• Tunnel and Underground Space
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• v.15 no.4 s.57
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• pp.305-315
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• 2005

DDA (Discontinuous Deformation Anlaysis) is one of the latest numerical analysis which has merits of both FEM and DEM. In this research a new edge-to-edge contact algorithm was applied on DDA. With adoption of new edge-to-edge contact state definition, sub-algorithm was improved about open-close iteration, contact state judge, contact detecting, and friction forces acting on joints. Newly applied DDA was verified based on two different cases. The DDA results show good agreement with numerically predicted one.

• Design & Manufacturing
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• v.10 no.1
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• pp.19-25
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• 2016

Connectors are very important components that transmit electric signals to different parts. It must maintain intensity of the connector to prevent defects from impact and maintain contact to transmit electric signals. Most of the external parts of the connector, which act as the main framework, are formed by injection molding. However, bend deformation occurs for injection molded products due to the residual stress left inside the product after product molding. When the bend deformation is large, it does not come into complete contact when being assembled with other parts, which leads to connector contact intensity not being properly maintained. In result, the main role of the connector, which is to transmit electric signals, cannot be performed. In order to address this problem, this study conducted bend deformation cause analysis through bend deformation analysis to predict and prevent bend deformation of housings and wafers, which are injection molded products of pressure welded connectors that are normally applied in compact mobile and display products. Bend deformation analysis was carried out by checking the charging time, pressure distribution and temperature distribution through wire to board connector wafer and housing injection molding analysis. Based on the results of the bend deformation analysis results, the cause of the bend deformation was analyzed through deformation resulting from disproportional cooling, deformation resulting from disproportional contraction, and deformation resulting from ingredient orientation. In result, it was judged that the effects for bend deformation were biggest due to disproportional contraction for both the pressure welded connector wafer and housing.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.838-843
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• 2008

Since thickness deformation and lateral deflection often occurs during the collision of flexible bodies, they should be considered simultaneously in the impact analysis. The thickness deformation, however, cannot be considered in beam/shell theory since the thickness is assumed to be constant in the theory. So, solid elements are employed to estimate the thickness deformation. However, the CPU time increases significantly if solid elements are employed. In the present study, a modeling method for the impact analysis of a flexible body employing Hertzian contact theory is presented. The efficiency and the accuracy of the modeling method are discussed with some numerical examples.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.38-42
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• 2000

In this study, the low velocity impact behavior of the composite laminates has been described by using 3 dimensional nonlinear finite elements. To describe the geometric nonlinearity due to large deformation, the dynamic contact problem is formulated using the exterior penalty finite element method on the base of Total Lagrangian formulation. The incremental decomposition is introduced, and the converged solution is attained by Newton-Raphson Method. The Newmark's constant-acceleration time integration algorithm is used. To make verification of the finite element program developed in this study, the solution of the nonlinear static problem with occurrence of large deformation is compared with ABAQUS, and the solution of the static contact problem with indentation is compared with the Hertz solution. And, the solution of low velocity impact problem for isotropic material is verificated by comparison with that of LS-DYNA3D. Finally the contact force of impact response from the nonlinear analysis are compared with those from the linear analysis.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1992.03a
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• pp.11-26
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• 1992

In this research, a numerical algorithm has been developed, which can be applied to the large deformation and large displacement contact problems between angle change have been proposed considering the change in geometric shape and rate of contact force. A set of linear simultaneous equations is constructed by adding the geometric shape change and contact conditions to the original stiffness matrix. A new method to determine time increment has been proposed based on Euler method, in which the condition to prevent the contact bodies from penetrating and overrunning each other has been taken into consideration. Practical application to contact problem is extrusion in which bodies are sliding along the contact boundary.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1346-1351
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• 2003

There is few research about contact problem in SPH because it is primarily suitable to analyze the large deformation problem. However, an elasto-plastic problem with small deformation need to be considered about contact characteristics. The numerical formulating methods for SPH is induced to be able to obtain solutions based on a variational method in contact problem. The contact algorithm presented is applied to the elastic impact problem in 1D and 2D. The results show thai an imaginary tension and a numerical instability which happen in impacting between different materials can be removed and contact forces which could not have been calculated are able to obtain.

• Geomechanics and Engineering
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• v.36 no.6
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• pp.575-587
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• 2024

The contact pressure between the surrounding rock and the support is an important indicator of the surrounding rock pressure. There has been a bottleneck in the prediction of contact loads between surrounding rock and primary support in deep-buried mountain tunnels. The main reason is that a reliable method wasn't existed to quantify the contact loads. This study had been taken into account the flexible support role of the primary support, and the fitting curve of surrounding rock deformation for dynamic tunnel construction was proposed. New formulas for the calculation of contact loads between surrounding rock and primary support were obtained by inversion. Comparative analysis of the calculation results with numerical simulation verified the reliability of the calculation method in this study. It can be seen from the analyses that the contact load between surrounding rock and primary support increases, remains unchanged and decreases during acceleration, uniform velocity and deceleration, respectively, and the deformation of the surrounding rock in the acceleration and deceleration stages cannot completely converted into contact loads. The contact loads between surrounding rock and primary support of medium-strength and weak surrounding rock tunnels are generally within 150 kPa and 1 MPa, respectively. For tunnels with weak surrounding rock, advanced support can be installed to reduce the unique release coefficient λ₀ and the value of the constant D, with the purpose of reducing the contact loads between surrounding rock and primary support. Changes in support parameters have a small effect on the contact loads between surrounding rock and primary support, but increase or decrease the safety factor, resulting in a waste of resources or a situation that threatens the safety of the support. The results of this research provide guidance for the prediction of contact loads between surrounding rock and primary support for dynamic tunnel construction.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.518-520
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• 2007

Since all essential property of semiconductor materials are structure-sensitive, the understanding of the deformation mechanism and the deformed structure which can be formed in the nanometer-scale devices is very crucial. To investigate the deformation mechanism and the corresponding structures, nanometer-scale contact loading simulations are carried out using molecular dynamics in silicon and gallium-arsenide.

• Journal of the Korean Institute of Gas
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• v.15 no.6
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• pp.34-37
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• 2011

This paper presents sealing contact stress and deformation behaviors of an elastomeric contact seal for a pipe connection. In this study, a pipe connection is used by a joint nut and an elastomeric contact seal with a sealing interference of 0.2~0.5mm. A sealing interference in which compresses an elastomeric contact seal is generated by fastening a joint nut between two pipes. The FEM computed results show that the contact normal stress of contact model 1 with an inclined sealing surface is 1.5~1.75 times high in compared with that of contact model 2 with a parallel sealing surface. This indicates that the sealing contact surface recommends a wedge contact mode between two pipe connections for a high sealing compression stress.

• Transactions of Materials Processing
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• v.18 no.4
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.