• Title/Summary/Keyword: Contact probe

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Experimental Analysis of Radiative Heat Interchange on Furnace Exit Plane of a Steam Boiler

  • Ahn, Kook-Young;Antonovsky, Vjacheslav-Ivanovich
    • Journal of Mechanical Science and Technology
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    • v.15 no.2
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    • pp.239-247
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    • 2001
  • Measured radiative heat fluxes on the furnace exit plane of a heavy duty power boiler of steam output 1650 T/h are discussed. A high-ash pulverized bituminous coal was used. Such measurements are necessary to improve heat fluxes inside a steam boiler furnace was manufactured. An extra small heat radiation sensor was placed in the water cooled head of the probe. The sensor had no direct contact with furnace gases and measured only the radiant energy. There was no exposure to convective heat transfer. With the radiometric probe, one can obtain a spherical indicatrix of radiation intensity as well as hemispherical radiative heat flux incident on any surface passing through a measuring point inside the furnace. Thus, the quantity of radiation energy, passing through the furnace exit plane, to the convective heating surfaces and the quantity of radiation energy going in the opposite direction were measured. A formula for relative radiative heat flux on the furnace exit plane has been proposed.

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CONDUCTIVITIES OF SEA-BOTTOM SEDIMENTS

  • HoWoongShon
    • Journal of the Korean Geophysical Society
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    • v.6 no.2
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    • pp.79-87
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    • 2003
  • An in-situ four-electrode contact resistivity probe system was designed, and field-tested in submarine sediments. Seismic survey was also performed to support and compare the results of electric survey. The probe was designed to be driven to selected depths below the seafloor using a Vibracore system. The four insulated electrodes were, spaced equidistant across the wedge, were extended beyond the probe tip to minimize effects of sediment disturbance by the wedge insertion. In-situ measurements of resistivity were recorded on board by precision electronic equipment consisting of signal generators and processors, and by temperature- monitoring systems. Overall limits of uncertainty at respective depths below the seafloor are up to ±10% of the measured values. Best estimates of conductivity are considered to be ±3 percent of the reported values. Resistivity measurements were made at six sites in carbonate sediments to a maximum depth of penetration of about 5 m. Average values of conductivity range between 0.88 and 1.21 mho/m. The results show the seabed is composed of alternating layers of relatively high-conductivity material (0.8 to 1.4 mho/m) in thicknesses of more or less one meter and layers about 30 cm thick having relatively low conductivities (0.4 to 0.8 mho/m).

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ULTRASONIC PROPERTY OF RADISH UNDER COMPRESSION LOAD

  • Lu, F.M.;Huang, W.J.
    • Proceedings of the Korean Society for Agricultural Machinery Conference
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    • 2000.11c
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    • pp.543-550
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    • 2000
  • The objective of this research was to study the effect of contact force of ultrasonic probe on the ultrasonic attenuation measurement of radish. The relationship between ultrasonic attenuation (y) and contact force (x) for radish can be expressed as equation y=a+bLn(x), where a=8.7194+2.l68x(porosity) and b =-9.9188+0.0075 ${\times}$ (volume). The relationship between ultrasonic power spectrum (y) and contact force (x) for radish is also represented by equation y=a+bLn(x), where a= 60.l965-1.47l4${\times}$(porosity). The coefficient b has no significant relation with radish properties.

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Fabrication and Electrical Properties of Highly Organized Single-Walled Carbon Nanotube Networks for Electronic Device Applications

  • Kim, Young Lae
    • Journal of the Korean Ceramic Society
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    • v.54 no.1
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    • pp.66-69
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    • 2017
  • In this study, the fabrication and electrical properties of aligned single-walled carbon nanotube (SWCNT) networks using a template-based fluidic assembly process are presented. This complementary metal-oxide-semiconductor (CMOS)-friendly process allows the formation of highly aligned lateral nanotube networks on $SiO_2/Si$ substrates, which can be easily integrated onto existing Si-based structures. To measure outstanding electrical properties of organized SWCNT devices, interfacial contact resistance between organized SWCNT devices and Ti/Au electrodes needs to be improved since conventional lithographic cleaning procedures are insufficient for the complete removal of lithographic residues in SWCNT network devices. Using optimized purification steps and controlled developing time, the interfacial contact resistance between SWCNTs and contact electrodes of Ti/Au is reached below 2% of the overall resistance in two-probe SWCNT platform. This structure can withstand current densities ${\sim}10^7A{\cdot}cm^{-2}$, equivalent to copper at similar dimensions. Also failure current density improves with decreasing network width.

Nonlinear Dynamics of AFM Tip with Different Contact Models (접촉모델에 따른 AFM 팀의 배선형 동역학 비교)

  • 홍상혁;이수일;이장무
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2004.05a
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    • pp.73-76
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    • 2004
  • Tapping mode atomic force microscopy (TM-AFM) utilizes the dynamic response of a resonating probe tip as it approaches and retracts from a sample to measure the topography and material properties of a nanostructure. We present recent results based on numerical techniques that yield new perspectives and insight into AFM. It is compared that the dynamic models including van der Waals and Derjaguin-Muller-Toporov(DMT) or Johnson-Kendall-Roberts(JKR) contact forces demonstrates that periodic solutions can be represented with respect to the approach distance and excitation frequency.

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Non-contact mode measurement of high aspect ratio tip (High aspect ratio 팁의 비접촉모드에서의 측정)

  • Shin Y.H.;Han C.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.463-464
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    • 2006
  • This paper present experimental results by non-contact mode Atomic Force Microscopy using high aspect ratio tips (HAR-T). We fabricated the carbon nanotube tip based on dielectrophoresis and the carbon nano probe by focused ion beam after dielectrophoretic assembling. In this paper, we measure AAO sample and trench structure to estimate HAR-T's performance and compared with conventional Si tip. We confirmed that results of HAR-T's performance in non contact mode was very superior than conventional tip.

