• Korean Journal of Materials Research
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• v.33 no.3
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• pp.101-105
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• 2023

A mixture of elemental Co₅₀Si₅₀ powders was subjected to mechanical alloying (MA) at room temperature to prepare a CoSi thermoelectric compound. Consolidation of the Co₅₀Si₅₀ mechanically alloyed powders was performed in a spark plasma sintering (SPS) machine using graphite dies up to 800 ℃ and 1,000 ℃ under 50 MPa. We have revealed that a nanocrystalline CoSi thermoelectric compound can be produced from a mixture of elemental Co₅₀Si₅₀ powders by mechanical alloying after 20 hours. The average grain size estimated from a Hall plot of the CoSi intermetallic compound prepared after 40 hours of MA was 65 nm. The degree of shrinkage of the consolidated samples during SPS became significant at about 450 ℃. All of the compact bodies had a high relative density of more than 94 % with a metallic glare on the surface. X-ray diffraction data showed that the SPS compact produced by sintering mechanically alloyed powders for 40-hours up to 800 ℃ consisted of only nanocrystalline CoSi with a grain size of 110 nm.

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.05a
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• pp.59-59
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• 1996

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.2
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• pp.122-130
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• 1996

In an effort to learn more about the reaction mechanisms which lead to the compound nucleation at the interface of cobalt and silicon, electrical noise properties has been investigated for cobalt thin films deposited on silicon substrates by the electron beam evaporation and rf sputtering techniques. Microstructural variations at the Co/Si interfaces have been observed by transmission electronmicroscopy. Amorphous structures are observed at the Co/Si interfaces for samples whose cobalt thicknesses are less than 4nm and a polycrystalline compound nucleation has been occurred for thicker films. 1/f noise power same samples, and the spetral density has been normalized. The amplitude of 1/f noise power spectral density shows a gradual increase as the cobalt thickness is increased, and the amplitude has dropped abruptly after the compound nucleation. The variations of the noise parameters areassumed to be an indiction of the phase transformation along the nucleation reaction path, and amplitude has been interpreted as instabilities of the Co/Si interfacial structures.

• Electronics and Telecommunications Trends
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• v.32 no.6
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• pp.8-16
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• 2017

In this paper, we review studies attempting to triumph over the limitation of Si-based semiconductor technologies through a heterogeneous integration of high mobility compound semiconductors on a Si substrate, and the co-integration of electronic and/or optical devices. Many studies have been conducted on the heterogeneous integration of various materials to overcome the Si semiconductor performance and obtain multi-purpose functional devices. On the other hand, many research groups have invented device fusion technologies of electrical and optical devices on a Si substrate. They have co-integrated Si-based CMOS and InGaAs-based optical devices, and Ge-based electrical and optical devices. In addition, chip and wafer bonding techniques through TSV and TOV have been introduced for the co-integration of electrical and optical devices. Such intensive studies will continue to overcome the device-scaling limitation and short-channel effects of a MOS transistor that Si devices have faced using a heterogeneous integration of Si and a high mobility compound semiconductor on the same chip and/or wafer.

• Korean Journal of Materials Research
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• v.13 no.2
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• pp.88-93
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• 2003

Co/Ti bilayer structure in Co salicide process helps to the improvement of device speed by lowering contact resistance due to the epitaxial growth of $CoSi_2$layers. We investigated the epitaxial growth and interfacial mass transport of $CoSi_2$layers formed from $150 \AA$-Co/Ti structure with two step rapid thermal annealing (RTA). The thicknesses of Ti layers were varied from 20 $\AA$ to 100 $\AA$. After we confirmed the appropriate deposition of Ti film even below $100\AA$-thick, we investigated the cross sectional microstructure, surface roughness, eptiaxial growth, and mass transportation of$ CoSi_2$films formed from various Ti thickness with a cross sectional transmission electron microscopy XTEM), scanning probe microscopy (SPM), X-ray diffractometery (XRD), and Auger electron depth profiling, respectively. We found that all Ti interlayer led to$ CoSi_2$epitaxial growth, while $20 \AA$-thick Ti caused imperfect epitaxy. Ti interlayer also caused Co-Ti-Si compounds on top of $CoSi_2$, which were very hard to remove selectively. Our result implied that we need to employ appropriate Ti thickness to enhance the epitaxial growth as well as to lessen Co-Ti-Si compound formation.

