• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1189-1194
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• 2004

In this paper, the effect of tip clearance on the cooling performance of the microchannel heat sink is presented under the fixed pumping power condition. For the various types of microchannel heat sink having different size of fin width and channel width, experimental study is conducted. Through the experiment, the tip clearance effect is investigated by increasing tip clearance from zero. As a result, it is shown that cooling performance of heat sink with tip clearance is better than that of heat sink without tip clearance. For the microchannel heat sink with tip clearance, the optimum conditions for cooling performance is also studied.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.4
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• pp.245-253
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• 2016

The friction and deformation of a tire causes heat generation, which causes a temperature rise of the tire. This temperature rise can be a source of tire damage. The object of this study is to investigate the cooling effect of the application of a fin to the tire side to suppress the temperature rise. Eight different fin shapes were considered, and the sidewall surface temperature reduction owing to the cooling fin shape was numerically analyzed. In addition, the flow characteristics and heat transfer characteristics of the vortex of the pin rear were compared.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.6
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• pp.1337-1342
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• 2007

An experimental study has been performed to investigate the performance and heat transfer characteristics of the heat exchanger for simultaneous cooling/heating heat pump. The heat transfer performance was measured using an air-enthalpy calorimeter and a constant temperature water bath, to obtain the performance evaluation and analysis of a fined tube heat exchanger. Six finned tube heat exchangers with louver fin were tested under a heating condition. Air-side heat transfer and friction were presented in terms of j-factor and f-factor. The heat transfer coefficient increased with decreasing the fin pitch, j-factor and f-factor on the fin pitch and the number of tube rows decreased with increasing Reair.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.10 no.6
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• pp.743-752
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• 1998

Experiments were performed to characterize single-phase heat transfer behavior of submerged liquid jet with multiple nozzle normally impinging on the smooth and extended surfaces. Arrays of 9 and 36 nozzles were used, with diameters of 0.5 to 2.0mm providing nozzle area ratio (AR) from 0.05 to 0.2. The square pin fin arrays were chosen as extended surfaces and the effects of geometrical parameters such as fin height, the ratio of fin width to channel width on heat transfer enhancement were examined. Single nozzle characteristics were also evaluated for comparison. The results clearly showed that heat transfer enhancement could be realized by using multiple nozzles at the constant volume flow rate. The average Nusselt number of multiple nozzle impingement on the smooth surface was correlated by the following equation : Nu/$Pr\frac{1}{3}=0.94 Re^{0.56}N^{-0.12}AR^{0.50}$The average heat transfer coefficients of multiple nozzle impingement on the extended surfaces decreased with increasing fin height and the ratio of fin width to channel width. The effectiveness of ex-tended surfaces ranged from 1.5 to 3.5 depending on the fin height, the ratio of fin width to channel width of pin fin arrays, nozzle number and nozzle area ratio.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.125-133
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• 1998

Nine tubes with trapezoidal integral-fins having fin densities from 748 to 1654fpm and 10,30 grooves and finned tubes with caves of 0.55 and 0.64mm height respectively are tested. A plain tube having same diameter as the finned tubes is also tested for comparison. In case of condensation CFC-11 condensates at saturation state of 32$^{\circ}C$ on the outside surface cooled by inside cooling water flows. And in case of boiling the refrigerant evaporates at a saturation state of 1bar on the outside tube surface and heat is supplied by hot water which circulates inside of the tube. The tube having fin density of 1299fpm and 30grooves has the best condensation overall heat transfer coefficient. However, as far as boiling heat transfer coefficient concerns, fin tubes with cave show higher value than low fin tube having fin density of 1299fpm and 30 grooves.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.5
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• pp.418-425
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• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.7
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.1920-1925
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• 2007

A transformer is a device that changes the current and voltage by electricity induced between coil and core steel, and it is composed of metals and insulating materials. In the core of the transformer, the thermal load is generated by electric loss and the high temperature can make the break of insulating. So we must cool down the temperature of transformer by external radiators. According to cooling fan's usage, there are two cooling types, OA(Oil Natural Air Natural) and FA(Oil Natural Air Forced). For this study, we used Fluent 6.2 and analyzed the cooling characteristic of radiator. we calculated 1-fin of detail modeling that is similar to honeycomb structure and multi-fin(18-fin) calculation for OA and FA types. For the sensitivity study, we have different positions(side, under) of cooling fans for forced convection of FA type. The calculation results were compared with the measurement data which obtained from 135.45/69kV ultra transformer flowrate and temperature test. The aim of the study is to assess the Fluent code prediction on the radiator calculation and to use the data for optimizing transformer radiator design.