• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.122-134
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• 1994

Design of a heuristic algorithm for high level synthesis of multichip architecture is presented in this paper. Considering the design constraints: individual chip area, I/O pin counts, chip-to-chip interconnection counts, interchip communication delay, and chip latecy, the proposed system automatically generates pipelined multichip architectures from behavioral descriptions. For efficient mulichip synthesis, a new methodology is proposed, which performs partitioning and schedulting of SFG into multichip architectures simultaneously. Experimental results for several benchmark programs show that the systems can be used for designing multichip hardware efficiently.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.53 no.3
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• pp.129-133
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• 2004

As In DS/CDMA(direct sequence code division multiple access) system, the system capacity is limited by multiple access interference(MAI), and self-interference(SI) resulting from the multi-path propagation of the desired user signal. This paper, which the approximated analytic chip waveforms are nearly the same as the computer generated chip waveforms are shown. And then, the BER(Bit Error Rate) performances in CDMA system using the approximated analytic chip waveforms are shown.

• ETRI Journal
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• v.32 no.6
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• pp.969-971
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• 2010

Based on a de-embedding technique, a new method is proposed which is capable of evaluating chip impedance behavior over absorbed power in flip-chip bonded UHF radio frequency identification transponder ICs. For the de-embedding, four compact co-planar test fixtures, an equivalent circuit for the fixtures, and a parameter extraction procedure for the circuit are developed. The fixtures are designed such that the chip can absorb as much power as possible from a power source without radiating appreciable power. Experimental results show that the proposed modeling method is accurate and produces reliable chip impedance values related with absorbed power.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.18 no.4
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• pp.160-164
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• 2004

In DS/CDMA(direct sequence code division multiple access) system using the approximated analytic chip waveforms are applied. Proposed chip waveforms are classified into 2 types: uniform chip waveforms with uniform envelope and non-uniform chip waveforms with non-uniform envelope. It has confirmed that the similarity of the approximated analytical chip waveforms is compared using chip waveforms, envelope, phase, correlation, and bandwidth properties.

• Journal of Institute of Control, Robotics and Systems
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• v.12 no.6
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• pp.530-538
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• 2006

DSP chip parameters of a digital hearing aid (HA) should be optimally selected or fitted for hearing impaired persons. The more precise parameter fitting guarantees the better compensation of the hearing loss (HL). Digital HAs adopt DSP chips for more precise fitting of various HL threshold curve patterns. A specific DSP chip such as Gennum GB3211 was designed and manufactured in order to match up to about 4.7 billion different possible HL cases with combination of 7 limited parameters. This paper deals with a digital HA fitting program which is developed for optimal fitting of GB3211 DSP chip parameters. The fitting program has completed features from audiogram input to DSP chip interface. The compensation effects of the microphone and the receiver are also included. The paper shows some application examples.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.34 no.8C
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• pp.806-813
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• 2009

This paper presents a modem chip design for high-speed wireless communications. Among the high-speed communication technologies, we design the UWB (Ultra-Wideband) modem SoC (System-on-Chip) Chip based on a MB-OFDM scheme which uses wide frequency band and gives low frequency interference to other communication services. The baseband system of the modem SoC chip is designed according to the standard document published by WiMedia. The SoC chip consists of FFT/IFFT (Fast Fourier Transform/Inverse Fast Fourier Transform), transmitter, receiver, symbol synchronizer, frequency offset estimator, Viterbi decoder, and other receiving parts. The chip is designed using 90nm CMOS (Complementary Metal-Oxide-Semiconductor) procedure. The chip size is about 5mm x 5mm and was fab-out in July 20th, 2009.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.4
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• pp.68-75
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• 2016

As the number of cores and IPs increase in multiprocessor system-on-chip (MPSoC), network-on-chip (NoC) has emerged as a promising novel interconnection architecture for its parallelism and scalability. However, minimization of the latency in NoC with legacy bus IPs must be addressed. In this paper, we focus on the latency minimization problem in NoC which accommodates legacy bus protocol based IPs considering the trade-offs between hop counts and path collisions. To resolve this problem, we propose separated address/data network for independent address and data phases of bus protocol. Compared to Mesh and irregular topologies generated by TopGen, experimental results show that average latency and execution time are reduced by 19.46% and 10.55%, respectively.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.8 no.3
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• pp.81-86
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• 2008

The paradigm of information & communication is rapidly changed into ubiquitous environment based electromagnetic wave, and antenna technology in the wireless ubiquitous communication is remarkably developed. Mini chip antenna has its within small card compared to the external AP antenna. Designed and Fabricated WLAN antenna has a broadband characteristics of 2.4~2.5GHz and 4.9~5.85GHz, and can be used triple mode of IEEE 802.11.a,g.b, and it has comparatively a constant performance in the dual frequency band.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.5
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• pp.393-396
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• 2018

Herein, a 94-GHz low-noise amplifier (LNA) using the 65-nm CMOS process is presented. The LNA is composed of a four-stage differential common-source amplifier and impedance matching is accomplished with transformers. The fabricated LNA chip shows a peak gain of 25 dB at 94 GHz and has a 3-dB bandwidth at 5.5 GHz. The chip consumes 46 mW of DC power from a 1.2-V supply, and the total chip area, including the pads, is $0.3mm^2$.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.2
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• pp.29-35
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• 1998

This paper describes architectures and design of a SIMD type parallel image processing chip called SliM-II. The chiphas a linear array of 64 processing elements (PEs), operates at 30 MHz in the worst case simulation and gives at least 1.92 GIPS. In contrast to existing array processors, such as IMAP, MGAP-2, VIP, etc., each PE has a multiplier that is quite effective for convolution, template matching, etc. The instruction set can execute an ALU operation, data I/O, and inter-PE communication simulataneously in a single instruction cycle. In addition, during the ALU/multiplier operation, SliM-II provides parallel move between the register file and on-chip memory as in DSP chips, SliM-II can greatly reduce the inter-PE communication overhead, due to the idea a sliding, which is a technique of overlapping inter-PE communication with computation. Moreover, the bandwidth of data I/O and inter-PE communication increases due to bit-parallel data paths. We used the COMPASS$^{TM}$ 3.3 V 0.6.$\mu$m standrd cell library (v8r4.10). The total number of transistors is about 1.5 muillions, the core size is 13.2 * 13.0 mm$^{2}$ and the package type is 208 pin PQ2 (Power Quad 2). The performance evaluation shows that, compared to a existing array processors, a proposed architeture gives a significant improvement for algorithms requiring multiplications.s.