• 제목/요약/키워드: Continuous chip

검색결과 138건 처리시간 0.024초

알루미늄 합금(Al 7075) 절삭성 향상을 위한 열간단조 후처리 방법에 관한 연구 (A Study on the Improvement of Machinability in Hot-Forged Aluminum Alloy Product(Al 7075))

  • 김진복;임학진;강범수
    • 한국추진공학회지
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    • 제4권2호
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    • pp.46-53
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    • 2000
  • 알루미늄 제품은 열간단조하면 재료가 연화되어 있어 절삭가공시 연속적인 칩이 발생하여 공구와 피삭재를 감고 회전함으로서 가공면 손상, 공구파손 및 작업자의 안전을 초래함에 따라 가공이 어려워 단지 절삭성 개선목적만을 위해 중간공정으로 T-4열처리하여 절삭가공하고 다시 어닐링처리하여 냉간성형을 하고 최종열처 리를 한다. 따라서 본 연구는 열간단조후 제품을 급냉시키면 용체화처리의 효과를 얻어 재료가 경화됨으로서 절삭성이 개선될 수 있다는 이론에 근거하여 T4열처리를 대체할 수 있는 후처리방법에 대해 연구하였다. 최적의 후처리방법을 구하기 위해 열간단조후 수냉과 공냉처리를 비교분석하였고, 열간단조후 냉각처리까지 지연된 시간과 수냉과정에서의 유지시간에 따른 분식을 통해 최적의 작업조건을 설정하였다.

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슬라이딩 모드 제어를 이용한 마으크로 드릴의 절삭력 제어 (Cutting force regulation of microdrilling using the sliding mode control)

  • 정만실;조동우
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 춘계학술대회 논문집
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    • pp.842-846
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    • 1997
  • Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratios larger than 10) is gaining increased attention in a wide spectrum of precision production industries. Alternative methods such as EDM, laser drilling, etc. can sometimes replace mechanical micro-hole drilling but are not acceptable in PCB manufacture because they yield inferior hole quality and accuracy. The major difficulties in micro-hold drilling are related to wandering motions during the inlet stage, high aspect ratios, high temperature,etc. However, of all the difficulties, the most undesirable one is the increase of drilling force as the drill penetrates deeper into hold. This is caused mainly by chip related effects. Peck-drilling is thus widely used for deep hole drilling despite the fact that it leads to low productivity. Therefore, in this paper, a method of cutting force regulation is proposed to achieve continuous drilling. A proportional plus derivative (PD) and a sliding modecontrol algorithm will be implemented for controlling the spinle rotational frequeency. Experimental results will show that sliding mode control reduces the nominal cutting force and its variation better than the PD control, resulting in a number of advantages such as an increase in drill life, fast stabilization of the wandering motion, and precise positioning of the hole.

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A Study on Realization of Visible Light Communication System for Power Line Communication Using 8-bit Microcontroller

  • Yun, Ji-Hun;Hong, Geun-Bin;Kim, Yong-Kab
    • Transactions on Electrical and Electronic Materials
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    • 제11권5호
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    • pp.238-241
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    • 2010
  • The purpose of this study is to solve the problems of radio frequency bandwidth frequency depletion, confusion possibilities, and security that are in current wireless communications systems, and to confirm the possibility of applying those solutions for the next generation network. To solve the problems of the current wireless communications system, a visible light communications system for power line communication (PLC) via 8-bit microcontroller is created and the capacity is analyzed. The exclusive PLC chip APLC-485MA, an 8-bit ATmega16 microcontroller, high brightness 5pi light emitting diodes (LEDs), and the LLS08-A1 visible light-receiving sensor were used for the transmitter and receiver. The performance was analyzed using a designed program and an oscilloscope. The voltage change was measured as a function of distance from 10-50 cm. Blue LEDs showed the best performance among the measured LED types, with 0.47 V of voltage loss, but for a distance over 50 cm, precise data was not easy to obtain due to the weak light. To overcome these types of problems, specific values such as the changing conditions and efficiency value relevant to the light emitting parts and the visible light-receiving sensor should be calculated, and continuous study and improvements should also be realized for better communication conditions.

