• 제목/요약/키워드: Component defect Detection

검색결과 28건 처리시간 0.02초

Automatic Defect Detection from SEM Images of Wafers using Component Tree

  • Kim, Sunghyon;Oh, Il-seok
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권1호
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    • pp.86-93
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    • 2017
  • In this paper, we propose a novel defect detection method using component tree representations of scanning electron microscopy (SEM) images. The component tree contains rich information about the topological structure of images such as the stiffness of intensity changes, area, and volume of the lobes. This information can be used effectively in detecting suspicious defect areas. A quasi-linear algorithm is available for constructing the component tree and computing these attributes. In this paper, we modify the original component tree algorithm to be suitable for our defect detection application. First, we exclude pixels that are near the ground level during the initial stage of component tree construction. Next, we detect significant lobes based on multiple attributes and edge information. Our experiments performed with actual SEM wafer images show promising results. For a $1000{\times}1000$ image, the proposed algorithm performed the whole process in 1.36 seconds.

초음파 서모그라피를 이용한 빠른 PCB 결함 검출 (Fast Defect Detection of PCB using Ultrasound Thermography)

  • 조재완;정현규;서용칠;정승호;김승호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2005년도 학술대회 논문집 정보 및 제어부문
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    • pp.273-275
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    • 2005
  • Active thermography is being used since several years for remote non-destructive testing. It provides thermal images for remote detection and imaging of damages. Also, it is based on propagation and reflection of thermal waves which are launched from the surface into the inspected component by absorption of modulated radiation. For energy deposition, it use external heat sources (e.g., halogen lamp or convective heating) or internal heat generation (e.g., microwaves, eddy current, or elastic wave). Among the external heat sources, the ultrasound is generally used for energy deposition because of defect selective heating up. The heat source generating a thermal wave is provided by the defect itself due to the attenuation of amplitude modulated ultrasound. A defect causes locally enhanced losses and consequently selective heating up. Therefore amplitude modulation of the injected ultrasonic wave turns a defect into a thermal wave transmitter whose signal is detected at the surface by thermal infrared camera. This way ultrasound thermography(UT) allows for selective defect detection which enhances the probability of defect detection in the presence of complicated intact structures. In this paper the applicability of UT for fast defect detection is described. Examples are presented showing the detection of defects in PCB material. Measurements were performed on various kinds of typical defects in PCB materials (both Cu metal and non-metal epoxy). The obtained thermal image reveals area of defect in row of thick epoxy material and PCB.

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독립성분분석을 이용한 TFT-LCD불량의 검출 (Detection of TFT-LCD Defects Using Independent Component Analysis)

  • 박노갑;이원희;유석인
    • 한국정보과학회논문지:소프트웨어및응용
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    • 제34권5호
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    • pp.447-454
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    • 2007
  • 최근 TFT-LCD (Thin film transistor liquid crystal display)패널의 수요증가에 비례하여 공정상 발생하는 LCD 불량의 수도 증가하고 있다. LCD 불량은 배경화면과 미세한 밝기대비 차이를 가지는 패널상의 불균등한 영역으로서 크게 정형과 비정형으로 나누어지며 사람의 눈에 매끄럽지 않게 보여진다. 이러한 불량은 배경과의 대비 차이가 미세하여 기존의 임계수준 검출이나 윤곽선 검출로는 불량을 검출할 수 없다. 본 논문은 비정형 LCD 불량을 독립성분분석, 적응 임계수준 검출 그리고 왜도를 이용하여 검출하는 방법을 제시한다. 본 검출방법은 잡음이 심한 영상에 대해서도 대응력이 뛰어나며, 생산라인에서 성공적으로 적용된다.

초음파 서모그라피를 이용한 빠른 PCB 결함 검출 (Fast Defect Detection of PCB using Ultrasound Thermography)

