• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.155-161
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• 2018

A Si chip with the Cu/Au bumps of $100-{\mu}m$ diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of $43.2m{\Omega}$. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as $36.2m{\Omega}$, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.

• Applied Chemistry for Engineering
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• v.33 no.2
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• pp.210-215
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• 2022

Two types of lignin materials with a different surface ionic character were used and polypyrrole layer was introduced on the lignin surface to obtain polypyrrole@lignin and polypyrrole@lignosulfonate composites using a simple chemical oxidation polymerization, reported in a previous article. Polypyrrole was effectively prepared regardless of the lignin type and the resulting composites were investigated using scanning electron microscope (SEM), cyclic voltammetry (CV), and impedance analysis. SEM and CV results showed that the obtained composites retained stable electrochemical properties after introduction of polypyrrole on the lignin surface. Impedance analyses showed that the surface properties of composites were dependent on lignin characteristics. In addition, the composites were embedded in agarose, an gelifying agent, to obtain conductive gels. It was found that the conductive gels possessed an electrical conductivity and also retained stable electrochemical properties, which indicated that the conductive gels might be useful for some applications.

• Membrane Journal
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• v.31 no.2
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• pp.101-119
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• 2021

The demand for clean water is virtually present in all modern human societies even as our society has developed increasingly more advanced and sophisticated technologies to improve human life. However, as global climate change begins to show more dramatic effects in many regions in the world, the demand for a cheap, effective way to treat wastewater or to remove harmful bacteria, microbes, viruses, and other solvents detrimental to human health has continued to remain present and remains as important as ever. Well-established synthetic membranes composed of polyaniline (PANI), polyvinylidene fluoride (PVDF), and others have been extensively studied to gather information regarding the characteristics and performance of the membrane, but recent studies have shown that making these synthetic membranes conductive to electrical current by doping the membrane with another material or incorporating conductive materials onto the surface of the membrane, such as allotropes of carbon, have shown to increase the performance of these membranes by allowing the adjustability of pore size, improving antifouling and making the antibacterial property better. In this review, modern electrically conductive membranes are compared to conventional membranes and their performance improvements under electric fields are discussed, as well as their potential in water filtration and wastewater treatment applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.10
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• pp.4673-4678
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• 2011

In this paper, studies on a mixing characteristic and viscosity measurement of polymer/graphite composites for a bipolar plate of the polymer electrolyte membrane fuel cell were presented. Since the materials for the bipolar plate should be electrically conductive, contents of solid graphite in the composite are very high. As a consequence, a viscosity of the polymer/graphite composite used for the bipolar plate is very high and the measurement of the viscosity is difficult. Viscosity measurements of the polymer/graphite composites were not possible because pressure drops were continuously fluctuated during the viscosity measurements when a conventional capillary die was used. After the die design was optimized, the steady state pressure drop could be achieved, but the viscosity thus measured was not reproducible. After many trials with different experimental techniques, it was found that melt blending of the grinded powder mixtures of both PET and graphite provides reproducible viscosity measurements and electric conductivities of the polymer/graphite composites.

• Polymer(Korea)
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• v.35 no.6
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• pp.543-547
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• 2011

A study has been done to enhance the mechanical properties and processability of electrically conductive polyaniline(PANI) without the polymer's structural alternation. Functionalized acid doped PANI (PANI-DBSA) was prepared by an emulsion polymerization, and dodecylbenzenesulfonic acid (DBSA) played both roles of surfactant and dopant. Also, PANI-DBSA was solution cast blended with high impact polystyrene (HIPS) to produce PANI-DBSA/HIPS blend film. The structure and electrical properties of the conducting polymer blends were observed through UV-vis and FTIR/ATR spectroscopy. A study of the blend was carried by focusing on observation of mechanical and electrical properties based on dispersibility and changes in polymer morphology. The conductivity of the blends was increased by increasing the content of PANI-DBSA, and the sudden increase of conductivity to $3.5{\times}10^{-4}$ S/cm was observed even under a low content of 9 wt%. There was a strong association of continuous network formation with percolation and conductivity in the conducting polymer blends.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.215-218
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• 1998

The thermal stability of polyaniline-camphorsulfonic acid(PANI-CSA) film was studied as a function of temperature and time. A decrease in electrical conductivity of PANI-CSA film occurred when PANI-CSA film is subjected to temperature above 60$^{\circ}C$. From the result of thermogravimetry (TG), it was thought that the deterioration in electrical conductivity of PANI-CSA film was due to evaporation of water and residual solvent.

• Proceedings of the Membrane Society of Korea Conference
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• 2004.11a
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• pp.181-185
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• 2004

• Bulletin of the Korean Chemical Society
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• v.34 no.12
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• pp.3825-3828
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• 2013

In this study, the influences of aniline to acid composition were investigated on the electrical conductivity of PANI-PAAMPSA. The ratio of aniline to sulfonic acid groups was optimized for the maximum conductivity of PANI-PAAMPSA. The conductivity is strongly correlated with the electronic structure of PANI-PAAMPSA; the highest conductivity of PANI-PAAMPSA was observed when PANI has the longest conjugation length.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.523-525
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• 2008

Inkjet printing is being considered as an alternative to the conventional lithography in the electronic industry. Surface energy control of substrate is a critical issue in controlling the dimension of microstructures by the inkjet printing. This study introduces the surface energy control of ITO substrate for in/q'et printing of PEDOT/PSS.