전자기기 냉각용 마이크로채널 워터블록의 냉각성능에 관한 수치해석

A Numerical Analysis on Cooling Performance of Microchannel Waterblock for Electronic Devices Cooling

The microchannel waterblock has a good capability in the cooling of electronic devices. The object of this paper is to estiblish the scheme of design for the microchannel waterblock. The effects of flow rate and channel size on the cooling performances are investigated. It was found that the optimum flow rates were ragned from 0.7 lpm to 1.4 lpm. The thermal resistance at 2.0 lpm and 100 W was 0.13 $^{\circ}C$/W. Decrease in the width of channels is more effective for the improvement in the cooling performances of microchannel waterblock than increase in the height of channels. The increase of pressure drop resulted from decrease in the width of channels can be decreased by increasing the hight of channels.