• Title/Summary/Keyword: Computer-aided Research

Search Result 516, Processing Time 0.032 seconds

Development of Schottky Diode for THz Applications using Heterogeneous Resist Patterning (이종 레지스트 패터닝을 이용한 테라헤르츠용 쇼트키 다이오드 개발)

  • Han, Min;Choi, Seok-Gyu;Lee, Sang-Jin;Baek, Tae-Jong;Ko, Dong-Sik;Kim, Jung-Il;Kim, Geun-Ju;Jeon, Seok-Gy;Yoon, Jin-Seob;Rhee, Jin-Koo
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.49 no.8
    • /
    • pp.47-54
    • /
    • 2012
  • In this paper, we have fabricated the Schottky diode for THz applications by heterogeneous resist patterning method. The Schottky diode was developed using electron beam lithography and photolithography to connect the anode and the anode pad for a simple process. The measured performance of developed Schottky diode are $11.2{\Omega}$ of series resistance, 25.96 fF of junction capacitance, 1.25 of ideality factor and 547.6 GHz of cut-off frequency.

Design of 200 GHz Waveguide to Microstrip Transition using Probe Structure (200 GHz 대역 프로브 구조의 구형도파관-마이크로스트립 변환기 설계)

  • Lee, Sang-Jin;Baek, Tae-Jong;Ko, Dong-Sik;Han, Min;Choi, Seok-Gyu;Kim, Jung-Il;Kim, Geun-Ju;Jeon, Seok-Gy;Yoon, Jin-Seob;Rhee, Jin-Koo
    • Journal of the Institute of Electronics Engineers of Korea TC
    • /
    • v.49 no.4
    • /
    • pp.47-52
    • /
    • 2012
  • We have designed the waveguide to microstrip transition using a probe structure for the center frequency of 200 GHz transceiver. The waveguide to microstrip transition is composed of probe, taper and microstrip transmission line. For design of the transition, we simulated the lengths and width of the probe and the taper to optimize the center frequency and the bandwidth using HFSS simulation tool from Ansoft. The transition is designed back-to-back structure. From the simulation results, the transition exhibits that insertion loss is below - 0.81 dB and the return loss less than -10 dB in range of 186 ~ 210 GHz.

The Effects of the Computer Aided Innovation Capabilities on the R&D Capabilities: Focusing on the SMEs of Korea (Computer Aided Innovation 역량이 연구개발역량에 미치는 효과: 국내 중소기업을 대상으로)

