• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.15-15
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• 1999

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.

• Coupled systems mechanics
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• v.11 no.2
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• pp.151-166
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• 2022

Peltier cells have low efficiency, but they are becoming attractive alternatives for affordable and environmentally clean cooling. In this line, the current article develops closed-form and semianalytical solutions to improve the temperature distribution of Bi₂Te₃ thermoelements. From the distribution, the main objective of the current work-the optimal electric intensity to maximize cooling-is inferred. The general one-dimensional differential coupled equation is integrated for linear and quadratic geometry of thermoelements, under temperature constant properties. For a general shape, a piece-wise solution based on heat flux continuity among virtual layers gives accurate analytical solutions. For variable properties, another piece-wise solution is developed but solved iteratively. Taking advantage of the formulae, the optimal intensity is directly derived with a minimal computational cost; its value will be of utility for more advanced designs. Finally, a parametric study including straight, two linear, barrel, hourglass and vase geometries is presented, drawing conclusions on how the shape of the thermoelement affects the coupled phenomena. A specially developed coupled and non-linear finite element research code is run taking into account all the materials of the cell and using symmetries and repetitions. These accurate results are used to validate the analytical ones.

• Journal of Korean Physical Therapy Science
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• v.16 no.3
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• pp.1-9
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• 2009

Background: The purpose of this study is to have examined the influence on the blood circulation by comparing the differences between stimulating the sympathetic ganglion and the muscle group among the stimulation variables in interferential current stimulation. Method: The object of the study is the twenties(M=8, F=12), who are in great condition and have no pathological report for the blood circulation influence. The intensity of the inferential current stimulation is the medium degree, 100 bps constant current, which is the comfort and degree to confirm the muscle contraction. The areas stimulated are the stellate ganglion area in the seventh cervical vertebrae and the forearm muscle area. Results: We have made sure that there is no change in blood pressure and pulse and that the change in the skin temperature occurred highly. Conclusion: In considering the change of the blood circulation in case of stimulation area by the inferential current stimulation, we have seen that stimulating the sympathetic ganglion area is more effective than stimulating muscle area directly.

• The Journal of Korean Physical Therapy
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• v.21 no.4
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• pp.73-79
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• 2009

Purpose: Recently, neurostimulation studies involving manipulation of cortical excitability of the human brain have been increasingly attempted. We investigated whether transcranial direct current stimulation (tDCS) applied to the underlying cerebral cortex, directly induces cortical activation during fMRI scanning. Methods: We recently recruited five healthy subjects without a neurological or psychiatric history and who were right-handed, as verified by the modified Edinburg Handedness Inventory. fMRI was done while constant anodal tDCS was delivered to the underlying SM1 area?? immediately after the pre-stimulation for eighteen minutes. Results: Group analysis yielded an averaged map that showed that the SM1 area and the superior parietal cortex in the ipsilateral hemisphere were activated. The voxel size and peak intensity were, respectively, 82 and 5.22 in the SM1, and 85 and 5.77 in the superior parietal cortex. Conclusion: Cortical activation can be induced by constant anodal tDCS of the underlying motor cortex. This suggests that tDCS may be an effective therapeutic device for enhancing? physical motor function by modulating neural excitability of the motor cortex.

• Corrosion Science and Technology
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• v.8 no.4
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• pp.143-147
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• 2009

In biomedical implants and dental fields, titanium has been widely utilized for excellent corrosion resistance and biocompatibility. However, Ti and its alloys are nonbioactive after being implanted in bone. In this study, for the purpose of improvement in biocompatibility the anodic $TiO_2$ layer on Ti-xNb alloys were fabricated by electrochemical method in phosphate solution, and the effect of Nb content on the pore size, the morphology and crystallinity of Ti oxide layer formed by the anodic oxidation method was investigated. The Ti containing Nb up to 3 wt%, 20 wt% and 40 wt% were melted by using a vacuum furnace. The sample were cut, polished, and homogenized for 24 hr at $1050^{\circ}C$ for surface roughness test and anodizing. Titanium anodic layer was formed on the specimen surface in an electrolytic solution of 1 M phosphoric acid at constant current densities ($30mA/cm^2$) by anodizing method. Microstructural morphology, crystallinity, composition, and surface roughness of oxide layer were observed by FE-SEM, XRD, EDS, and roughness tester, respectively. The structure of alloy was changed from $\alpha$-phase to $\beta$-phase with increase of Nb content. From XRD results, the structure of $TiO_2$ formed on the Ti-xNb surface was anatase, and no peaks of $Nb_2O_5$ or other Nb oxide were detected suggesting that Nb atoms are dispersed in $TiO_2$-based solid solution. Surface roughness test and SEM results, pore size formed on surface and surface roughness decreased as Nb content increased. From the line analysis results, intensity of Ti peak was high in the center of pore, whereas, intensity of O peak was high in the outside of pore center.

