• Title/Summary/Keyword: Contamination process

Search Result 740, Processing Time 0.031 seconds

Investigation of Fuel Filter Contamination for Turboprop Engine (터보프롭 엔진 연료필터 오염 원인 탐구)

  • Lee, Hyeongwon;Jo, Hana;Lee, Chungryeol
    • Journal of the Korean Society of Propulsion Engineers
    • /
    • v.23 no.6
    • /
    • pp.87-94
    • /
    • 2019
  • This paper contains the process of investigating the cause of fuel filter contamination of P&WC's PT6A-67A engine. An outline of the fuel filter contamination and configuration of the fuel supply line are specified. The analytical methods were classified into fuel component analysis and solid sediment analysis(EDX, TGA, optical microscope). In summary, the sulfur was detected from fuel tank sealant as a major contamination component. As a follow-up, P&WC and the Agency for Defense Development will conduct engine fuel filter cycle checks and fuel tank cleaning for engine operation.

Method of Particle Contamination Control for Yield Enhancement in the Cleanroom (클린룸 제조공정에서 수율개선을 위한 입자오염제어 방법)

  • Noh, Kwang-Chul;Lee, Hyeon-Cheol;Kim, Dae-Young;Oh, Myung-Do
    • Transactions of the Korean Society of Mechanical Engineers B
    • /
    • v.31 no.6 s.261
    • /
    • pp.522-530
    • /
    • 2007
  • The practical studies on the method of particle contamination control for yield enhancement in the cleanroom were carried out. The method of the contamination control was proposed, which are composed of data collection, data analysis, improvement action, verification, and implement control. The partition check method and the composition analysis for data collection and data analysis were respectively used in the main board and the cellular phone module production lines. And these methods were evaluated by the variation of yield loss between before and after improvement action. In case that the partition check method was applied, the critical process step was selected and yield loss reduction through improvement actions was observed. While in case that the composition analysis was applied, the critical sources were selected and yield loss reduction through improvement actions was also investigated. From these results, it is concluded that the partition check and the composition analysis are effective solutions for particle contamination control in the cleanroom production lines.

The Effect on the Microroughness of Si Substrate by Metallic Impurity Ca (금속 불순물 Ca이 Si 기판의 표면 미세 거칠기에 미치는 영향)

  • Choe, Hyeong-Seok;Jeon, Hyeong-Tak
    • Korean Journal of Materials Research
    • /
    • v.9 no.5
    • /
    • pp.491-495
    • /
    • 1999
  • In this study, we focus on Ca contaminant which affects on the roughness Si substrate after thermal process. The initial Si substrates were contaminated intentionally by using a standard Ca solution. The contamination levels of Ca impurity were measured by TXRF and the chemical composition of that was analyzed by AES. Then we gre the thermal oxide to investigate the effect of Ca contaminants. The microroughness of the Si surface, the thermal oxide surface, and the surface after removing the thermal oxide were measured to examine the electrical characteristics. The initial substrates that were contaminated with the standard solution of Ca exhibited the contamination levels of 10\ulcorner~10\ulcorneratoms/$\textrm{cm}^2$ which was measured by TXRF. The Ca contaminants were detected by AES and exhibited the peaks of Ca, SI, C and O.After intentional contamination, the surface microroughness of this initial substrate was increased from $1.5\AA$ to 4$\AA$ as contamination levels became higher. The microroughness of the thermal oxide surfaces of both contaminated and bare Si substrates exhibits similar values. But the microroughness of the contaminated$ Si/SiO_2$ interface was increased as contamination increased. The thermal oxide of contaminated substrate exhibited the small minority carrier diffusion length, low breakdown voltage, and slightly high leakage current.

  • PDF

Development of High Quality Die Casting Technology with Function to Purify Molten Metal (용탕청정기능을 부여한 고품질 다이캐스팅 기술의 개발)

  • Hatano, Tomoyuki;Takagi, Hiromi;Inagaki, Mitsugi
    • Journal of Korea Foundry Society
    • /
    • v.24 no.1
    • /
    • pp.3-9
    • /
    • 2004
  • Die casting is "a process in which molten metal is injected at high velocity and pressure into a mold(die) cavity". Casting with smooth surfaces, high dimensional precision, complicated shapes, and reduced weight can be obtained using this process. But this process is susceptible to casting defects such as porosities, scattered chilled layers, hard spots, etc. For preventing casting defects, we developed "low-velocity high pressure die casting technology", "squeeze die casting technology", "heat insulating sleeve lubricant technology", and "direct pouring technology". The "direct pouring technology" is useful for producing molten metal without oxide contamination. It consists of a pumping system which supplies pure molten metal to the die casting machine. By using this technology, we have successfully reduced oxide contamination in castings to 1/20 of that of our previous castings.

Development of Particle Deposition System for Cleaning Process Evaluation in Semiconductor Fabrication (반도체 세정 공정 평가를 위한 나노입자 안착 시스템 개발)

  • Nam, Kyung-Tag;Kim, Ho-Joong;Kim, Tae-Sung
    • Proceedings of the KSME Conference
    • /
    • 2007.05b
    • /
    • pp.3168-3172
    • /
    • 2007
  • As the minimum feature size decreases, control of contamination by nanoparticles is getting more attention in semiconductor process. Cleaning technology which removes nanoparticles is essential to increase yield. A reference wafer on which particles with known size and number are deposited is needed to evaluate the cleaning process. We simulated particle trajectories in the chamber by using FLUENT and designed a particle deposition system which consists of scanning mobility particle sizer (SMPS) and deposition chamber. Charged monodisperse particles are generated using SMPS and deposited on the wafer by electrostatic force. The experimental results agreed with the simulation results well in terms of particle number and deposition area according to particle size, flow rate and deposition voltage.