  • Shim, Jae Eok;Byeon, Moo Jang;Moon, Hyo Gon;Oh, Jay In
    • Asia pacific journal of information systems
    • /
    • v.23 no.3
    • /
    • pp.25-53
    • /
    • 2013
  • This study analyzes the effect of Computer Aided Innovation (CAI) to improve R&D Capabilities empirically. Survey was distributed by e-mail and Google Docs, targeting CTO of 235 SMEs. 142 surveys were returned back (rate of return 60.4%) from companies. Survey results from 119 companies (83.8%) which are effective samples except no-response, insincere response, estimated value, etc. were used for statistics analysis. Companies with less than 50billion KRW sales of entire researched companies occupy 76.5% in terms of sample traits. Companies with less than 300 employees occupy 83.2%. In terms of the type of company business Partners (called 'partners with big companies' hereunder) who work with big companies for business occupy 68.1%. SMEs based on their own business (called 'independent small companies') appear to occupy 31.9%. The present status of holding IT system according to traits of company business was classified into partners with big companies versus independent SMEs. The present status of ERP is 18.5% to 34.5%. QMS is 11.8% to 9.2%. And PLM (Product Life-cycle Management) is 6.7% to 2.5%. The holding of 3D CAD is 47.1% to 21%. IT system-holding and its application of independent SMEs seemed very vulnerable, compared with partner companies of big companies. This study is comprised of IT infra and IT Utilization as CAI capacity factors which are independent variables. factors of R&D capabilities which are independent variables are organization capability, process capability, HR capability, technology-accumulating capability, and internal/external collaboration capability. The highest average value of variables was 4.24 in organization capability 2. The lowest average value was 3.01 in IT infra which makes users access to data and information in other areas and use them with ease when required during new product development. It seems that the inferior environment of IT infra of general SMEs is reflected in CAI itself. In order to review the validity used to measure variables, Factors have been analyzed. 7 factors which have over 1.0 pure value of their dependent and independent variables were extracted. These factors appear to explain 71.167% in total of total variances. From the result of factor analysis about measurable variables in this study, reliability of each item was checked by Cronbach's Alpha coefficient. All measurable factors at least over 0.611 seemed to acquire reliability. Next, correlation has been done to explain certain phenomenon by correlation analysis between variables. As R&D capabilities factors which are arranged as dependent variables, organization capability, process capability, HR capability, technology-accumulating capability, and internal/external collaboration capability turned out that they acquire significant correlation at 99% reliability level in all variables of IT infra and IT Utilization which are independent variables. In addition, correlation coefficient between each factor is less than 0.8, which proves that the validity of this study judgement has been acquired. The pair with the highest coefficient had 0.628 for IT utilization and technology-accumulating capability. Regression model which can estimate independent variables was used in this study under the hypothesis that there is linear relation between independent variables and dependent variables so as to identify CAI capability's impact factors on R&D. The total explanations of IT infra among CAI capability for independent variables such as organization capability, process capability, human resources capability, technology-accumulating capability, and collaboration capability are 10.3%, 7%, 11.9%, 30.9%, and 10.5% respectively. IT Utilization exposes comprehensively low explanatory capability with 12.4%, 5.9%, 11.1%, 38.9%, and 13.4% for organization capability, process capability, human resources capability, technology-accumulating capability, and collaboration capability respectively. However, both factors of independent variables expose very high explanatory capability relatively for technology-accumulating capability among independent variable. Regression formula which is comprised of independent variables and dependent variables are all significant (P<0.005). The suitability of regression model seems high. When the results of test for dependent variables and independent variables are estimated, the hypothesis of 10 different factors appeared all significant in regression analysis model coefficient (P<0.01) which is estimated to affect in the hypothesis. As a result of liner regression analysis between two independent variables drawn by influence factor analysis for R&D capability and R&D capability. IT infra and IT Utilization which are CAI capability factors has positive correlation to organization capability, process capability, human resources capability, technology-accumulating capability, and collaboration capability with inside and outside which are dependent variables, R&D capability factors. It was identified as a significant factor which affects R&D capability. However, considering adjustable variables, a big gap is found, compared to entire company. First of all, in case of partner companies with big companies, in IT infra as CAI capability, organization capability, process capability, human resources capability, and technology capability out of R&D capacities seems to have positive correlation. However, collaboration capability appeared insignificance. IT utilization which is a CAI capability factor seemed to have positive relation to organization capability, process capability, human resources capability, and internal/external collaboration capability just as those of entire companies. Next, by analyzing independent types of SMEs as an adjustable variable, very different results were found from those of entire companies or partner companies with big companies. First of all, all factors in IT infra except technology-accumulating capability were rejected. IT utilization was rejected except technology-accumulating capability and collaboration capability. Comprehending the above adjustable variables, the following results were drawn in this study. First, in case of big companies or partner companies with big companies, IT infra and IT utilization affect improving R&D Capabilities positively. It was because most of big companies encourage innovation by using IT utilization and IT infra building over certain level to their partner companies. Second, in all companies, IT infra and IT utilization as CAI capability affect improving technology-accumulating capability positively at least as R&D capability factor. The most of factor explanation is low at around 10%. However, technology-accumulating capability is rather high around 25.6% to 38.4%. It was found that CAI capability contributes to technology-accumulating capability highly. Companies shouldn't consider IT infra and IT utilization as a simple product developing tool in R&D section. However, they have to consider to use them as a management innovating strategy tool which proceeds entire-company management innovation centered in new product development. Not only the improvement of technology-accumulating capability in department of R&D. Centered in new product development, it has to be used as original management innovative strategy which proceeds entire company management innovation. It suggests that it can be a method to improve technology-accumulating capability in R&D section and Dynamic capability to acquire sustainable competitive advantage.

