• 한국정밀공학회지
• /
• 제24권12호
• /
• pp.95-103
• /
• 2007

This paper presents a liquid cooling concept for heat rejection of high power electronic devices existing in notebook computers etc. The design, fabrication, and performance of the planar ECF pump and farced-liquid cooling system are summarized. The electro-conjugate fluid (ECF) is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The planar ECF pump, consists of a pump housing and electrode substrate, achieves maximum flow rate and output pressure of $5.5\;cm^3/s$ and 7.2 kPa, respectively, at an applied voltage of 2.0 kV. The farced-liquid cooling system, constructed with the planar ECF pump, liquid-cooled heat sink and thermal test chip, removes input power up to 80 W keeping the chip surface temperature below $70\;^{\circ}C$. The experimental results demonstrate that the feasibility of forced-liquid cooling system using ECF is confirmed as an advanced cooling solution on the next-generation high power electronic devices.

• 동력기계공학회지
• /
• 제18권1호
• /
• pp.14-21
• /
• 2014

Piezoelectric fans are thin elastic beams whose vibratory motion is actuated by means of a piezoelectric material bonded to the beam. These fans have found use as a means to enhance convective heat transfer while requiring only small amounts of power. This study presents new types of models with heat sink having air passage and investigates experimentally their heat transfer characteristics. From the comparison results for four models, the heat transfer coefficients of model 1 are approximately 44~66% higher than those of the reference model 0. The model 1 show the best overall performance about heat transfer and cooling capability. As shown in above results, it is necessary to design the heat sink with air pass for cooling of electronic devices, in order to increase the convective heat transfer coefficient of a piezoelectric fan for electronic cooling.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2003년도 추계학술대회
• /
• pp.31-36
• /
• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.

• 설비공학논문집
• /
• 제22권9호
• /
• pp.614-619
• /
• 2010

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of a slimness of the devices, so it is not easy to find the optimal thermal management solution for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint of the applications. In the present study, the silicon flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. The normal isothermal characteristics created by vapor-liquid phase change was confirmed through the experimental study. The cooling device with 70 mm of total length showed 6.8 W of the heat transfer rate within the range of $4{\sim}5^{\circ}C/W$ of thermal resistance. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of the silicon and glass cooling device.

• 대한설비공학회:학술대회논문집
• /
• 대한설비공학회 2005년도 동계학술발표대회 논문집
• /
• pp.329-334
• /
• 2005

As more high power wide band gap devices are being utilized. the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2007년도 춘계학술대회B
• /
• pp.2426-2431
• /
• 2007

The microchannel waterblock has a good capability in the cooling of electronic devices. The object of this paper is to estiblish the scheme of design for the microchannel waterblock. The effects of flow rate and channel size on the cooling performances are investigated. It was found that the optimum flow rates were ragned from 0.7 lpm to 1.4 lpm. The thermal resistance at 2.0 lpm and 100 W was 0.13 $^{\circ}C$/W. Decrease in the width of channels is more effective for the improvement in the cooling performances of microchannel waterblock than increase in the height of channels. The increase of pressure drop resulted from decrease in the width of channels can be decreased by increasing the hight of channels.

• 한국산학기술학회논문지
• /
• 제15권4호
• /
• pp.1850-1858
• /
• 2014

본 연구의 목적은 전기자동차용 고발열 전자장비를 최적으로 냉각 제어하는 알고리즘을 개발하는 것이다. 이를 위하여 준중형급 전기자동차의 전자장비 냉각시스템의 계절 부하별 냉각수온도 변화를 실험적으로 고찰하여 시험용 전기자동차 냉각 제어 로직의 타당성 분석을 수행하였다. 결과적으로 기존 전기자동차의 전자장비 냉각시스템은 필요 냉각부하인 기준온도와 비교하여 과도하게 구동되고 있음을 확인하였다. 또한, 전기자동차의 연비 향상을 위하여 외기온도, 차량속도, 냉매온도 등을 고려한 최적 냉각 제어 알고리즘이 필요하다.

• E2M - 전기 전자와 첨단 소재
• /
• 제9권1호
• /
• pp.67-75
• /
• 1996

This paper has presented the characteristics of thermoelectric devices and the plots of thermoelectric cooling and heating as a function of currents for different temperatures. The maximum cooling and heating(.DELTA.T) for (BiSb)$\_$2/Te$\_$3/ and Bi$\_$2/(TeSe)$\_$3/ as a function of currents is about 75.deg. C, A solderable ceramic insulated thermoelectric module. Each module contains 31 thermoelectric devices. Thermoelectric material is a quaternary alloy of bismuth, tellurium, selenium, and antimony with small amounts of suitable dopants, carefully processed to produce an oriented polycrystalline ingot with superior anisotropic thermoelectric properties. Metallized ceramic plates afford maximum electrical insulation and thermal conduction. Operating temperature range is from -156.deg. C to +104.deg. C. The amount of Peltier cooling is directly proportional to the current through the sample, and the temperature gradient at the thermoelectric materials junctions will depend on the system geometry.

• 설비공학논문집
• /
• 제15권8호
• /
• pp.667-673
• /
• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• 전기학회논문지P
• /
• 제58권3호
• /
• pp.235-240
• /
• 2009

In automobile, the introduction of electronically commutated motors has been accompanied by a proliferation of electronic devices. With this proliferation of electronic devices, an emphasis has been placed on EMC issues. This paper is proposed to use SRM as a radiator cooling fan in automotive applications. To drive SRM, Energy efficient C-dump converter is applied. Energy efficient C-dump converter, derived from the conventional C-dump converter, is proposed as a switched reluctance motor (SRM) drive for automotive engine cooling application. It is verified more efficient than other converters through simulation and experiments. And also SRM is valid for automotive applications that have strict EMC standards. Simulation and experimental results obtained on a laboratory prototype are finally presented to evaluate the performance.