  • 조재완;서용칠;정승호;김승호;정현규
    • 대한전기학회논문지:시스템및제어부문D
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    • 제55권2호
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    • pp.68-71
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    • 2006
  • Active thermography has been used for several years in the field of remote non-destructive testing. It provides thermal images for remote detection and imaging of damages. Also, it is based on propagation and reflection of thermal waves which are launched from the surface into the inspected component by absorption of modulated radiation. For energy deposition, it use external heat sources (e.g., halogen lamp or convective heating) or internal heat generation (e.g., microwaves, eddy current, or elastic wave). Among the external heat sources, the ultrasound is generally used for energy deposition because of defect selective heating up. The heat source generating a thermal wave is provided by the defect itself due to the attenuation of amplitude modulated ultrasound. A defect causes locally enhanced losses and consequently selective heating up. Therefore amplitude modulation of the injected ultrasonic wave turns a defect into a thermal wave transmitter whose signal is detected at the surface by thermal infrared camera. This way ultrasound thermography(UT) allows for selective defect detection which enhances the probability of defect detection in the presence of complicated intact structures. In this paper the applicability of UT for fast defect detection is described. Examples are presented showing the detection of defects in PCB material. Measurements are performed on various kinds of typical defects in PCB materials (both Cu metal and non-metal epoxy). The obtained thermal image reveals area of defect in row of thick epoxy material and PCB.

온라인 결함계측용 협대역 제거형 공간필터의 최적설계 및 제작 (Optical Design and Construction of Narrow Band Eliminating Spatial Filter for On-line Defect Detection)

  • 전승환
    • 한국항해학회지
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    • 제22권4호
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    • pp.59-67
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    • 1998
  • A quick and automatic detection with no harm to the goods is very important task for improving quality control, process control and labour reduction. In real fields of industry, defect detection is mostly accomplished by skillful workers. A narrow band eliminating spatial filter having characteristics of removing the specified spatial frequency is developed by the author, and it is proved that the filter has an excellent ability for on-line and real time detection of surface defect. By the way,. this spatial filter shows a ripple phenominum in filtering characteristics. So, it is necessary to remove the ripple component for the improvement of filter gain, moreover efficiency of defect detection. The spatial filtering method has a remarkable feature which means that it is able to set up weighting function for its own sake, and which can to obtain the best signal relating to the purpose of the measurement. Hence, having an eye on such feature, theoretical analysis is carried out at first for optimal design of narrow band eliminating spatial filter, and secondly, on the basis of above results spatial filter is manufactured, and finally advanced effectiveness of spatial filter is evaluated experimentally.

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교류전류를 이용한 새로운 비파괴탐상법의 개발;표면결함과 이면결함의 평가 및 실기 부재의 결함 검출 (Development of the Advanced NDI Technique Using an Alternating Current : the Evaluation of surface crack and blind surface crack and the detection of defects in a field component)

  • 김훈;임재규
    • Journal of Welding and Joining
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    • 제13권2호
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    • pp.42-52
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    • 1995
  • In the evaluation of aging degradation on the structural materials based on the fracture mechanics, the detection and size prediction of defect are very important. Aiming at nondestructive detection and size prediction ol defect with high accuracy and resolution, therefore, an lnduced Current Focusing Potential Drop(ICFPD) technique has been developed. The principle of this technique is to induce a focusing current at an exploratory region by an induction wire flowing an alternating current(AC) that is a constant ampere and frequency. Defects are assessed with the potential drops that are measured the induced current on the surface of metallic material by the potential pick-up pins. In this study, the lCFPD technique was applied for evaluating the location and size of the surface crack and blind crack made in plate specimens, and also for detecting the defects existing in valve, a field component, that were developed by SCC etc. during the service. The results of this present study show that surface crack and blind crack are able to defect with potential drop. these cracks are distinguished with the distribution of potential drop, and the crack depths can be estimated with each normalized potential drop that are parameters estimating the depth of each type crack. In the field component, the defects estimated by experiment result correspond with those in the cutting face of the measuring point within a higher sensitivity.

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주성분 분석과 이차 판별 분석 기법을 이용한 항공기 복합재료에서의 자동 결함 검출 및 분류 (Automatic Defect Detection and Classification Using PCA and QDA in Aircraft Composite Materials)

