• 제목/요약/키워드: Contact condition

검색결과 1,535건 처리시간 0.035초

고체표면에 응축된 물 분자의 윤활특성에 대한 분자시뮬레이션 연구 (Lubrication Characteristics of Condensed Water Molecules at Solid Surface through Molecular Simulation)

  • 김현준
    • Tribology and Lubricants
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    • 제37권5호
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    • pp.195-202
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    • 2021
  • This paper presents a numerical analysis of the lubrication characteristics of condensed water molecules on a solid surface by conducting molecular dynamics simulations. We examine two models consisting of a simple hexahedral substrate with and without water molecules to reveal the lubrication mechanism of mono-layered water molecules. We perform a sliding simulation by contacting and translating a single asperity on the substrate under various normal loads. During the simulation, we measure the friction coefficient and atomic stress. When water molecules were interleaved between solid surfaces, atomic stress exerted on individual atom and friction coefficient were smaller than those of model without water molecule. Particularly, at a low load, the efficacy of water molecules in the reduction of atomic stress and friction is remarkable. Conversely, at high loads, water molecules rarely lubricate solid surfaces and fail to effectively distribute the contact stress. We found a critical condition in which the lubrication regime changes and beyond the condition, significant plastic deformation was created. Consequently, we deduce that water molecules can distribute and reduce contact stress within a certain condition. The reduced contact stress prevents plastic deformation of the substrate and thus diminishes the mechanical interlocking between the asperity and the substrate.

Analysis of sliding/Impacting Wear in T7be to Convex Spring Contact and Relevant Contact Problem

  • Kim, Hyung-Kyu;Lee, Young-Ho;Heo, Sung-Pil;Jung, Youn-Ho;Ha, Jae-Wook;Kim, Seock-Sam;Jeon, Kyeong-Lak
    • KSTLE International Journal
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    • 제3권1호
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    • pp.60-67
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    • 2002
  • Wear on the tube-to-spring contact is investigated experimentally, The vibration of the tube causes the wear while the springs support it As for the supporting conditions, the contacting normal farce of 5 N,0 N and the gap of 0.1 mm are applied. The gap condition is for considering the influence of simultaneous impacting and sliding on wear. The wear volume and depth decreases in the order of the 5 N,0 N and the gap conditions. This is explained from the contact geometry of the spring, which is convex of smooth contour, The contact shear force is regarded smaller in the case of the gap existence compared with the other conditions. The wear mechanism is considered from SEM observation of the worn surface. The variation of the normal contact traction is analysed using the finite element analysis to estimate the slip displacement range on the contact with consulting the fretting map.

금속 접촉 저항에 대한 RF 식각 조건의 영향 (Effect of RF Etch Conditions on Metal Contact Resistance)

  • 김도우;정철모;구경완;왕진석
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제51권4호
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    • pp.147-151
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    • 2002
  • The resistances of metal2 contact to metall and poly Si are checked by various RF etch conditions in terms of pre-cleaning. The changes of resistance are evaluated by statistical analysis method(SAS) for the AC bias power, coil power and RF target. The contact area on poly Si is shown by TEM image and the distributions of contact resistance according to ar etch target and RTP are investigated. The RTP groups have larger variations than normal RF etch targets. When the RF etch target becomes lower and coil power becomes higher, the resistances of metal2 contact to metals and poly Si have lower contact resistance. But the condition of AC bias power did not satisfied low meta12 contacts resistance for metall and poly Si simultaneously. The R-square of ststistical analysis was 0.98 for resistances of meta12 contact to poly Si and 0.87 for resistances of meta12 contact to metall.

Experimental study on the shear thinning effects of viscosity index improver added lubricant by in-situ optical viscometer

  • Jang, Siyonl
    • Korea-Australia Rheology Journal
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    • 제15권3호
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    • pp.117-124
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    • 2003
  • Elastohydrodynamic lubrication (EHL) film is measured under the condition of viscosity index improver added to base oil. In-situ optical contact method using the interference principle make the measuring resolution of ~5 nm possible and enables the measuring range all over the contact area of up to ~300 $\mu\textrm{m}$ diameter. What is more important to the developed method by the author is that the measurement of EHL film thickness is possible in the range from 100 nm to 2 $\mu\textrm{m}$, which is the regime of worst contact failures in precision machinery. Viscosity index improver (VII) is one of the major additives to the modem multigrade lubricants for the viscosity stability against temperature rise. However, it causes shear thinning effects which make the film thickness lessened very delicately at high shear rate (over $10^5 s^{-1}$) of general EHL contact regime. In order to exactly verify the VIIs performance of viscosity stability at such high shear rate, it is necessary to make the measurement of EHL film thickness down to ~100 nm with fine resolution for the preliminary study of viscosity control. In this work, EHL film thickness of VII added lubricant is measured with the resolution of ~5 nm, which will give very informative design tool for the synthesis of lubricants regarding the matter of load carrying capacity at high shear rate condition.

