • Lee, Sang-Wha
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.4
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    • pp.2382-2392
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    • 2014
  • In this paper, a new data frame structure for wavelength routing in optical ring access network(ORAN) is designed and the functions of each field in the frame are defined. In addition, the IP packet transmission to the network layer corresponding to the newly proposed structure of the protocol stack is newly presented. Tha data transmission protocol design techniques of ORAN was proposed. IP packet and broadcasting packet transmission within the sub-network, and the IP packet transmission to other sub-network was shown through the process illustration. In the process, the encapsulation and framing process of the wavelength information to routing has been described in detail. And each step takes place in a packet transfer process is demonstrated. A ring type optical access network protocol is not yet research field. ORAN data transfer protocol to send/receive module structure of a subscriber node and a control node of the two rings which analyzed the results are shown. The high-speed Internet solution is proposed that by using wavelength routing the packet transport protocol for ORAN is designed.

ED COB Package Using Aluminum Anodization (알루미늄 양극산화를 사용한 LED COB 패키지)

  • Kim, Moonjung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.10
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    • pp.4757-4761
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    • 2012
  • LED chip on board(COB) package has been fabricated using aluminum substrate and aluminum anodization process. An alumina layer, used as a dielectric in COB substrate, is produced on aluminum substrate by selective anodization process. Also, selective anodization process makes it possible to construct a thermal via with a fully-filled via hole. Two types of the COB package are fabricated in order to analyze the effects of their substrate types on thermal resistivity and luminous efficiency. The aluminum substrate with the thermal via shows more improved measurement results compared with the alumina substrate. These results demonstrate that selective anodization process and thermal via can increase heat dissipation of COB package in this work. In addition, it is proved experimentally that these parameters also can be enhanced using efficient layout of multiple chip in the COB package.

A Study on the Plastic Forming by Rotary Swaging Process (Rotary Swaging 공법을 적용한 탄체 소성가공에 관한 연구)

  • Shon, Byoung-Chul;Lee, Ho-Jin
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.6
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    • pp.672-678
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    • 2020
  • Ogive parts of large-caliber ammunition in Korea are manufactured by the Press Nosing method, but this method has the disadvantage of requiring additional processes such as lubrication before and after the press process. This study proposes the possibility of applying the Swaging method to improve these shortcomings. A large-diameter shell body was manufactured in sub-scale and plastic working experiments using a swaging process were performed. We investigated whether plastic processing is possible up to 75 % of the diameter reduction rate that satisfies the final molding dimension, and whether the dimensions of the product produced by swaging molding are satisfactory as the hardness changes according to the diameter reduction rate and the increase in thickness. The test using the prototype confirmed that the hardness increased proportionally with the diameter reduction rate and by more than HV 335 at the reduction rate of 75 %. The material thickness variation tended to be similar to the theoretical calculated value, and the thickness increase rate was proportional to 65.4 % at the reduction rate of 75 %.

Die Shift Measurement of 300mm Large Diameter Wafer (300mm 대구경 웨이퍼의 다이 시프트 측정)

  • Lee, Jae-Hyang;Lee, Hye-Jin;Park, Sung-Jun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.17 no.6
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    • pp.708-714
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    • 2016
  • In today's semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.

The Mechanism of Coastal Landscape Formation Process in Japan (일본 해안경관 형성과정의 메커니즘 분석)

  • Lee, Seok-Hwan
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.10
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    • pp.3974-3981
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    • 2010
  • Coastal landscape is a collective setting of artificial or natural elements along the seaside. The approach method for the coastal landscape formation is different from that of urban landscape formation. This study analyzes the mechanism of coastal landscape formation process in Japan in the aspects of recognition phase, formation phase, and practice phase. The characteristics of coastal landscape formation process in Japan are construction of a survey system for integrating diverse landscape elements as a final coastal landscape, construction of a coherent evaluation system responding the local natural and spatial characters, and building a cooperative system responding the police of coastal landscape formation. This study suggest the implications both for the improvement of domestic local values and for the ways of the domestic coastal landscape formation.

A Study on Optimization of Vacuum Glazing Encapsulating Process using Frit inside a Vacuum Chamber (진공챔버 내 프리트 이용 진공유리 봉지공정 최적화에 관한 연구)

  • Park, Sang Jun;Lee, Young Lim
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.2
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    • pp.567-572
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    • 2013
  • In houses that use heating and cooling system, most of heat loss occurs through the windows, so that low-E glass, double-layered glass, and vacuum glazing are used to minimize the heat loss. In this paper, an encapsulating process that is a final process in manufacturing the vacuum glazing has been studied, and bonding in a vacuum chamber rather than atmospheric bonding was considered. For the efficiency of the encapsulating process, frit-melting temperature and bonding time were optimized with heater temperature, and the glass preheating temperature was optimized to prevent glass breakage due to thermal stress. Thus the vacuum glass was successfully manufactured based on these results and heat transmission coefficient measured was about $5.7W/m^2K$ which indicates that the internal pressure of the vacuum glazing is $10^{-2}$ torr.