  • 김영범;신덕하;황승준;백중환
    • 한국항행학회논문지
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    • 제18권4호
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    • pp.304-311
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    • 2014
  • 본 논문에서는 항공기 복합재료 내부의 결함을 자동으로 검출하고 분류하는 초음파 검사 방식을 제안한다. 결함 검출을 위해서 초음파의 국부 최대값을 이용해 피크(peak) 값을 추출해낸다. 피크의 거리정보를 이용해 히스토그램화 하며 시편의 표면과 바닥의 백월에코(back-wall echo)를 결정한다. 이를 통해 C-scan 영상을 생성한다. 검출된 피크의 평균과 분산을 이용해 임계값을 정하고 그 값으로 결함여부를 판단한다. 결함의 종류를 구분하기 위해서는 주성분 분석(PCA; principal component analysis)와 이차 판별 분석(QDA; quadratic discriminant analysis)를 수행하였다. PCA를 통한 512개의 차원은 주성분으로 변환 시 30개의 주성분에 99% 이상의 분산이 포함되었다. 주성분 개수를 한정시킴으로써 차원 축소를 통해 계산량을 크게 줄였고 오분류를 최소화하였다. 이차 판별 분석을 적용해 결정경계(decision boundary)의 방정식을 얻었고 이를 통해 결함을 분류할 수 있음을 실험을 통해 보였다.

이중 SQI를 이용한 TFT-LCD 결함 검출 (TFT-LCD Defect Detection Using Double-Self Quotient Image)

  • 박운익;이규봉;김세윤;박길흠
    • 한국정보과학회논문지:컴퓨팅의 실제 및 레터
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    • 제14권6호
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    • pp.604-608
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    • 2008
  • TFT-LCD영상은 불균일한 휘도 변화를 어느 정도 허용하고 있으며, 영상 전반에 걸쳐 나타나는 큰 휘도 변화는 국부적으로 주변 영역과 차이가 나는 결함 영역을 찾는데 방해가 된다. SQI(Self Quotient Image)는 얼굴 인식 분야에서 저주파에 해당하는 조명성분을 제거 하는데 사용되어 왔으며, 일종의 High Pass Filter(고주파 통과 필터) 형태이다. 본 논문에서는 SQI가 신호의 저주파 성분을 평활화 하는 효과를 가지면서 국부적인 변화를 유지하는 특성을 가지는데 착안하여, TFT-LCD영상에 존재하는 결함을 강조하는 알고리즘을 제안하였다. 제안한 방법을 기존의 TFT-LCD영상 전처리 방법들과 비교하였을 때, 평활화 효과 및 결함 영역 강조 효과가 우수함을 확인할 수 있었다.

초음파 펄스 서모그라피를 이용한 세라믹 전열 판의 결함 검출 (Defect Detection of Ceramic Heating Plate Using Ultrasound Pulse Thermography)

  • 조재완;서용칠;정승호;김승호;정현규
    • 한국세라믹학회지
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    • 제43권4호
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    • pp.259-263
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    • 2006
  • The applicability of UPT (Ultrasound Pulse Thermography) for real-time defect detection of the ceramic heating plate is described. The ceramic heating plate with superior insulation and high radiation is used to control the water temperature in underwater environment. The underwater temperature control system can be damaged owing to the short circuit, which resulted from the defect of the ceramic heating plate. A high power ultrasonic energy with pulse duration of 280 ms was injected into the ceramic heating plate in the vertical direction. The ultrasound excited vibration energy sent into the component propagate inside the sample until they were converted to the heat in the vicinity of the defect. Therefore, an injection of the ultrasound pulse wave which results in heat generation, turns the defect into a local thermal wave transmitter. Its local emission is monitored and recorded via the thermal infrared camera at the surface which is processed by image recording system. Measurements were Performed on 4 kinds of samples, composed of 3 intact plates and the defect plate. The observed thermal image revealed two area of crack in the defective ceramic heating plate.

태양전지 실리콘 웨이퍼에서의 레일리기준 기반 레이저산란 패턴 분석 및 결함 검출 (Investigation of Laser Scattering Pattern and Defect Detection Based on Rayleigh Criterion for Crystalline Silicon Wafer Used in Solar Cell)

  • 연정승;김경범
    • 한국정밀공학회지
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    • 제28권5호
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    • pp.606-613
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    • 2011
  • In this paper, patterns of laser scattering and detection of micro defects have been investigated based on Rayleigh criterion for silicon wafer in solar cell. Also, a new laser scattering mechanism is designed using characteristics of light scattering against silicon wafer surfaces. Its parameters are to be optimally selected to obtain effective and featured patterns of laser scattering. The optimal parametric ranges of laser scattering are determined using the mean intensity of laser scattering. Scattering patterns of micro defects are investigated at the extracted parameter region. Among a lot of pattern features, both maximum connected area and number of connected component in patterns of laser scattering are regarded as the important information for detecting micro defects. Their usefulness is verified in the experiment.