• Journal of the Korean institute of surface engineering
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• v.37 no.6
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• pp.326-334
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• 2004

Deposit charateristics of Electroless nickel(EN) were investigated with various complexing agents. As expected, the deposition rate of nickel is increased with pH and that of Phosphorous is decreased with pH. The result of SEM investigation shows that the rough surface crystallization is appeared with pH. It is show that the surface resistance of EN deposit is decreased with pH at 85$^{\circ}C$.

• Journal of the Korean institute of surface engineering
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• v.48 no.1
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• pp.1-6
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• 2015

Amino-carboxyl acid as a complexing agent in acid copper sulfate solution was utilized to improve the adhesion of immersion copper layer for steel wire. According to the tape test results, regardless of alloy composition of the wire, the adhesion of immersion copper layer was improved with the addition of amino-carboxyl acid. The incorporation of H and Fe in the plating layer was analyzed by TOF-SIMS. The H and Fe were detected at the entire coating layer without any addition of amino-carboxyl acid. However, with addition of amino-carboxyl acid, the H and Fe were scarcely detected at the coating layer.

• Journal of the Korean institute of surface engineering
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• v.47 no.5
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• pp.215-220
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• 2014

Electrodeposition behaviors of Pd-Ni alloys were investigated from the polarization curves in a solution containing ethylenediamine as complexing agent. The microstructure and hardness of electrodeposited Pd-Ni alloys were also characterized. Codeposition of Pd-Ni alloys was successfully performed in the wide current density ranging from 2 to $5000A{\cdot}m^{-2}$ because the deposition potential of Pd became close to that of Ni in the ethylenediamine-contained solution. It was also found from X-ray diffraction patterns that the solid solution between Pd and Ni was formed with variation of the composition of alloys. The measured hardness of Pd-Ni alloys increased with increasing the contents of Ni due to solid solution strengthening and grain refinement. The electrodeposited Pd-Ni alloys also exhibited a crack free smooth surface morphology from the SEM observation.

• Journal of the Korean institute of surface engineering
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• v.33 no.2
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• pp.126-134
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• 2000

This study investigated the bath compositions and plating conditions and crystal structure used for achieving nickel-thallium-phosphorus deposits by means electroless plating. The electroless nickel-thallium-phosphorus deposits were achieved with a bath using sodium hypophosphite as the reducing agent and sodium citrate as the complexing agent. The depositing rate was 10.5mg.$cm^{2-1}$ .$hr^{-1 }$ from the optimistic bath composition, 0.1M nickel sulfate, 0.005M thallium sulfate, 0.2M sodium hypophosphite, and 0.05M sodium citrat and the recommended plating conditions, pH 5.5 and $90^{\circ}C$. The composition of alloy deposits determined by X-ray analysis (EDS) that the Thallium was increased with major increasing concentration of complexing agent and thallium ion in bath solution, it decreased according to the increasing concentrations of reduction agent in the bath solution, Bit Phosphorus showed a contrary to the thallium. It was observed from X-ray diffraction analysis, Scanning Electron Microscopy and Transmission Electron Microscopy. The crystalline structure of deposits was amorphous at the first deposited state but it was changed $Ni-T1-Ni_{5}$ $P_2$ polycrystalline when subjected to 1 hour heat treatment of more than $350^{\circ}C$. TEM observation demonstrated that the microstructure was identical to the result of the XRD at as deposited but it became $Ni-Tl-Ni_{5}$ $P_2$ polycrystalline when heated. And grain size was 10-50nm.

• Journal of the Korean institute of surface engineering
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• v.19 no.4
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• pp.140-148
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• 1986

Using sodium pyrophoshate as complexing agent, the characteristics and the magnetic properties of the films deposited from electroless cobalt plating bath have been studied. The result obtained are as following; 1. It was found that the optimum bath compositions consisted of 0.1M cobalt sulfate, 0.2M sodium hypophosphite as reducing agent, 0.4M sodium pyrophosphate as complexing agent and 0.5M ammonium sulfate as buffer agent, whereas good operating conditions were the bath of pH 10.5 adjusted with ammonia and 70$^{\circ}C$ of bath temperature, respectively. 2. The coercive force and the squareness of magnetic films were increased with deposition from the low temperature bath. 3. The phosphorous content in Co-P films deposited from these bath was relatively higher than that from Brenner bath. It was assumed to be due to codeposition of phosphorous from the pyrophosphate anion in the solution.

• Journal of the Korean institute of surface engineering
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• v.36 no.4
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• pp.317-323
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• 2003

The effect of additives such as complexing agents, stabilzers and boric acid on the bath stability and the deposition rate of electroless black Ni-Zn plating has been examined. The deposits obtained became black and showed an amorphous structure. The significant increasing in the deposition rate was not found when only glycine and citric acid were used as complexing agents. The deposition rate increased up to 3 and 4 times by adding malic acid and glycolic acid as an additional complexing agent, respectively. The stabilizers and the boric acid, however, had little influence on the deposition rate.

• Current Photovoltaic Research
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• v.1 no.1
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• pp.44-51
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• 2013

For preparing a device-quality $CuInSe_2$ (CISe) light-absorbing layer by single-bath electrodeposition for a superstrate-type CISe cell, morphological properties of the CISe layers were investigated by varying concentrations of sulfamic acid and potassium biphthalate, complexing/buffering agents. CISe films were grown on an $In_2Se_3$ film by applying a constant voltage of -0.5V versus Ag/AgCl for 90 min in a solution with precursors of $CuCl_2$, $InCl_3$, and $SeO_2$, and a KCl electrolyte. A dense and smooth layer of CISe could be obtained with a solution containing both sulfamic acid and potassium biphthalate in a narrow concentration range of combination. A CISe layer prepared on the $In_2Se_3$ film with proper concentrations of complexing/buffering agents exhibited thickness of $1.6{\sim}1.8{\mu}m$ with few undesirable secondary phases. On the other hand, when the bath solution did not contain either sulfamic acid or potassium biphthalate, a CISe film appeared to contain undesirable flake-shape $Cu_{2-x}Se$ phases or sparse pores in the upper part of film.

• Journal of the Korean institute of surface engineering
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• v.30 no.2
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• pp.104-110
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• 1997

Conventional hexavlent chromium electroplating baths deposit the matal at low cathode efficiency and have poor covering and throwing power. The processs also generate hazardous wastes. To overcome many of the disadvantages of hexavalent chromium plating the use of trivalent chromium has advocted. After Yoshida, who first studied trivalent chromium plating, using ammonium sulfate and urea, there are numerous report describing the trivalent chromium electropating process using complexing agents. This study investigaten trivalent chromium plating electrolyte solutious containing formate as a complexing agent and ammouim chloride for conducting agent. The effects of composition and operating conditions on deposits and current efficiencies were investigated in trivalent chromium plating baths by analyzing the relationship pulse conditions and surface morphology The surface morphology of the deposits was observed by SEM. pulse electrolysis has been effective on obtaining a smooth with high current efficiency comparing with D.C. electrolysis in trivalent chromium solution.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.102-102
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• 2003

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.80-80
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• 2003