Silver Alloying Process for Mokumegane-like Effect for Jewelry Design (장신구 디자인을 위한 모꾸메가네 효과 은 합금 공정)

  • Song Oh-Sung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.3
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    • pp.506-511
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    • 2006
  • Silver is one of the most appropriate Jewelry materials for Jewelry casting and bench working. The technique known as 'Mokumegane' is good for making silver jewelry with natural patterns, such as wood grain patterns, but the process is not easy for silversmithing because it requires complicated and heavy labour. Instead of using conventional Mokumegane technique, we propose a new modified silver-copper casting process that enables a similar surface effect with good metal bonding strength between silver and copper. Simply pouring the molten silver into pre-aligned copper granules or 0.5 mm to 1.5 mm-thick copper sheets leads to well embedded copper silver ingots. The rolled silver plates from those ingots show excellent bonding interface even after the silver plate rolled ten times. We successfully fabricated prototype rings with copper embedded silver plates. Our result implies that our newly proposed process nay be a simpler way to fabricate silver jewelry with a pseudo-Mokumegane effect.

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Business process model for vertical relationship -Focusing on the automotive industry- (수직관계 비즈니스 프로세스 모형에 관한 연구 -자동차산업 분야를 중심으로-)

  • Kim, Jin-Suk
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.8
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    • pp.3458-3465
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    • 2011
  • Business relationships can be divided into vertical and horizontal relationships. Relationship between horizontal competitors in the business of business to be done is generally vertical relationship between the main office Suppliers and Contractors says business done. In general, the number of models of business relationships through a lot of things are known. Model consisting of a vertical relationship, but there are not many highlights. In this paper, the vertical relationship problems based on the business model to develop. Vertical relationships include leading industrial electronics, automotive and many industrial tempted to target the automotive industry, but in this paper developed a model to look at. In Chapter 2 the theoretical background needed to develop a process model to examine the vertical relationship between Chapter 3 Features Find out about your business. Followed by Chapter 4 of this paper, the vertical relationship between the core business process model is developed. Finally, Chapter 5 of the study limitations and future research directions are suggested.

Design of Naphtha Splitter Unit with Petlyuk Distillation Column Using Aspen HYSYS Simulation (Aspen HYSYS를 이용한 나프타 분리공정의 Petlyuk Distillation Column 설계)

  • Lee, Ju-Yeong
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.2
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    • pp.21-27
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    • 2018
  • FRN (Full range Naphtha) is distilled from crude oil in a Naphtha Splitter Unit and is separated into the Light Straight Naphtha, Heavy Naphtha, and kerosene according to the boiling point in sequence. This separation is conducted using a series of binary-like columns. In this separation method, the energy consumed in the reboiler is used to separate the heaviest components and most of this energy is discarded as vapor condensation in the overhead cooler. In this study, the first two columns of the separation process are replaced with the Petlyuk column. A structural design was exercised by a stage to stage computation with an ideal tray efficiency in the equilibrium condition. Compared to the performance of a conventional system of 3-column model, the design outcome indicates that the procedure is simple and efficient because the composition of the liquid component in the column tray was designed to be similar to the equilibrium distillation curve. An analysis of the performance of the new process indicated an energy saving of 12.3% under same total number of trays and with a saving of the initial investment cost.

The Successful Process of Technology Commercialization Training Program : Focus on the Absorptive Capacity (기술사업화 교육프로그램의 성공적인 프로세스 개발 연구 - 흡수역량을 중심으로-)

  • Kim, Myung-Seuk;Choi, Jong-In
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.6
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    • pp.2506-2514
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    • 2011
  • The research object is stepwise process of absorptive capacity is important factor to get the successful result of technology commercialization training program. We analyze the relationship between absorptive capacity and educational performance with empirical study to the students who attended the technology commercialization training program. Results show that potential absorptive capacity has positive effect on realized absorptive capacity. Realized absorptive capacity also has the positive effect on educational performance. We conclude the successful technology commercialization training program is based on the stepwise process of absorptive capacity. That means technology commercialization training program will set up based on not functional but stepwise process. Further more, technology commercialization training program must be practical, focusing, interdisciplinary, and repetitive courses.