• Korean Journal of Materials Research
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• v.8 no.6
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• pp.484-492
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• 1998

The formation mechanism of the epitaxial cobalt silicide from Co/Ti/OOO) Si structure has been investigated. The transition temperature of CoSi to CoSi, was found to increase with increasing the Ti interlayer thickness, which may be owing to the occupation of the tetrahedral sites by Ti atoms in the CoSi crystal structure as well as the blocking effect of the Ti interlayer on the diffusion of Co. Also, the Co- Ti-O ternary compound formed at the metal! Si interface at the begining of silicidation, which seems to play an important role in epitaxial growth of Co silicide. The final layer structures obtained after a rapid thermal annealing of the Cot Ti/( 100) Si bi-layer structure turned out to be Ti oxide/Co- Ti-Si/epi-$CoSi_2$/OOO)

• Journal of the Korean Society for Precision Engineering
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• v.29 no.9
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• pp.931-937
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• 2012

In this study, we assessed environmental impacts of compound humidifiers using environmental life cycle assessment and presented the ways to improvements in energy consumption of them. We found eco-design parameters and $CO_2$-eq emissions in each stage of raw material acquisition, manufacturing, transportation, use and disuse in life cycle of the compound humidifiers. The highest $CO_2$ emission is found to be in the stage of use among all stages of life cycle, which is mainly due to power consumption in thermal heating of heating coil for sterilization during humidification. The power consumption and $CO_2$ emission in the stage of use can be reduced to 1/4 and 1/3 at the highest estimate through improvement of sterilization method, respectively. We suggested the replacement of conventional thermal heating coil by ultra violet light-emitting diodes (UV-LED) for sterilization and then presented the experimental results on the sterilization effects of UV-LEDs.

• Journal of Magnetics
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• v.16 no.3
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• pp.318-321
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• 2011

A new Fe-based amorphous compound powder was prepared from Fe-Si-B amorphous powder by crushing amorphous ribbons as the first magnetic component and Fe-Cr-Mo metallic glassy powder by water atomization as the second magnetic component. Subsequently by adding organic and inorganic binders to the compound powder and cold pressing, the new Fe-based amorphous compound powder cores were fabricated. This new Fe-based amorphous compound powder cores combine the superior DC-Bias properties and the excellent core loss. The core loss of 500 kW/$m^3$ at $B_m$ = 0.1T and f = 100 kHz was obtained When the mass ratio of FeSiB/FeCrMo equals 3:2, and meanwhile the DC-bias properties of the new Fe-based amorphous compound powder cores just decreased by 10% compared with that of the FeSiB powder cores. In addition, with the increasing of the content of the FeCrMo metallic glassy powder, the core loss tends to decrease.

• Journal of the Korea Concrete Institute
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• v.18 no.1 s.91
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• pp.57-64
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• 2006

The crack presented in concrete structures causes a structural defect, the durability decrease, and external damages etc. Therefore, it is necessary to improve durability through the effort to control the crack. Fluosilicic acid($H_2SiF_6$) is recovered as aqueous solution which absorbs $SiF_4$ produced from the manufacturing of industrial-graded $H_3PO_4$ or HF. Generally, fluosilicates prepared by the reaction between $H_2SiF_6$ and metal salts. Addition of fluosilicates to cement endows odd properties through unique chemical reaction with the fresh and hardened cement. Mix proportions for experiment were modulated at 0.45 of water to cement ratio and $0.0{\sim}2.0%$ of adding ratio of fluosilicate salt based inorganic compound. To evaluate correlation of concrete strength and adding ratio of fluosilicate salt based inorganic compound, the tests were performed about design strength(21, 24, 27 MPa) with 0.5% of adding ratio of fluosilicate salt based inorganic compound. Applications of fluosilicate salt based inorganic compound to reduce cracks resulted from plastic and drying shrinkage, to improve durability are presented in this paper. Durability was evaluated as neutralization, chloride ion penetration depth, freezing thawing resistant tests and weight loss according reinforcement corrosion. It is ascertained that the concrete added fluosilicate salt based inorganic compound showed m ability to reduce the total area and maximum crack width significantly as compared non-added concrete. In addition, the durability of concrete improved because of resistance to crack and watertightness by packing role of fluosilicate salt based inorganic compound obtained and pozzolanic reaction of soluble $SiO_2$ than non-added concrete.

• Journal of the Semiconductor & Display Technology
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• v.7 no.2
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• pp.1-5
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• 2008

Silicide formation process and the formation sequence were investigated in this study. It was postulated that the formation of the second silicide phase involves glass formation between the first silicide phase and Si given that a thin metal film is deposited on a Si substrate. The concentration of glass was assumed to be located where the free energy of the liquid alloy with respect to the first nucleated compound and solid Si (${\Delta}$G') is most negative. It was also mentioned that the glass concentration is close to the composition of the second phase in order to achieve the maximum energy degradation. It was shown that the minimum ${\Delta}$G' concentration can be estimated by interpolating the portion of the liquidus where the liquid alloy is in equilibrium with the two solid constituents, namely the first compound phase and Si, thereby forming a hypothetical eutectic.