• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.77-77
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• 2007

The development of next generation displays such as flexible display is a major challenge. Most materials and processes in current flat panel display industry cannot be transferred to flexible substrates. Typically, indium tin oxide (ITO) thin films are brittle and need to be deposited at high temperature to achieve an optimal opto-electrical property, therefore ITO films cannot be used as a flexible electrode. Up to date, many alternative materials to ITO have been proposed such as conductive polymers, nanometals, solution deposited transparent conductive oxide(TCO) and carbon nanotubes(CNTs). CNT based transparent conductive films are fabricated on glass and polymer substrates. CNT thin films exhibit a sheet resistance ($R_s$) of nearby $10^3\;{\Omega}/sq$ with a transmittance of around 80% on the visible light range, which is attributed by excellent dispersion and interaction among CNTs, solvents and polymeric binders. This talk will present the current studies, opto-electrical properties, design criteria and its applications for CNT-based transparent conductive films.

• Design & Manufacturing
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• v.13 no.3
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• pp.1-11
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• 2019

Recently, studies on the development of flexible electronic devices by combining flexible materials and a conductor have been actively performed as interest in wearable devices. Especially, carbon nanotubes (CNT) or graphene coating have been used to construct a circuit to induce improvement in flexibility and rigidity. Various technologies have been developed in the surface coating of conductive materials, which are key to the manufacture of flexible electronic devices. Surface coating products with 3D coating and micro-patterns have been proposed through electrospinning, electrification, and 3D printing technologies. As a result of this advanced surface coating technology, there is a growing interest in manufacturing gradient conductive surfaces. Gradient surfaces have the advantage that they are adapted to apply a gentle change or to inspect optimum conditions in a particular region by imparting continuously changing properties. In this study, we propose a manufacturing technique to produce a continuous gradient conductive surface by combining a partial stretching of elastomer and a conductive material coating, and introduce experimental results to confirm its performance.

• Composites Research
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• v.17 no.5
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• pp.68-77
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• 2004

The electromagnetic (EM) absorption or shielding characteristics of a material is an important issue not only for military purpose but also for commercial purposes such as radar, electric or telecommunication devices. In order to design the effective electromagnetic wave absorber, the electromagnetic characteristics of the constituents of the material should be available in target frequency band. Also, it must be possible to predict the electromagnetic properties of absorbers with respect to the content of lossy ingredients. In this study, the dielectric properties of unsaturated polyester resins containing nano-size conductive carbon black powder were measured with a free space method in the X-band frequency range and analyzed with respect to the content of carbon black. Finally, the method for estimating the dielectric properties of polymeric resin containing conductive carbon black with respect to the EM frequency was developed and verified.

• Bulletin of the Korean Chemical Society
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• v.32 no.3
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• pp.939-942
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• 2011

Conductive carbon films were prepared at room temperature by unbalanced magnetron sputtering (UBMS) on silicon substrates using argon (Ar) gas, and the effects of post-annealing temperature on the structural, tribological, and electrical properties of carbon films were investigated. Films were annealed at temperatures ranging from $400^{\circ}C$ to $700^{\circ}C$ in increments of $100^{\circ}C$ using a rapid thermal annealing method by vacuum furnace in vacuum ambient. The increase of annealing temperature contributed to the increase of the ordering and formation of aromatic rings in the carbon film. Consequently, with increasing annealing temperature the tribological properties of sputtered carbon films are deteriorated while the resistivity of carbon films significantly decreased from $4.5{\times}10^{-3}$ to $1.0{\times}10^{-6}\;{\Omega}-cm$ and carrier concentration as well as mobility increased, respectively. This behavior can be explained by the increase of sp2 bonding fraction and ordering $sp^2$ clusters in the carbon networks caused by increasing annealing temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.320-320
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• 2007

Nowadays, ZnO thin films are investigated as transparent conductive electrodes for use in optoelectronics devices including flat displays, thin films transistors, solar cells because of their unique optical and electrical properties. For the use as transparent conductive electrodes, a film has to have low resistivity, high absorption in the ultra violent light region and high optical transmission in the visible region. Different technologies such as electron beam evaporation, chemical vapor deposition, laser evaporation, DC and RF magnetron sputtering and have been reported to produce thin films of ZnO with adequate performance for applications. However, highly transparent and conductive doped-ZnO thin films deposited by a metal-organic decomposition method have not been reported before. In this work, the effect of dopant concentration, heating treatment and annealing in areducing atmosphere on the structure, morphology, electrical and optical properties of ZnO thin films deposited on glass substrates by a Sol-gel method are investigated.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.105-108
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• 2002

Materials, matrices mixed with various kinds of conductive or magnetic powder, such as ferrite, have been used as the electromagnetic wave absorbing ones, so called RAM(radar absorbing material). The structure that does not only have electromagnetic waves absorbing property like RAM but also supports loads is called RAS(radar absorbing structure). One of the existing manufacturing process of RAS is to compound with conductive powders the glass fiber-reinforced composite with good permeability and the ability to support loads. The process, however, causes a number of problems, such as the degradation in the mechanical properties of the composite, especially, interlamina shear strength. In this study, mechanical properties of glass fabric/epoxy composite containing 7wt% carbon black powders were measured and compared with pure glass fabric/epoxy composites.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.3
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• pp.122-131
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• 2003

In this study, some characteristics of conductive and non-conductive adhesive inter-connections are derived, based on data from literature and own projects. Assembly of flip chip on flex is taken as a carrier. Potential failure mechanisms of adhesive interconnections reported in literature are reviewed. Some methods that can be used to evaluate the quality of adhesive interconnections and to evaluate their aging behavior are given. Possible finite element simulation approaches are introduced and the required critical materials properties are summarized. Response to temperature and moisture, resistance to reflow soldering and resistance to rapid change in temperature and humidity are elaborated. The effect of post cure during accelerated testing is discussed. This study shows that only a combined approach using finite element simulations, and use of appropriate experimental evaluation methods can result in revealing, understanding and quantifying the complex degradation mechanisms of adhesive interconnections during aging.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.44-49
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• 2007

Dimensionally stable anodes have been widely used to cathodically protect the metallic materials in corrosive environments including concrete structure as the insoluble anode. Lifespan of the anode for concrete construction can be determined by NACE TM0294-94 method. Lifespan of conductive oxide electrode would be affected by thermal treatment condition in the process of sol-gel coatings. This work aims to evaluate the effect of thermal treatment temperature on the lifespan of the $RuO_{2}$ electrode. $450^{\circ}C$ treated conductive oxide electrode showed the excellent properties and its lifespan was evaluated to be over 88 years in 3% NaCl, 4% NaOH, and simulated pore water. This behavior was related to the formation of $RuO_{2}$.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Journal of the Korean Ceramic Society
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• v.35 no.11
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• pp.1155-1161
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• 1998

We have studyed the surface electric resistiance for inner conductive film consisted of graphite and iron oxide by coating the conductive paint on inner face of 28" wide CRT funnel and have evaluated the working properties of 28" wide CRT according to the surface electric resistiance. We found that the viscosity of paint and the thickness of conductive film became the higher but the surface electric resistiance of con-ductive films was the lower than before in accordance with the increase of solid contents in conductive paint and that the surface condition and the surface electric resistiance of conductive films changed highly ac-cording to the drying conditions also. From these results we could get the uniform thickness and the un-iform film resistance and the optimum working property of selectric propertise in CRT when we used the conductive paint with solid contents 28% and viscosity about 13cps.