A Study on Critical Depth of Cuts in Micro Grooving

  • Son, Seong-Min;Lim, Han-Seok;Paik, In-Hwan;Ahn, Jung-Hwan
    • Journal of Mechanical Science and Technology
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    • 제17권2호
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    • pp.239-245
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    • 2003
  • Ultra precision diamond cutting is a very efficient manufacturing method for optical parts such as HOE, Fresnel lenses, diffraction lenses, and others. During micro cutting, the rake angle is likely to become negative because the tool edge radius is considerably large compared to the sub-micrometer-order depth of cut. Depending on the ratio of the tool edge radius to the depth of cut, different micro-cutting mechanism modes appear. Therefore, the tool edge sharpness is the most important factor which affects the qualities of machined parts. That is why diamond, especially monocrystal diamond which has the sharpest edge among all other materials, is widely used in micro-cutting. The majar issue is regarding the minimum (critical) depth of cut needed to obtain continuous chips during the cutting process. In this paper, the micro machinability near the critical depth of cut is investigated in micro grooving with a diamond tool. The experimental results show the characteristics of micro-cutting in terms of cutting force ratio (Fx/Fy), chip shape, surface roughness, and surface hardening nea. the critical depth of cut.

초정밀 절삭에서의 가공깊이 최소화에 관한연구 (A Study on the minimizing of cutting depth in sub-micro machining)

  • 손성민;허성우;안중환
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2003년도 춘계학술대회 논문집
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    • pp.376-381
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    • 2003
  • Ultra precision diamond cutting is a very efficient manufacturing method for optical parts such as HOE, Fresnel lenses, diffraction lenses, and others. During micro cutting, the rake angle is likely to become negative because the tool edge radius is considerably large compared to the sub-micrometer-order depth of cut. Depending on the ratio of the tool edge radius to the depth of cut, different micro-cutting mechanism modes appear. Therefore, the tool edge sharpness is the most important factor affecting the qualities of machined parts. That is why diamond especially mono-crystal diamond, which has the sharpest edge among all other materials is widely used in micro-cutting. The question arises, given a diamond tool, what is the minimum (critical) depth of cut to get continuous chips while in the cutting process\ulcorner In this paper, the micro machinability around the critical depth of cut is investigated in micro grooving with a diamond tool, and introduce the minimizing method of cutting depth using vibration cutting. The experimental results show the characteristics of micro cutting in terms of cutting force ratio (Fx/Fy), chip shape, surface roughness, and surface hardeing around the critical depth of cut.

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미세구멍 가공의 생산성 향상을 위한 상태식별 및 제어 (Diagnosis and Control of Machining States in Micro-Drilling for Productivity Enhancement)

  • 정만실;조동우
    • 한국정밀공학회지
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    • 제15권1호
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    • pp.117-129
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    • 1998
  • Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratio larger than 10) is recently having more attention in a wide spectrum of precision production industries. Alternative methods such as EDM. laser drilling, etc. can sometimes replace the mechanical micro-hole drilling but are not acceptable in PCB manufacture because of the inferior hole quality and accuracy. The major difficulties in micro-hole drilling are related to small signal to noise ratios, wandering motions of the inlet stage, high aspect ratios, high temperatures and so forth. Of all the difficulties. the most undesirable one is the increase of drilling force as the drill proceeds deeper into the hole. This is caused mainly from the chip effects. Peck-drilling is thus widely used for deep hole drilling despite that it suffers from low productivity. In the paper, a method of cutting force regulation is proposed to achieve continuous drilling. A PD and a sliding mode control algorithms were implemented through controlling the spindle rotating frequency. Experimental results show that the sliding mode control reduces the nominal cutting force and the variation of the cutting force better than the PD control. The advantages of the regulation, such as increase of drill life, fast stabilization of a wandering motion, and the precise positioning of the hole are verified in experiment.

