• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.9
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• pp.1409-1418
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• 1990

Characteristics of NMOS transistors with phosphorus source/drain junctions formed by two-step rapid thermal diffusion (RTD) process using a solid diffusion source have been investigated. Phosphorus profiles after RTD were measured by SIMS analysis. In the case of 1100\ulcorner, 10sec RTD of, P, the specific contact resistance of n+ Si-Al was 2.4x10**-7 \ulcorner-cm\ulcorner which is 1/5 of the As junction The comparison fo P junction devices formed by RTD and conventional As junction devices shows that both short channel effect and hot carrier effect of P junction devices are smaller than those of As junction devices when the devices have same junction depths. P junction device had maximum of 0.4 times lower Isub/Id than As junction device. Characteristics of P junction formed by several different RTD conditions have been compared and 1000\ulcorner RTD sample had the smaller hot carrier generation. Also, it has been shown that the hot carrier generation can be futher reduced by forming the P junctions by 3-step RTD which has RTO-driven-in process additionally.

• Nuclear Engineering and Technology
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• v.55 no.4
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• pp.1518-1527
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• 2023

A method was proposed for in-situ evaluating the thickness and resistivity of the oxide/hydroxide film formed on the surface of aluminum alloy exposed to sump water formed in the containment after a loss-of-coolant accident. The evaluation entailed fitting a model for the film impedance, which has film thickness and other variables describing the resistivity profile of the film along its thickness direction as fitting parameters, to the practically measured electrochemical impedance data. The obtained resistivity profiles implied that the films formed at pHs_25℃ 7, 8, 9, 10, and 11 all had a duplex structure; compared to the outer layer in contact with the solution, the inner layer of the film had a much higher resistivity and was inferred to be denser and provide most of the protectiveness of the film. Both the thickness and the total resistance of the film decreased with the increasing solution pH_25℃, suggesting that the films formed in more alkaline solutions had less protectiveness against corrosion, consistent with the increasing aluminum alloy corrosion rates previously identified.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.881-887
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• 2014

Micro-sized Peltier coolers are generally employed for uniformly distributing heat generated in the multi-chip packages. These coolers are commonly classified into vertical and planar devices, depending on the heat flow direction and the arrangement of thermoelectric materials on the used substrate. Owing to the strong need for evaluation of performance of thermoelectric modules, at present an establishment of proper theoretical model has been highly required. The design theory for micro-sized thermoelectric cooler should be considered with contact resistance. Cooling performance of these modules was significantly affected by their contact resistance such as electrical and thermal junction. In this paper, we introduce the useful and optimal design model of small dimension thermoelectric module.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1792-1797
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• 2007

This paper try to find root-cause of failure in a connector used in transmitting signals for throttle body control in automotives by analyzing possible failure causes and performing experiments to simulate the cable failure in field. The connector comprises fins, wires, and case moldings. The failure is due to degradation of initial clamping force required fixing fins and wires in the connector. Expansion and compression of the case molding material surrounding fins would cause the degradation. Investigations of strict initial claming force and control of thermal expansion property of the molding are required to prevent the failure.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.07a
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• pp.133-155
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• 2002

1. Quasicrystalline powders shows exotic physical and mechanical p properties 2. Applications: structural application: strengthening particles for composites C Coating application: wear resistance, low friction coefficient 3. For thermal spaying: material loss during process should be c considered to control chemical composition of deposit 4. Friction coefficient is strongly dependent on contact geometry F Friction coefficient from pin on plate: 0.1-0.2 Friction coe야icient from flat on plate: about 0.46. 5. Quasicrystalline materials show lower friction coefficient but higher w wear rate than corresponding values of $Cr_20_3$ coated layer. 6. Amorphous coating seems to be promising

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.18-21
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• 1996

SiO 7f the SiO/TiN film is used as the insulating layer and TiN film is chosen as the barrier against the diffusion of Al which is the terminal connected by ohmic contact because TiN has the advantageous properties such as good thermal stability and very low diffusion rate in spite of it\`s relatively low specific resistance. In this study we investigated it\`s electrical and optical characteristics to determine refractive index, absorption coefficient and Permittivity. The films are differently fabricated in thickness method for this experiment.

• Proceedings of the Korean Nuclear Society Conference
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• 1995.05a
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• pp.973-979
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• 1995

The input equivalent noise charge (ENC) of hydrogenated amorphous silicon radiation detector diodes was measured and analyzed. The noise sources of amorphous silicon diodes were analyzed into three sources; shot noise, flicker noise and thermal noise from the contact resistance. By comparing the measured ENC with the calculated signal charge in uniform generation case, the signal-to-noise ratio (S/N) for the sample diodes is estimated as a function of the detector bias and the shaping time of Gaussian pulse shaper. The maximum S/N occurred at the bias level just above the full depletion voltage for shaping time of 2∼3 ${\mu}$sec. The developed method is useful in optimum design or amorphous silicon p-i-n diodes for charged particulate radiation spectroscopy.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.17-21
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• 2000

Logarithmic electrical resistivity of the untreated or thin diameter carbon fiber composite increased suddenly to the infinity when the fiber fracture occurred by tensile electro-micromechanical test, whereas that of the ED or thick fiber composite increased relatively broadly up to the infinity. Electrical resistance of single-carbon fiber composite increased suddenly due to electrical disconnection by the fiber fracture in tensile electro-micromechanical test, whereas that of SFC increased stepwise due to the occurrence of the partial electrical contact with increasing the buckling or overlapping in compressive test. Electrical resistivity measurement can be very useful technique to evaluate interfacial properties and to monitor curing behavior of single-carbon fiber/epoxy composite under tensile/compressive loading.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.3
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• pp.79-86
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• 1992

The cause of excess current noise which appears some times in RuO$_2$ thick film chip resistors and the process to reduce such noise are investigated. We observed that too large thermal expansion coefficients of resistor paste and electrode metal paste can induce the mechanical stress and microcracks in the contact region of the two sintered materials. Such microcracks result in the reduction of conduction paths in the sintered electrode and this provokes the increase of the resistance value and the current noise. Such excessive current noise induced by microcracks could be reduced or even eliminated by using an enlarged overcoat patterns in the plating process or by adding an additional annealing process before plating.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.570-575
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• 1997

In this days, the thinner film of dielectric materials is required while its capacitance is required to be still large at the VLSI process. Most of such VLSI have MOS structures. For the research on this requirement, MOS capacitors were fabricated on the silicon wafer in four different thickness groups by RF sputtering method. SiO of the SiO/TiN film is used as the insulating layer and TiN is chosen as the barrier against the diffusion of Al which is the terminal connected by ohmic contact because TiN has the advantageous properties such as good thermal stability and very low diffusion rate in spite of its relatively low specific resistance. In this study their electrical and optical characteristics are investigated to find refractive index, absorption coefficient and Permittivity.