고전류 스트레싱이 금스터드 범프를 이용한 ACF 플립칩 파괴 기구에 미치는 영향 (High Electrical Current Stressing Effects on the Failure Mechanisms of Austudbumps/ACFFlip Chip Joints)

  • 김형준;권운성;백경욱
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.195-202
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    • 2003
  • In this study, failure mechanisms of Au stud bumps/ACF flip chip joints were investigated underhigh current stressing condition. For the determination of allowable currents, I-V tests were performed on flip chip joints, and applied currents were measured as high as almost 4.2Amps $(4.42\times10^4\;Amp/cm^2)$. Degradation of flip chip joints was observed by in-situ monitoring of Au stud bumps-Al pads contact resistance. All failures, defined at infinite resistance, occurred at upward electron flow (from PCB pads to chip pads) applied bumps (UEB). However, failure did not occur at downward electron flow applied bumps (DEB). Only several $m\Omega$ contact resistance increased because of Au-Al intermetallic compound (IMC) growth. This polarity effect of Au stud bumps was different from that of solder bumps, and the mechanism was investigated by the calculation of chemical and electrical atomic flux. According to SEM and EDS results, major IMC phase was $Au_5Al_2$, and crack propagated along the interface between Au stud bump and IMC resulting in electrical failures at UEB. Therefore. failure mechanisms at Au stud bump/ACF flip chip Joint undo high current density condition are: 1) crack propagation, accompanied with Au-Al IMC growth. reduces contact area resulting in contact resistance increase; and 2) the polarity effect, depending on the direction of electrons. induces and accelerates the interfacial failure at UEBs.

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고효율 Solar Cell 제조를 위한 Firing 공정 조건의 최적화 (Optimization of the firing process condition for high efficiency solar cells on single-crystalline silicon)

  • 정세원;이성준;홍상진;한승수
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2006년도 추계학술발표회 초록집
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    • pp.4-5
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    • 2006
  • This paper represents modeling and optimization techniques for solar cell process on single-crystalline float zone (FZ) wafers with high efficiency; There were the four significant processes : i)emitter formation by diffusion, anti-reflection-coating (ARC) with silicon nitride using plasma-enhanced chemical vapor deposition (PECVD); iii)screen-printing for front and back metallization; and iv)contact formation by firing. In order to increase the performance of solar cells, the contact formation process is modeled and optimized. This paper utilizes the design of experiments (DOE) in contact formation to reduce process time, fabrication costs. The experiments were designed by using central composite design which is composed of $2^4$ factorial design augmented by 8 axial points with three center points. After contact formation process, the efficiency of the solar cell is modeled using neural networks. This model is used to analyse the characteristics of the process, and to optimize the process condition using genetic algorithms (GA). Finally, find optimal recipe for solar cell efficiency.

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단 측벽 구속하에서 압축 및 내압을 받는 고무 오링의 설계 민감도 연구 (A Study on Design Sensitivity of Elastomeric O-ring Squeezed and Highly Pressurized Under Laterally One-sided Constrained Condition)

  • 박성한;김재훈;김원훈
    • 한국안전학회지
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    • 제22권6호
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    • pp.27-34
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    • 2007
  • Static or dynamic elastomeric O-ring seals are installed between joining parts, and play key roles of high pressure-tightening. Sealing performance and structural safety of the O-ring are dependent on groove design, plain diameter, squeeze and applications such as pressure and temperature. In this study, to solve O-ring problem squeezed and highly pressurized under laterally one-sided constrained condition, hyperelastic FE analyses are performed, and FE results are compared with measured ones by computer-aided tomography, deformed shape and extrusion depth of the O-ring. Through the comparisons, FE analysis technique was verified. In order to evaluate design sensitivity, Taguchi method was used to select FE analysis cases. Adjustment parameters are clearance gap, groove comer radius, plain diameter and squeeze. By means of verified FE analysis technique, it has been analysed how the parameters have effects on contact stress fields, internal stress fields, and extrusion depths. Sealing performance has been evaluated based on contact stress fields and contact widths, and structural safety on internal stress and strain, extrusion lengths.