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An Adaptive Equalizer for High-Speed Receiver using a CDR-Assisted All-Digital Jitter Measurement

  • Kim, Jong-Hoon;Lim, Ji-Hoon;Kim, Byungsub;Sim, Jae-Yoon;Park, Hong-June
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제15권2호
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    • pp.155-167
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    • 2015
  • An adaptive equalization scheme based on all-digital jitter measurement is proposed for a continuous time linear equalizer (CTLE) preceding a clock and data recovery (CDR) in a receiver circuit for high-speed serial interface. The optimum equalization coefficient of CTLE is determined during the initial training period based on the measured jitter. The proposed circuit finds automatically the optimum equalization coefficient for CTLE with 20", 30", 40" FR4 channel at the data rate of 5 Gbps. The chip area of the equalizer including the adaptive controller is 0.14 mm2 in a $0.13{\mu}m$ process. The equalizer consumes 12 mW at 1.2 V supply during the normal operation. The adaptive equalizer has been applied to a USB3.0 receiver.

Transceiver for Human Body Communication Using Frequency Selective Digital Transmission

  • Hyoung, Chang-Hee;Kang, Sung-Weon;Park, Seong-Ook;Kim, Youn-Tae
    • ETRI Journal
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    • 제34권2호
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    • pp.216-225
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    • 2012
  • This paper presents a transceiver module for human body communications whereby a spread signal with a group of 64 Walsh codes is directly transferred through a human body at a chip rate of 32 Mcps. Frequency selective digital transmission moves the signal spectrum over 5 MHz without continuous frequency modulation and increases the immunity to induced interference by the processing gain. A simple receiver structure with no additional analog circuitry for the transmitter has been developed and has a sensitivity of 250 ${\mu}V_{pp}$. The high sensitivity of the receiver makes it possible to communicate between mobile devices using a human body as the transmission medium. It enables half-duplex communication of 2 Mbps within an operating range of up to 170 cm between the ultra-mobile PCs held between fingertips of each hand with a packet error rate of lower than $10^{-6}$. The transceiver module consumes 59 mA with a 3.3 V power supply.

DSL 모뎀용 CMOS 신호처리 적응필터 설계 (A Design of CMOS Signal Processing Adaptive Filter for DSL Modem)

  • 이근호;이종인
    • 한국정보통신학회논문지
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    • 제8권7호
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    • pp.1424-1428
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    • 2004
  • 본 논문에서는 DSL 모뎀의 입출력단에 응용 가능한 수신단의 CMOS 필터를 설계 제안하였다. 제안된 필터는 저전력 특성을 위한 저전압 동작이 가능하며, 저역통과 특성과 고역통과 특성이 혼합된 연속시간 필터 형태로 송신단과 수신단에 위치하여 각종 DSL 시스템에 응용가능하다. 수신단에서 차단주파수는 각각 138kHz와 1.1MHz로서 요구되는 DSL 시스템의 표준 설계사양에 부합하도록 설계하였다. 선형성면에서 개선된 특성을 나타낸 저전압 gmr 방식의 적분기가 필터 설계를 위한 기본블럭으로 이용되었다. 설계된 필터는 0.25${\mu}m$ CMOS n-well 공정 파라미터를 이용한 HSPICE 시뮬레이션을 통해 그 특성이 검증되었다.

새로운 MPPT 제어기능을 갖는 마이크로 빛에너지 하베스팅 회로 (Micro-scale Photo Energy Harvesting System with a New MPPT control)

  • 윤일영;최선명;박윤수;윤은정;유종근
    • 한국정보통신학회:학술대회논문집
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    • 한국정보통신학회 2013년도 추계학술대회
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    • pp.379-382
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    • 2013
  • 기존의 빛 에너지 하베스팅 회로에서는 MPPT(Maximum Power Point Tracking) 기능을 구현하기 위해 전력변환기(power converter)를 동작시키기 위한 클럭의 주파수나 듀티 싸이클(duty cycle)을 지속적으로 변화시키는 방법을 사용하고 있다. 본 논문에서는 전력변환기에 전력 공급을 위한 스위치의 듀티 싸이클을 제어하여 MPPT 기능을 구현하는 새로운 방법을 제안하였다. 제안된 회로는 0.35um CMOS 공정으로 설계 되었으며 칩 면적은 패드를 포함하여 $770um{\times}800um$이다.

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