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TSV Fault Detection Technique using Eye Pattern Measurements Based on a Non-Contact Probing Method (Eye 패턴을 사용한 비접촉 형태의 TSV 고장 검출 기법)

  • Kim, Youngkyu;Han, Sang-Min;Ahn, Jin-Ho
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.64 no.4
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    • pp.592-597
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    • 2015
  • 3D-IC is a novel semiconductor packaging technique stacking dies to improve the performance as well as the overall size. TSV is ideal for 3D-IC because it is convenient for stacking and excellent in electrical characteristics. However, due to high-density and micro-size of TSVs, they should be tested with a non-invasive manner. Thus, we introduce a TSV test method on test prober without a direct contact in this paper. A capacitive coupling effect between a probe tip and TSV is used to discriminate small TSV faults like voids and pin-holes. Through EM simulation, we can verify the size of eye-patterns with various frequencies is good for TSV test tools and non-contact test will be promising.

MICP(Multi-pole Inductively Coupled Plasma)를 이용한 deep contact etch 특성 연구

  • 김종천;구병희;설여송
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2003.05a
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    • pp.12-17
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    • 2003
  • 본 연구에서는 MICP Etching system 을 이용한 Via contact 및 Deep contact hole etch process 특성을 연구하였다. Langmuir probe 를 이용한 MICP source 의 Plasma density & electron temperature 측정하였고 탄소와 플로우르를 포함하는 혼합 Plasma 를 형성하여 RF frequency, wall temperature, chamber gap, gas chemistry 등의 변화에 따른 식각 특성을 조사하였다. Plasma density 는 1000w 에서 $10^{11}$/$cm^3$ 이상의 high density plasma와 uniform plasma 형성을 확인하였고 $CH_{2}F_{2}$와 CO의 적절한 혼합비를 이용하여 Oxide to PR 선택비가 10 이상인 고선택비 조건을 확보하였다. 고선택비 형성에 따라 Polymer 형성이 많이 되었고 이를 개선하기 위하여 반응 챔버의 온도 조절을 통하여 Polymer 증착 방지에 효과적인 것을 확인하였다. MICP source를 이용하여 탄소와 플로우르의 혼합 가스와 식각 챔버의 온도 조절에 의한 선택비 증가를 확보하여 High Aspect Ratio Contact Hole Etch 가능성을 확보하였다.

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Metal-Semiconductor Contact Behavior of Solution-Processed ZnSnO Thin Film Transistors (용액법으로 제작된 ZnSnO 박막트랜지스터의 전극 물질에 따른 계면 접촉특성 연구)

  • Jeong, Young-Min;Song, Keun-Kyu;Woo, Kyoo-Hee;Jun, Tae-Hwan;Jung, Yang-Ho;Moon, Joo-Ho
    • Korean Journal of Materials Research
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    • v.20 no.8
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    • pp.401-407
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    • 2010
  • We studied the influence of different types of metal electrodes on the performance of solution-processed zinc tin oxide (ZTO) thin-film transistors. The ZTO thin-film was obtained by spin-coating the sol-gel solution made from zinc acetate and tin acetate dissolved in 2-methoxyethanol. Various metals, Al, Au, Ag and Cu, were used to make contacts with the solution-deposited ZTO layers by selective deposition through a metal shadow mask. Contact resistance between the metal electrode and the semiconductor was obtained by a transmission line method (TLM). The device based on an Al electrode exhibited superior performance as compared to those based on other metals. Kelvin probe force microscopy (KPFM) allowed us to measure the work function of the oxide semiconductor to understand the variation of the device performance as a function of the types metal electrode. The solution-processed ZTO contained nanopores that resulted from the burnout of the organic species during the annealing. This different surface structure associated with the solution-processed ZTO gave a rise to a different work function value as compared to the vacuum-deposited counterpart. More oxygen could be adsorbed on the nanoporous solution-processed ZTO with large accessible surface areas, which increased its work function. This observation explained why the solution-processed ZTO makes an ohmic contact with the Al electrode.

A Study on the Development of iGPS 3D Probe for RDS for the Precision Measurement of TCP (RDS(Robotic Drilling System)용 TCP 정밀계측을 위한 iGPS 3D Probe 개발에 관한 연구)

  • Kim, Tae-Hwa;Moon, Sung-Ho;Kang, Seong-Ho;Kwon, Soon-Jae
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.6
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    • pp.130-138
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    • 2012
  • There are increasing demands from the industry for intelligent robot-calibration solutions, which can be tightly integrated to the manufacturing process. A proposed solution can simplify conventional robot-calibration and teaching methods without tedious procedures and lengthy training time. iGPS(Indoor GPS) system is a laser based real-time dynamic tracking/measurement system. The key element is acquiring and reporting three-dimensional(3D) information, which can be accomplished as an integrated system or as manual contact based measurements by a user. A 3D probe is introduced as the user holds the probe in his hand and moves the probe tip over the object. The X, Y, and Z coordinates of the probe tip are measured in real-time with high accuracy. In this paper, a new approach of robot-calibration and teaching system is introduced by implementing a 3D measurement system for measuring and tracking an object with motions in up to six degrees of freedom. The general concept and kinematics of the metrology system as well as the derivations of an error budget for the general device are described. Several experimental results of geometry and its related error identification for an easy compensation / teaching method on an industrial robot will also be included.