A spectral efficient transmission method for ofdm-based power line communications (직교주파수분할다중화기반 전력선통신에서 대역 효율적인 전송기법)

  • Kim, Byung Wook
    • Journal of Korea Society of Industrial Information Systems
    • /
    • v.19 no.4
    • /
    • pp.25-32
    • /
    • 2014
  • Powerline communications (PLC) is a promising medium for network access technology where smart grid aided network services can be provided. In the presence of frequency selective fading in the PLC channel, orthogonal frequency division multiplexing (OFDM) is a technique for reliable communications. This paper presents a spectral efficient method using a superimposed hidden pilot for OFDM-based PLC systems. Based on the scheme using a hidden pilot, it is possible to estimate the channel with no consumption of bandwidth, but with utilization of power allocated to the hidden pilot. Computer simulations showed that the proposed scheme provides higher achievable data rate than that of the conventional schemes in low voltage and medium voltage transmission lines.

Heat Transfer Analysis of Bakery Machine (제과제빵기계의 열전달 해석)

  • Lee, Jong-Sun
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.13 no.10
    • /
    • pp.4405-4410
    • /
    • 2012
  • This research aims to do heat transfer analysis on multi-functional dough conditioner. The dough conditioner is a key bakery machine for the maturation of dough which is raw material of bakery and also it's amount of used has been increased. Solidworks which is one of automatic design programs is applied to design in order to manufacture the multi-functional dough conditioner, and ANSYS which is a three dimensional finite element analysis code is used for the heat transfer analysis. Inside temperatures and heat fluxes are obtained as the results of heat transfer analysis and the results are contributed significantly in manufacturing the multi-functional dough conditioner.

Characteristic Analysis on the Distribution Pattern of Discharge Signals Generated in the Power Cable (전력 케이블에서 발생되는 방전 신호의 분포패턴에 관한 특성 분석)

  • So, Soon-Youl;Hong, Kyung-Jin;Jung, Woo-Seong;Lim, Jang-Seob;Lee, Jin;Lee, Joon-Ung;Kim, Tae-Sung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.11 no.11
    • /
    • pp.1035-1042
    • /
    • 1998
  • After the 1990's, a computer-aided partial discharge(PD) measurement system was referred in part of aging diagnosis using digital signal processing as the new technology has been studied. The PD patterns and relevant information for pattern recognition are discussed in PD research area, because discharge quantity(q), the number of discharge pulse(n) and the applied boltage phase($\varphi$) was combined with the system information of the aging state. This paper investigates the discharge phase and quantity, as well as the number of discharge(n) with regard to discharge signals generated in power cable. therefore, according to characteristic analysis on the distribution of $\varphi$, q and n, it is able to apply in the aging analysis of power cable which visual observation is impossible and distribution change of discharge signals offers much information for risk degree on aging progress of insulation materials.

  • PDF

Prediction of Durability, Static and Dynamic Properties on Rubber (엔진마운트 고무부품의 내구 평가 및 동적 특성 예측)

  • Kim, Choon-Hyu;Kim, Kee-Joo;Jeong, Hyo-Tae;Kim, Cheol-Woong;Sohn, Il-Seon;Kim, Joong-Bae
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.14 no.6
    • /
    • pp.17-23
    • /
    • 2006
  • Rubber materials have the nonlinear, large deformation and viscoelastic behavior. W.D. Kim et al. studied these characteristics through the static, fatigue, dynamic, aging and viscoelastic test. This paper discussed that the properties of engine mounting rubber, such as static stiffness, fatigue life and damping factor, are predicted based on CAE by using material properties acquired by the report of Kim et al. In result, the static stiffness of engine mounting rubber is predicted approximately in comparison with test value. Also, it was confirmed that the relationship of fatigue life and Green-Lagrange strain in specimen was the valid tool to predict the fatigue life of engine mounting rubber. From the results of transient viscoelastic analysis the damping factor changed rapidly at the range less than 8hz.