  • PDF

Development of Particle Deposition System for Cleaning Process Evaluation in Semiconductor Fabrication (반도체 세정 공정 평가를 위한 나노입자 안착 시스템 개발)

  • Nam, Kyung-Tag;Kim, Young-Gil;Kim, Ho-Joong;Kim, Tae-Sung
    • Journal of the Semiconductor & Display Technology
    • /
    • v.6 no.4
    • /
    • pp.49-52
    • /
    • 2007
  • As the minimum feature size decrease, control of contamination by nanoparticles is getting more attention in semiconductor process. Cleaning technology which removes nanoparticles is essential to increase yield. A reference wafer on which particles with known size and number are deposited is needed to evaluate the cleaning process. We simulated particle trajectories in the chamber by using FLUENT. Charged monodisperse particles are generated using SMPS (Scanning Mobility Particle Sizer) and deposited on the wafer by electrostatic force. The Experimental results agreed with the simulation results well. We calculate the particles loss in pipe flow theoretically and compare with the experimental results.

  • PDF

The Influence of Pore Water Contamination on the Cement Treated Sandy Soil (공극수 오염이 시멘트 고화처리된 사질토에 미치는 영향)

  • Yu, Chan
    • Magazine of the Korean Society of Agricultural Engineers
    • /
    • v.45 no.6
    • /
    • pp.144-152
    • /
    • 2003
  • Laboratory experiments were carried out to investigate the influence of pore water contamination on the treatment effect of sandy soil which was solidified by Portland cement. In the experiments, setting time of hydraulic cement that was mixed with contaminated mixing water was measured using Vicat equipment and observed the tendency of setting process with the kind of contaminants, organic or inorganic components. It was shown that organic contaminants of the mixing water affect largely on the initial setting process of hydraulic cement and inorganics, expecially heavy metals, did not affect on the initial setting process, otherwise it was appeared that setting time of the sandy soil that was contaminated with inorganic components was apparently faster than the sandy soil that did not include inorganic components even though organic concentrations was relatively low level (COD=200∼300) in the mixing water. The results of unconfined compression strength test (UCST) were well consistent with the results of Vicat equipment test.

Investigation on DHF Application at Metal CMP Cleaning Process (Metal CMP 세정 공정에서 DHF 적용에 관한 연구)

  • 김남훈;김상용;김인표;장의구
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.16 no.7
    • /
    • pp.569-572
    • /
    • 2003
  • In this study, we evaluated the dilute HF cleaning to reduce residual defects made by metal CMP process. The purpose of this test is to observe the existence of barrier metal damage during DHF cleaning on condition that it should not affect metal thin film reliability, so we will get rid of slurry residual particles as a main defect of the metal CMP process for the better yield. In-line defect data showed us that slurry residual particles were removed by DHF application. The HF rinse significantly reduced metal contamination levels and surface roughness. The best effect by additional oxide loss was discovered when Dilute HF condition is 10".

Development of Ceramic Arc-tube by the PIM Process

  • Rhee, Byung-Ohk;Choi, Seung-Chul;Park, Jeong-Shik;Kim, Byoung-Kyu;Kim, Hyung-Soo;Kim, Sang-Woo
    • Proceedings of the Korean Powder Metallurgy Institute Conference
    • /
    • 2006.09a
    • /
    • pp.205-206
    • /
    • 2006
  • A ball-shape alumina arc-tube for low-wattage lamp was developed by the PIM process. An ultra high purity translucentgrade alumina powder was used. In injection molding process, a hot-runner type mold was developed. The translucent-grade alumina powder was extremely sensitive to contamination so that the injection molding condition and atmosphere control in the furnace should be taken care of with extreme caution. Contamination sources were pinpointed with EPMA. The arc-tube was molded in half and two halves were bonded in the middle by a new bonding technique at room temperature developed in this study.

  • PDF

Study on the soil contamination characteristics according to the functions of the returned U.S. military base (반환미군기지 기능별 토양오염특성에 관한 연구)

  • Oh, Chang-Gyu
    • Journal of Environmental Impact Assessment
    • /
    • v.22 no.5
    • /
    • pp.481-489
    • /
    • 2013
  • There are U.S. troops with a force about 290,000 strong stationed all around the world, approximately 150 countries. Among the troops, USFK has performed principal part with its stationing for 50 years against the military threat of North Korea. However, as a result of an investigation made into environmental contamination of several bases which were restituted from US to ROK by the Land Partnership Plan in the process of relocation of USFK, it was found that the area was contaminated by not only TPH and BTEX caused by diesel fuel and JP-8 but also various heavy metal over the standard level according to the operations of corps. Among these bases, 4 corps, each of which has different duties and function, were chosen to be analyzed for the characteristics and degrees of soil contamination. Fisrt of all, in armored camp the soil was contaminated by TPH and heavy metal (Zn, Ni, Pb) due to the repairing activities of tracked vehicles and shooting exercises. In army aviation camp, the soil was contaminated by TPH, BTEX and heavy metal (Zn, Cd) due to repairing activities of aircrafts. Also, in engineer camp there was contaminated area polluted by TPH and heavy metal (Zn, Pb) caused by open-air storage of various construction materials and TPH, BTEX and heavy metal (Zn, Pb, Cu) contamination of aircraft shooting area in shooting range camp were detected. Managing environment will be more effective when we identify the contaminative characteristics and take necessary measures in advance.