• Title/Summary/Keyword: Compound Cooling

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High Temperature Deformation Behavior of Ti-Al Intermetallic Compound - Microstructure Effect (TiAl 금속간 화합물의 미세조직에 따른 고온변형특성)

  • 하태권;정재영;이광석;장영원
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.295-298
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    • 2003
  • High temperature deformation behavior of a Ti-Al intermetallic compound has been investigated. Specimens with a near gamma and a lamella structures were obtained by performing heat treatment at 1200 and 1330$^{\circ}C$, respectively, for 24 hr and stabilized at 900$^{\circ}C$ for 4 hr followed by air cooling. A series of load relaxation tests has been conducted on these samples at temperatures ranging from 850 to 950$^{\circ}C$ to construct flow curves in the strain rate range from 10$\^$-6//s to 10$\^$-3//s. Strain hardening was observed even at the temperature of 950$^{\circ}C$ in both the near gamma and the lamella structures. Further aging treatment for 12 hr at test temperatures has found to cause no softening in both microstructures.

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A study on cooling characteristics of clathrate compound for cold storage applications (저온축열용 포접화합물에 냉각특성에 관한 실험적 연구)

  • 한영옥;김진흥
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.11 no.2
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    • pp.205-214
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    • 1999
  • The objective of this paper is to investigate the thermal properties of TMA clathrate compound applicable to cold storage system for building air-conditioning. Especially, the test tube experiments are performed by comparing and analyzing the temperature of phase change, specific heat and subcooling characteristic according to the variation of density, temperature of heat source and charging quantity in TMA clathrate compound. The results are summarized as follows:1) $-15^{\circ}C$ is not proper as the temperature of heat source because the temperature of subcooling is above $8.3^{\circ}C$ 2) temperature of phase change is dropped as the temperature of heat source is lower, 3) the effect of subcooling suppression with about 8$^{\circ}C$ is confirmed when the temperature of heat source is $-10^{\circ}C$ in case of 26, 27, and 30wt%, while the temperature of subcooling is about $0^{\circ}C$ when the temperature of heat source is $-15^{\circ}C$ in case of 25, 26 and 30wt%. Thus, the effect of subcooling suppression is greater as the temperature of heat source is lower. Additionally, the concentrative study is needed on mass concentration causing the phase change without subcooling phenomenon when the temperature of heat source is $-15^{\circ}C$. Thus, it is concluded that TMA clathrate compound has enough thermal properties as the cold storage medium for building air-conditioning.

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A Study on the Analysis of Isothiazolinone Components by High Performance Liquid Chromatography (고성능액체크로마토그래피에 의한 Isothiazolinone Components의 분석에 관한 연구)

  • 김종규;이덕희
    • Journal of Environmental Health Sciences
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    • v.18 no.2
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    • pp.102-105
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    • 1992
  • Introduction : Isothiazolinone product is one of new preservatives used in cooling tower, paper mill, and general industrial waters.l) It is also effective in controlling bacteria and fungi in the manufacture and storage of dispersed pigments, such as kaolin clays, titanium dioxide, calcium carbonate and others\ulcorner Its broad-spectrum activity, excellent physical and chemical compatibility with anionic, nonionic and cationic surfactants and most organic and inorganic compounds and low toxicity at recommended use levels provide formulators with an effective, economical, and environmentally acceptable alternative to other commercial biocides. It dose not contain or generate formaldehyde and is easy to formulate (1.5% solution is supplied as an aqueous solution), so that it gains advantage over the other preservatives. The active ingredients of the isothiazolinone product are unchlorinated compound (2-methyl-4-isothiazolin-3-one) and chlorinated one (5-chloro-2-methyl-4-isothiazolin-3-one). Methods preferred for the analysis of preservatives are chromatographic methods, especially high performance liquid chromatograph (HPLC). Although several methods were satisfactory in respect to separation, no offical method has been published for the isothiazolinone components. This study was performed to search for an alternative method in order to show flexible operating conditions of HPLC and to reduce assay time.

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Beating Channel Layout Design and Evaluation Technology for SMC Molds (Sheet Molding Compound 금형의 가열채널설계 및 평가기술)

  • Heo Y. M.;Ko Y. B.;Lee J. H.;Lee S. H.
    • Transactions of Materials Processing
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    • v.14 no.3 s.75
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    • pp.263-268
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    • 2005
  • Heating channel layout design and evaluation technology for SMC molding system was investigated in this work. Traditional rules of cooling channel design in injection molding were applied to the present work. Finite element thermal analysis with $ANSYS^{TM}$ was performed to evaluate the temperature distribution of SHC mold surface. SMC mold was manufactured to evaluate the effect of a proposed heating channel layout system on the temperature distribution of SMC mold surface and infrared camera was applied to a measurement of temperature distribution. It was shown that infrared camera application was possible in a measurement of temperature distribution on SHC mold surface.

Dependence of Microstructure of Sintered $Y_3$Fe$_5$O$_{12}$ in Addition of CuO (CuO 첨가에 따른 $Y_3$Fe$_5$O$_{12}$ 소결체의 미세구조 변화)

  • 이재동;김광석;김성재;김태옥
    • Journal of the Korean Ceramic Society
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    • v.35 no.10
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    • pp.1014-1019
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    • 1998
  • As results of the study on the sinterbility of YIG at the low temperature using CuO as additive CuO com-pound which contain {{{{ { {Fe }_{2 }O }_{3 } }} was shown liquid in sintering process. YIG crystal dissolved into CuO compound liquid phase and then Y element which is considered no solubility in solid CuO compound moved to the grain during cooling. The abnormal grain growth up to 150${\mu}{\textrm}{m}$ at CuO 8.6mole% was shown due to shape accomdation reaction and local liquid distribution. The apparent density of YIG shows minimum at CuO 8.6 mole% due to abnormal grain growth and the saturation magnetization decrease dramatically at 32.5mole% due to orthoferrite formation.

