• Polymer(Korea)
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• v.31 no.2
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• pp.160-167
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• 2007

This paper proposes a model for the solutions predicting the coefficient of thermal expansion of composites including fiber-like shaped$(a_1>a_2=a_3)$ and disk-like shaped$(a_1=a_2>a_3)$ inclusions like two dimensional geometries, which was analyzed by one axis and a single aspect ratio, $(\rho_\alpha=a_1/a_3)$. The analysis follows the procedure developed for elastic moduli by using the Lee and Paul's approach. The effects of the aspect ratio on the coefficient of thermal expansion of composites containing aligned isotropic inclusions are examined. This model should be limited to analyze the composites with unidirectionally aligned inclusions and with complete binding to each other of both matrix and inclusions having homogeneous properties. The longitudinal coefficients of thermal expansion $\alpha_{11}$ decrease and approach the coefficient of thermal expansion of filler, as the aspect ratios increase. However, the transverse coefficients of thermal expansion $\alpha_{33}$ increase or decrease with the aspect ratios.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.191-192
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• 2006

The deformation under radial pressure of rectangular dies for metal powder compaction has been investigated by FEM. The explored variables have been: aspect ratio of die profile, ratio between diagonal of the profile and die height, insert and ring thickness, radius at die corners, interference, different insert materials, i. e. conventional HSS, HSS from powders, cemented carbide (10% Co). The analyses have ascertained the unwanted appearance of tensile normal stress on brittle materials, also "at rest", and even some dramatic changes of stress patterns as the die height increases with respect to the rectangular profile dimensions. Different materials behave differently, mainly due to difference of thermal expansion coefficients. Profile changes occur when the dies are heated up to the temperature required for warm compaction. The deformation patterns depend on compaction temperature and thermal expansion coefficients.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Journal of the Korean institute of surface engineering
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• v.35 no.5
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• pp.289-294
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• 2002

ZnTe films have been grown on (100) GaAs substrate with two representative problems. The one is lattice mismatch, the other is thermal expansion coefficients mismatch of ZnTe /GaAs. It claims here, the relationship of film thickness and defects distribution with (100) ZnTe/GaAs using hot wall epitaxy (HWE) growth was investigated by transmission electron microscopy (TEM). It analyzed on the two-sort side using TEM with cross-sectional transmission electron microscopy (XTEM) and high-resolution electron microscopy (HREM). Investigation into the nature and behavior of dislocations with dependence-thickness in (100) ZnTe/ (100) GaAs hetero-structures grown by transmission electron microscopy (TEM). This defects range from interface to 0.7 $\mu\textrm{m}$ was high density, due to the large lattice mismatch and thermal expansion coefficients. The defects of low density was range 0.7$\mu\textrm{m}$~1.8$\mu\textrm{m}$. In the thicker range than 1.8$\mu\textrm{m}$ was measured hardly defects.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.2
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• pp.67-84
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• 1991

This study was carried out to investiagate the residual stress caused by the mismatch of thermal expansion and the bond failure resistance of alloy-porcelain specimens. The thermal expansions of alloys and porcelains were measured by using a straight push-rod dilatometer. Porcelain glass transition temperatures, thermal expansion coefficients, and thermal compatibility indices were derived from length-versus-temperature curves. Strain gauges were used to experimentally determine the Young's moduli of porcelains, the residual stresses of porcelain surface, and tensile bond strengths of the specimens of simulated porcelain metal crown. The obtained results were as follows: 1. The coefficients of thermal expansion for alloys were the minimum of $13.53\mu/^{\circ}C$ and the maximum of $20.11\mu/^{\circ}C$ in the range of $100\sim600^{\circ}C$ and those for porcelains were the minimum of $7.72\mu/^{\circ}C$ and the maximum of $31.24\mu/^{\circ}C$ in the range of $100\sim500^{\circ}C$. 2. The glass transition temperature of porcelains exhibited the same value without my relation to the healing rate, and the thermal disharmony of porcelain and alloy was more affected by porcelains than by the alloys. 3. The Young's moduli of body porcelains were larger than those of opaque porcelains(P<0.01) 4. It seemed that the residual stresses of porcelain surfaces in the porcelainalloy systems were more affected by porcelains than by alleys. 5. The bond strengths of the procelain-base metal alloy systems were larger than those of the porcelain-precious metal alloy systems. The fracture strengths of porcelain surfaces showed significant difference between porcelains (P<0.05).

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.73-76
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• 2002

This study developed SiC/Al composites for electronic packaging to which reinforcements were added with the volume fractions of 49%, 56% and 63% by the squeeze casting method. 0.8 wt.% of the inorganic binder as well as the $Al_2O_3$ fiber and SiC particles with the volume fraction of 1:10 were added to the SiC/Al composites For the produced SiC/Al composites, the CTEs (coefficients of thermal expansion) were measured from 30 to $300^{\circ}C$ and compared with the FEM numerical simulation to analyze the temperature dependent properties. The experiment showed the CTEs of SiC/Al composites that were intermediate values of those of Rule of Mixture and Turner's Model. The CTEs were close to Turner's Model in the room temperature and approached the Rule of Mixture as the temperature increases. These properties analyzed from the difference of the average stress acting between the matrix and the reinforcements proposed in this study

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03b
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• pp.42-42
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• 2010

We have characterized the previously undescribed parameters for engineering the electrical properties of single-walled carbon nanotube (SWCNT) films for technological applications. The surface tension of the top coating passivation material and matching coefficients of thermal expansion for the substrate and carbon nanotube network are two crucial parameters for the fabrication of reliable and highly conductive single-walled carbon nanotube network thin films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.278-278
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• 2010

We have characterized the previously undescribed parameters for engineering the electrical properties of single-walled carbon nanotube (SWCNT) films for technological applications. The surface tension of the top coating passivation material and matching coefficients of thermal expansion for the substrate and carbon nanotube network are two crucial parameters for the fabrication of reliable and highly conductive single-walled carbon nanotube network thin films.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.3
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• pp.538-550
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• 2004

The convection heat transfer coefficients on the top surface of a large liquid petroleum liquid injection(LPLi) engine piston with the oil gallery are analyzed by solving an inverse thermal conduction problem. The heat transfer coefficients are numerically found so that the difference between analyzed temperatures from the finite element method and measured temperatures is minimized. Using the resulting heat transfer coefficients as the boundary condition, temperature of a large LPLi engine piston is analyzed. With varying cooling water temperature, temperature, stress, and thermal expansion of the piston are analyzed and evaluated.

• Nuclear Engineering and Technology
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• v.55 no.12
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• pp.4685-4694
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• 2023

The ability to calculate the material density sensitivity coefficients of power with respect to the material density has broad application prospects for accelerating Monte Carlo-Thermal Hydraulics iterations. The second-order material density sensitivity coefficients for the general Monte Carlo score have been derived based on the differential operator sampling method in this paper, and the calculation of the sensitivity coefficients of cell power scores with respect to the material density has been realized in continuous-energy Monte Carlo code RMC. Based on the power-density sensitivity coefficients, the sensitivity coefficients of power scores to some other physical quantities, such as power-boron concentration coefficients and power-temperature coefficients considering only the thermal expansion, were subsequently calculated. The effectiveness of the proposed method is demonstrated in the power-density coefficients problems of the pressurized water reactor (PWR) moderator and the heat pipe reactor (HPR) reflectors. The calculations were carried out using RMC and the ENDF/B-VII.1 neutron nuclear data. It is shown that the calculated sensitivity coefficients can be used to predict the power scores accurately over a wide range of boron concentration of the PWR moderator and a wide range of temperature of HPR reflectors.