• Bulletin of the Korean Chemical Society
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• v.24 no.7
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• pp.975-980
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• 2003

The electrochemical properties and the mechanism of formation of anodic oxide films on Mg alloys containing 0-15 mass% Al, when anodized in NaOH solution, were investigated by focusing on the effects of anodizing potential, Al content, and anodizing time. The intensity ratio of Mg(OH)₂ in the XRD analysis decreased with increasing applied potential, while that of MgO increased. Mg(OH)₂ was barely detected at 80 V, while MgO was readily detected. The anti-corrosion properties of anodized specimens at each constant potential were better than those of non-anodized specimens. The specimen anodized at an applied potential of 3 V had the best anti-corrosion property. The intensity ratio of the β phase increased with aluminum content in Mg-Al alloys. During anodizing, the active dissolution reaction occurred preferentially in β phase until about 4 min, and then the current density increased gradually until 7 min. The dissolution reaction progressed in α phase, which had a lower Al content. In the anodic polarization test in 0.017 mol·$dm^{-3}$ NaCl and 0.1 mol·$dm^{-3}$ Na₂SO₄ at 298 K, the current density of Mg-15 mass% Al alloy anodized for 10 min increased, since the anodic film that forms on the α phase is a non-compacted film. The anodic film on the α phase at 30 min was a compact film as compared with that at 10 min.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.4
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• pp.237-240
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• 2016

The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

• Korean Journal of Materials Research
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• v.20 no.7
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• pp.374-378
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• 2010

$MgTiO_3$ thin films were prepared by r.f. magnetron sputtering in order to prepare miniaturized NPO type MLCCs. $MgTiO_3$ films showed a polycrystalline structure of ilmenite characterized by the appearance of (110) and (202) peaks. The intensity of the peaks decreased with an increase in the chamber pressure due to the decrease of crystallinity which resulted from the decrease of kinetic energy of the sputtered atoms. The films annealed at $600^{\circ}C$ for 60min. showed a fine grained microstructure without micro-cracks. The grain size and roughness of the $MgTiO_3$ films decreased with the increase of chamber pressure. The average surface roughness was 1.425~0.313 nm for $MgTiO_3$ films prepared at 10~70 mTorr. $MgTiO_3$ films showed a dielectric constant of 17~19.7 and a dissipation factor of 2.1~4.9% at 1MHz. The dielectric constant of the films is similar to that of bulk ceramics. The dielectric constant and the dissipation factor decreased with the increase of the chamber pressure due to the decrease of grain size and crystallinity. The leakage current density was $10^{-5}\sim10^{-7}A/cm^2$ at 200kV/cm and this value decreased with the increase of the chamber pressure. The small grain size and smooth surface microstructure of the films deposited at high chamber pressure resulted in a low leakage current density. $MgTiO_3$ films showed a near zero temperature coefficient and satisfied the specifications for NPO type materials. The dielectric properties of the $MgTiO_3$ thin films prepared by sputtering suggest the feasibility of their application for MLCCs.

• Journal of Surface Science and Engineering
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• v.38 no.2
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• pp.73-78
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• 2005

A real-time monitoring of ICP(inductively coupled plasma) assisted magnetron sputtering of MgO was carried out using a QMS(quadrupole mass spectrometer), an OES(optical emission spectrometer), and a digital oscilloscope with a high voltage probe and a current monitor. At the time of ICP ignition, the most distinct impurity was OH emission (308.9 nm) which was dissociated from water molecules. For reactive deposition oxygen was added to Ar and the OH emission intensity was reduced abruptly When the discharge voltage was regulated by a PID controller from 240V(metallic mode) to 120V(oxide mode), the emission intensity from Mg (285.2 nm) changed proportionally to the discharge voltage, but the intensity of Ar I(811.6 nm) was constant. At 100V of discharge voltage, Mg sputtering was almost stopped. Emissions from Ar I(420.1 nm) and Mg I were dropped down to 1/10, but Ar I(811.6 nm) didn't change. And the emission from atomic oxygen (O I, 777.3 nm) was increased to 10 times. These results are compatible with those from QMS study.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.09a
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• pp.72-75
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• 2001

In this paper, the $Sr_{1-x}Ca_{x}TiO_{3}(0{\leq}x{\leq}0.2)$ 2)-based grain boundary layer ceramics were fabricated to measured dielectric properties and voltage-current properties. The sintering temperature and time were $1420\sim1520^{\circ}C$, 4hours, in $N_{2}$ gas, respectively. The structural and the dielectric properties were investigated by SEM, X-ray, HP4194A and K6517. The 2nd phase formed by thermal diffusion from the surface lead to a very high apparent dielectric constant, $\varepsilon_r$ > 50000. X-ray diffraction patterns exhibited cubic structure for all specimens. Increasing content of Ca, the peak intensity were decreased.ﱇﶖ⨀ਆᘍ܀㘱㔮㠹㬅K䍄乍