• Title/Summary/Keyword: Consumables

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Evaluation of Mechanical Properties of RPV Clad by Small Punch Tests

  • Lee, Joo-Suk;Kim, In-Sup
    • Nuclear Engineering and Technology
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    • v.34 no.6
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    • pp.574-585
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    • 2002
  • The microstructural characteristics and its related mechanical properties of RPV cladding have been investigated using small punch (SP) tests. SA508 Cl.3 RPV steel plates were overlay cladded with the type ER309L welding consumables by submerged arc welding process. Although the RPV clad material had a small portion of 5 ferrite phase, it still showed the ductile to brittle transition behavior The transition temperature was determined by the SP test and it depended on the content of $\sigma$ phase, specimen size, and determination methods. The fracture appearance of SP specimen was changed from circumferential to radial cracking as test temperature became low, and below the transition temperature region, ER309L cladding usually fractured along the 6 ferrite by the low temperature failure of ferrite phase.

An Analysis on the Material Removal Mechanism of Chemical-Mechanical Polishing Process Part I: Coupled Integrated Material Removal Modeling (화학-기계적 연마 공정의 물질제거 메커니즘 해석 Part I: 연성 통합 모델링)

  • Seok, Jong-Won;Oh, Seung-Hee;Seok, Jong-Hyuk
    • Journal of the Semiconductor & Display Technology
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    • v.6 no.2 s.19
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    • pp.35-40
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    • 2007
  • An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.

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A Study on the Oxide CMP Characteristics using $ZrO_2$ -Diluted Silica Slurry($ZrO_2$ -DSS) ($ZrO_2$ - DSS의 CMP 특성에 관한 연구)

  • Lee, Sung-Il;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.10a
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    • pp.85-86
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    • 2006
  • Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables arc relatively high because of expensive slurry. In this paper, in order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, abrasives were added in the diluted silica slurry (DSS) in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry (MAS) for the oxide CMP application.

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Effects of Mixed Abrasive Slurry(MAS) on Metal CMP Characteristics (MAS (Mixed Abrasive Slurry)가 Metal CMP에 미치는 영향)

  • Lee, Young-Kyun;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.10a
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    • pp.81-82
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    • 2006
  • Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, so as to investigate the influence of mixed abrasive slurry (MAS), such as $ZrO_2$, $CeO_2$, and $MnO_2$ for Ti-CMP application.

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A Study on the Oxide CMP Characteristics of using $MnO_2$-Mixed Abrasive Slurry ($MnO_2$-MAS) ($MnO_2$ 연마제를 혼합한 Mixed Abraive Slurry (MAS)의 CMP 특성)

  • Han, Sung-Min;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.10a
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    • pp.83-84
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    • 2006
  • Chemical mechanical polishing (CMP) process has been attracted as an essential technology of multi-level interconnection. However, the COO (cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. Also, the addition effects of $MnO_2$ abrasives and the diluted silica slurry (DSS) on CMP performances were evaluated. Finally, we have investigated the possibility of new abrasive for the oxide CMP application.

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A Study on the Oxide CMP Characteristics of using Mixed Abrasive Slurry(MAS) (혼합 연마제 슬러리를 이용한 Oxide CMP 특성에 관한 연구)

  • Lee, Sung-Il;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1727-1728
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    • 2006
  • Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by do-ionized water (DIW). And then, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

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Effects of Silica Slurry Dispersion and pH on the Oxide CMP (슬러리 분산 및 pH가 Oxide CMP에 미치는 영향)

  • Han, Sung-Min;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1731-1732
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    • 2006
  • CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

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The Meaning of Water and Its Interpretation in the Space (물의 의미와 공간적 해석)

  • 오영근
    • Korean Institute of Interior Design Journal
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    • no.9
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    • pp.127-133
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    • 1996
  • Water is the origin of all things and has been standing as a symbol of eternity which neglectes birth and death, or time and space. We mankind , however, confronts the water pollution or moreover the situation threatening even our existence as the results of considering it as mere consumables without any study on its original meaning or nature. Now, we should search for the way to understand the substance of water and to use it in the course of nature, getting rid of the altitude of merely consuming it. Our traditional way of life is in harmony with the nature and water has been adopted in the space as the important element of the nature especially as per the theory of geomancy. Man can be inspired by the plasticity , motion, sound , and reflectivity of water adopted and harmonized in the space, and the concept such as water both of inner and outer space or hierachy of a microcosmis to be composed by the natural order which lines up a man-water-space.

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Development of Water Treatment System Using Non-contact Plasma (비접촉식 플라즈마 수처리 장치(플라투스) 개발)

  • Lee, Min-ki;Jeong, Byung-jo;Park, Jun-hyung;Jo, Gil-hwoan
    • Proceedings of the KIPE Conference
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    • 2012.07a
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    • pp.117-119
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    • 2012
  • Plasma Water Treatment, a Unique System(PLATUS) of algae(Chl-a) removal efficiency is average 90.6 up to 99.6%, It is cost effective facility because it doesn't need any other chemicals and consumables. Also, It is Eco-friendly installation with no sludge. It is easy to transform its treatment capacity by the number of Plasma installation. As it requires small space for installing, It can be installed in Land nearby water, vehicle mounted, and set on the ship.

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Welding Residual Stress and Strength of Thick 9% Nickel Steel Plate (9% 니켈강 후판 용접부의 강도 및 잔류응력)

  • Kim, Young-Kyun;Kim, Young-Wann;Kim, Jae-Hoon
    • Journal of Power System Engineering
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    • v.18 no.4
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    • pp.85-90
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    • 2014
  • In this paper, the transient thermal and residual stress analysis of the welding of 9% Ni steel plates using the FEA software ABAQUS are presented. The 9% Ni steel plates are welded manually with welding consumables of 70% Ni based Inconel type super-alloys (YAWATA WELD B (M)), producing a multi-pass/multi-layer butt weld. For these materials, temperature dependant mechanical and thermal material properties are used in the analysis. The back gouging is considered in welding process simulation. The FE thermal results are validated by comparing the real fusion profile and heat affected zone (HAZ). In addition, the continuous indentation test was conducted to measure the strength of base metal, HAZ and weld metal.