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Development of 3 dimensional Automatic Polishing System (3차원 자동 연마장치의 개발)

  • ;;;Isao Shibata
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.04a
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    • pp.314-318
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    • 2002
  • Recently, new polishing tool which was made by magnetic intelligent compound(Magic) was invented. The distribution of abrasives in this new tool can be controlled by magnetic field. Therefore, we can make a special polishing tool which has well arranged abrasives after cooling. In this study, 3 dimensional polishing machine was developed in order to polish complicated - shaped inner surfaces of molds. The performance of developed machine was investigated by measuring the roughness of polished surface using new polishing tool.

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Singular Residual Stresses at Interface of Compound Cylinders

  • Lee, S.S.;Kim, T.H.;Kim, J.G.;Park, K.W.;Hwang, J.K.
    • Proceedings of the Korean Nuclear Society Conference
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    • 1996.05c
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    • pp.305-310
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    • 1996
  • This paper concerns the cladding residual stresses in a reactor vessel induced during cooling from the manufacturing temperature down to room temperature Finite element results show that very large stress gradients are present at the interface corner and such stress singularity might lead to local yielding or cladding-base metal debonding.

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Characterization and crystal growth of InP by VGF method using quartz ampoule

  • Park, E.S.;C.H. Jung;J.J. Myung;J.Y. Hong;Kim, M.K.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.6
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    • pp.542-546
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    • 1999
  • InP single crystal, III-V binary compound semiconductor, was grown by VGF(vertical gradient freeze) method using quartz ampoule and its electrical optical properties were investigated. Phosphorous powders were put in the bottom of quartz ampoule and Indium metal charged in conical quartz crucible what was attached at the upper side position inside the quartz ampoule. It was vacuous under the pressure of $10^5$Torr and sealed up. Indium metal was melted at $1070^{\circ}C$ and InP composition was formed by diffusion of phosphorous sublimated at $450^{\circ}C$ into Indium melt. By cooling the InP composition melt ($2^{\circ}C$~$5^{\circ}C$/hr of cooling rate) in range of $1070^{\circ}C$~$900^{\circ}C$, InP crystal was grown. The grown InP single crystals were investigated by X-ray analysis and polarized optical microscopy. Electrical properties were measured by Van der Pauw method. At the cooling method. At the cooling rate of $2^{\circ}C$/hr, growth direction of ingot was [111] and the quality of ingot was better at the upper side of ingot than the lower side. It was found that the InP crystals were n-type semiconductor and the carrier concentration, electron mobility and relative resistivity were $10^{15}$~$10^{16}/\textrm{cm}^3$ , $2\times 10^3$~$3\times 10^4{\textrm}{cm}^2$/Vsec and$2\times 10^{-1}$~$2\times 10^{-3}$/ Wcm in the range of 150K~300K, respectively.

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Effect of Solidification Conditions on the Structure and Mechanical Properties of Al-5wt%Mg Alloy by Metallic Mold Casting (중력 금형 주조한 Al-5wt%Mg 합금의 주조 조직과 기계적 성질에 미치는 응고 조건의 영향에 관한 연구)

  • Park, Jun-Young;Kim, Jong-Chul;Kim, Hong-Beom;Choi, Chang-Ock
    • Journal of Korea Foundry Society
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    • v.17 no.3
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    • pp.237-244
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    • 1997
  • This study has been carried out to investigate into the influence of solidification conditions mold on the structure and mechanical properties of Al-5wt%Mg alloy by metallic mold casting. The percentage of equiaxed grain of Al-5wt%Mg alloy castings increased both when pouring temperature decreased and when the low part or bottom of metallic mold was cooled. The hardness was checked and showed that hardness of outside in the castings was higher than that inside, and that it is the highest at the pouring temperature of $680^{\circ}C$. The castings had the highest U.T.S. and elongation when the bottom of metallic mold was cooled. At the same pouring temperature, the structure of castings was changed as the position of cooling parts of metallic mold was varied. When the castings were solidified through cooling of the bottom of the metallic mold, the morphology of Fe intermetallic compound has tendency to change to a Chinese script and the U.T.S. and elongation of Al-5wt.%Mg alloy castings was increased.

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The Study on the Dry Floor Tile Unit System used Resin Mat (수지매트를 이용한 바닥타일 건식공법 시스템에 관한 연구)

  • 김성식;임남기;정병훈;정재영;정상진
    • Journal of the Korea Institute of Building Construction
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    • v.1 no.2
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    • pp.185-190
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    • 2001
  • The purpose of this study is the development of practical Dry floor tile unit method that settle the defect of a wet method and designed for resin mat. With use of PE resin which is confirmed the basic property, it is developed that resin mat, joint-sealing compound with fixed form and space management to Dry floor tile unit method. The result of this study is below. 1) To acquire above the 4kgf/$\textrm{cm}^2$ - construction specification criterion, the bonding space that between resin mat and tile has to occupy the 50% of resin mat module space(10,000$\textrm{cm}^2$). 2) Criteria of bonding part plane is below. simpleness of metal form. productivity, uniform quality after injection molding cooling, easy cutting for remain space management, adhesive property, construction ability, transformation of a severed piece under pressure and so on. 3) To get the shape that could protect the interfacial breakdown, it is designed that resin mat and tile are unified after the bond input. 4) Adapted joint-sealing compound is the material of urethane kinds wedge form. Resin mat has the water passageway that could drain the water. 5) To manage the severed piece of tile, the resin mat is likely to divide the half and the quarter and the plastic drainage is developed in the severed piece.

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