Pile Contact Depth Effects in Rubbed Polyimide(PI) Films

  • 김기정;권혁민;이상문;이철구;곽무선;김봉수
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.398-398
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    • 2010
  • To determine the molecular directionality of PI chains depending on rubbing condition, we measured the angle resolved near edge X-ray absorption fine structure (NEXAFS) spectra at C K-edge of the rubbed PI films. Twisted nematic mode PI (PI-TN) and in plane switching mode PI (PI-IPS) were introduced to examine the effect of rubbing conditions on the chain directionality. The average tilt angle a of the PI molecules was estimated through the measured intensity change of $C=C\;{\pi}^*$ in NEXAFS C K-edge spectrum by controlling the stage speed and the pile contact depth. After rubbing, the irregular molecular direction changed to a regular direction with a molecular tilt angle of $51.2^{\circ}$ for PI-TN and $49.6^{\circ}$ for PI-IPS at the rubbing condition of the roll speed of 1000 rpm, stage speed of 50 mm/sec, and file contact depth of 0.3 mm. The molecular tilt angle $\alpha$ was linearly decreased in the PI-TN and PI-IPS samples with increasing depth of the pile contact.

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전기철도 강체전차선로의 정적 상태 검출 기술 연구 (A Study on Technologies for Measuring Static Condition of Rigid Conductor System in Railway Electrification)

  • 나경민;이기원;박영
    • 한국전기전자재료학회논문지
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    • 제32권6호
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    • pp.507-511
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    • 2019
  • The purpose of an electric railway system contact wire is to supply electric energy to trains through a contacted pantograph. This energy is then converted into mechanical energy. Recent developments in overhead contact lines include the increase in the tension force up to 34 kN according to train speeds that reach up to 400 km/h with a verified safety. Rigid conductor catenary (R-Bar) for high speeds of up to 250 km/h have been developed in tunnels to save on construction costs. This is significant because minor defects in R-bars in aspects, such as height and stagger affect installation conditions. In this study, we propose the use of a detector that measures the static characteristics to reduce the R-bar installation errors. This detector has been developed to measure the height and stagger of the contact wire using video images.

구면과 토릭 소프트 렌즈로 교정한 약도 난시안의 대비감도와 눈부심 (Contrast Sensitivity and Glare with Spherical and Toric Soft Contact Lenses in Low-astigmatic Eyes)

  • 이민아;김현정;김재민
    • 한국안광학회지
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    • 제14권1호
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    • pp.39-45
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    • 2009
  • 목적: 본 연구는 약도의 근시성 난시안의 토릭 소프트 렌즈와 다른 교정 방법의 효과를 알아보기 위해 대비감도 검사와 눈부심 장애 검사를 이용하여 시력의 질을 비교하였다. 방법: 1.50D이하의 경도 난시의 근시안인 남녀 대학생 20명(40안)을 대상으로 5가지 다른 방법(소프트렌즈 등가구면, 토릭 소프트 렌즈, RGP 렌즈, 난시교정 안경, 안경 등가구면)으로 교정하였다. 모든 대상자는 교정시력이 20/20(1.0) 이상이었다. 대비감도 검사와 눈부심 장애 검사는 OPTEC$^{(R)}$ 6500을 이용하여 밝은 조도과 어두운(글레어) 조도에서 실시하였다. 결과: 밝은 조도 하에서 난시교정 안경이 모든 공간주파수에서 가장 높은 대비감도를 나타내었고, 토릭 소프트 렌즈, RGP 렌즈, 안경 등가구면, 소프트 콘택트렌즈 등가구면 처방 순으로 대비감도가 낮아지는 것으로 나타났다. 그러나 모두 정상 범위의 대비감도 영역에 포함되었다. 어두운 조도(글레어) 하에서는 토릭 소프트 렌즈 착용자가 가장 높은 대비감도를 나타내었고, RGP렌즈, 안경 등가구면, 난시교정 안경, 소프트 렌즈 등가구면 처방 순으로 대비감도가 낮아지는 것으로 나타났다. 구면 소프트렌즈 착용자는 어두운 조도(글레어) 하에서 정상 영역보다 낮은 대비감도 값을 보였다. 결론: 약도의 근시성 난시안의 교정으로 토릭 소프트 렌즈 교정이 구면 소프트렌즈보다 좋은 시력의 질(대비감도)을 보인 것으로 나타났다. 어두운 조명에서 콘택트렌즈를 착용해야할 경우에는 토릭 소프트렌즈가 우수한 것으로 사료된다.

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