New CAD Datarization Technique of Shoe Lasts for Automation of the Adaptive Lasting Machine (적응형 라스팅기의 자동화를 위한 제화용 라스트의 새로운 CAD Data화 기법)

  • Kim, S.H.;Jang, K.K.;Kim, K.P.;Huh, H.;Kwon, D.S.
    • Korean Journal of Computational Design and Engineering
    • /
    • v.6 no.1
    • /
    • pp.17-23
    • /
    • 2001
  • Lasting machines for shoe manufacturing are continuously developed with the aid of automation and CAM(Computer Aided Manufacturing). Although automation and CAM techniques have tremendously reduced the labor in shoe manufacturing, there still remain some parts manufactured by experts. In order to enhance the capability and efficiency of machines for labor-free shoe manufacturing, CAD data of a shoe last is essential. While CAD datarization takes the fundamental role in the shoe design and manufacturing, there has been little research for the CAD datarization of a shoe last. In this paper, a new procedure for CAD datarization of a shoe last using finite element patches and a tension sl)line method is proposed for application to shoe manufacturing machines. The outer line of a shoe-last sole is interpolated by a tension spline method and bonding lines are extracted from the shoe CAD data. Data set for a control algorithm of the tasting machine can be produced from the CAD data.

  • PDF

New CAD Datarization Technique of Shoe Lasts and Data Extraction Scheme for the control of the Adaptive Lasting Machine (제화용 라스트의 새로운 DAD Data화 기법 및 적응형 라스팅기의 제어를 위한 데이터 추출)

  • Kim, Seung-Ho;Jang, Kwang-Keol;Huh, Hoon
    • Proceedings of the KSME Conference
    • /
    • 2001.06c
    • /
    • pp.122-127
    • /
    • 2001
  • Lasting machines for shoe manufacturing are continuously developed with the aid of automation and Computer Aided Manufacturing (CAM). Although automation and CAM techniques have tremendously reduced the labor in shoe manufacturing field, there still remain some parts manufactured by experts. In order to enhance the capability and efficiency of machines for labor-free shoe manufacturing, CAD data of a shoe last is indispensable. While CAD datarization takes the fundamental role in the shoe design as well as the shoe manufacturing, there has been little research for the CAD datarization of a shoe last. In this paper, a new procedure for CAD datarization of a shoe last using finite element patches is proposed and some data for the control part of the shoe lasting machine are extracted and interpolated from the CAD data. The outer line of a shoe-last sole is interpolated by a tension spline method and bonding lines are extracted from the shoe CAD data. Finally, initial setting data for the lasting machine are extracted from the last CAD data and initial setup parts of the lasting machine.

  • PDF

Development of Nonlinear Static Design Sensitivity Analysis Based ANSYS (ANSYS 비선형 정적설계민감도해석 외부모듈 개발)

  • Choi, Byung-Nam;Jung, Jae-Jun;Yoo, Jung-Hoon;Lee, Tae-Hee
    • Proceedings of the KSME Conference
    • /
    • 2001.06c
    • /
    • pp.543-547
    • /
    • 2001
  • CAE has been settled down to an indispensable tool for the simulation of a mechanical system according to the development of computer-aided analysis rapidly. Particularly finite element programs have advanced to the one of most valuable things in the filed of CAE due to the remarkable progress in the implementation. But since this analysis tool mostly provides the result of the analysis, it cannot satisfy designers who are seeking for information to improve their designs. Therefore, design sensitivity analysis or optimization module has been incorporated into commercial FEA programs to satisfy the desire of designers since 1990s. Design sensitivity analysis is to compute the rate of change of response with respected to design variable. Design sensitivity analysis is classfied into static design sensitivity analysis, Eigenvalue design sensitivity analysis and dynamic design sensitivity analysis. In this research, it will be presented to nonlinear static design sensitivity analysis formulation and nonlinear static design sensitivity analysis external module based ANSYS have been developed and illustrated an example to verify the developed module.

  • PDF