• Proceedings of the Korea Contents Association Conference
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• 2014.06a
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• pp.165-166
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• 2014

• Proceedings of the Korea Contents Association Conference
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• 2014.06a
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• pp.169-170
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• 2014

• East Asian Economic Review
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• v.20 no.1
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• pp.37-65
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• 2016

This research intends to investigate the progress made in East Asian bond market integration thus far. Price-based measures (AAD indicator and beta-convergence measure), quantity-based measures and econometric techniques (co-integration test, error correction model based Granger causality test) are employed in the analysis. Even though East Asian government bond markets have become more integrated since 2001, the differentials among the markets still remain significantly high. The bond market integration process seems slow. The convergence of bond markets sped up in 2003 and after the 2008 world financial crisis, implying the important role of government policies in integrating the regional bond markets. East Asian bond market integration may need more government-directed measures.

• Knowledge Management Research
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• v.15 no.4
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• pp.105-126
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• 2014

Knowledge integration is becoming a primary function of improving organizational capabilities and performance in today's convergence paradigm. The knowledge integration capability of employees has increasingly been regarded as a critical source for developing new products and services. This study investigates the influential factors of employees' knowledge integration capability and its effects. A theoretical research model was developed based on the socio-technical perspective and information processing theory. The model includes teamwork quality, expertise, IT support, and knowledge complexity as the primary influential factors of employees' knowledge integration capability. A large-scale survey was conducted for gathering data (a total of 316 samples from 141 organizations) to test the proposed model. The test results of the hypotheses show that expertise and knowledge complexity are the significant influential factors of employees' knowledge integration capability, and also the capability has a positive effect on the knowledge creation performance of employees. Our findings contribute to the development of initiatives for promoting employees' knowledge integration capability, especially in knowledge intensive organizations focusing on convergence products and services.

• Proceedings of the Korean Information Science Society Conference
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• 2012.06b
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• pp.16-17
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• 2012

국토해양부는 지방국토관리청의 도로공사와 관련하여 발생하는 공사비 정보의 교환 및 공유를 목적으로 작업분류체계 기반의 공사비 관리 항목을 추가하여 전자설계도서 작성 납품 지침을 개정하였다. 이를 반영하고 문제점 개선 및 활성화를 위하여 5개 지방국토관리청에서 관리중인 10개 도로건설공사를 시범적용 사업으로 지정하여 발생하는 공사비 정보를 디지털 수량산출정보로 관리하고 있다. 시범사업을 진행하면서 건설공사에 발생하는 설계변경 업무를 전자화하여 관리하는 기능을 개발하고 추가 적용하였다. 이를 통해 건설사에서 생성한 설계변경 정보를 건설사와 발주처가 동일한 형태로 공사비 정보를 공유 및 관리 가능하도록 하였다.

• Proceedings of the Korean Society of Computer Information Conference
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• 2014.07a
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• pp.415-416
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• 2014

본 연구에서는 ICT 기술특성을 건설 전 생애주기에 걸쳐 활용하여 미래 건설 환경 변화에 신속하게 대응하고, 시간과 장소에 구애 받지 않고 실시간 현장 업무를 지원할 수 있도록 건설사업정보시스템(CALS)의 하위 업무시스템인 건설사업관리시스템, 시설물유지관리시스템, 건설인허가시스템, 용지보상시스템에 모바일 기술을 적용하는 스마트화 방안을 제시하였다.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.6_2
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• pp.1145-1153
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• 2023

This study presents the development of pointcloud data integration technology in construction sites via drone photogrammetry and MMS LiDAR. The integration of pointcloud data from drones and MMS technology can provide precise and accurate 3D digital maps of construction sites, which can benefit the development of smart construction and BIM. The advantages of using both drones and MMS technology for pointcloud data acquisition in construction sites are discussed, along with the limitations and challenges of using drone photogrammetry and MMS LiDAR for pointcloud data integration. The results of this study can contribute to the advancement of pointcloud data integration technology in construction sites and improve the efficiency and accuracy of construction projects.

• ETRI Journal
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• v.29 no.6
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• pp.811-813
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• 2007

We report on a ridge waveguide laser diode with laterally tapered waveguides fabricated in a single growing step using a double patterning method. In this structure, nearly constant output power is obtained with the change of the lower tapered waveguide width, and the facet power ratio of 1.4 to 1.5 is observed over the current range. The asymmetric facet power property is also investigated.

• Asia-Pacific Journal of Business
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• v.10 no.1
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• pp.1-11
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• 2019

Asian countries have been striving for economic integration for decades. This effort may lead to the convergence of income level through externalities across countries. This paper investigates whether the convergence phenomenon holds for income levels in Asian countries for the periods between 1975-2015 applying the traditional methodology of ${\sigma}-$ and ${\beta}-convergence$. Although the absolute ${\beta}-convergence$ of income levels in Asian and ASEAN+3 countries do hold, ${\sigma}-convergence$ and conditional ${\beta}-convergence$ of income level generally do not exist. This suggests that the benefits of economic integration in Asian countries were not yet realized to be significant. A plausible explanation is that the economies of Asian countries are largely based on low trade openness and a high level of informal economy.