• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.20 no.5
• /
• pp.923-930
• /
• 2016

Various pipes are used in the many industrial field such as water supply, drainage system and marine plants, so a maintenance of these pipes is essential. Especially, the maintenance of the piping in the industrial field, some professional staffs enter and clean the pipe. If the professional staffs can not enter and clean the pipe, the workers has to use the method of inserting a scraper connected to wire inside the pipe. However, this method demands huge budget and causes a number of problems such as traffic congestion. To solve these problems, pipe cleaning robot has been researching and developing. Many Pipe cleaning robots have a problem, that is impossible to confirm the operating condition of the robot in a real time. This paper suggest pipe cleaning robot with RS-485 which transmit operating and cleaning condition of robot and inner pipe filmed by camera, that user can check.

• Applied Chemistry for Engineering
• /
• v.29 no.2
• /
• pp.229-236
• /
• 2018

A customized cleaning agent was investigated for improving the performance decreased by the pollution of collecting plates in an electric fume collector (EFC) which was developed and applied for the purification of effluent gas including oil mist from the textile industry. The pollutants on the surface of collecting plates were blackened by the condensation of oil mist for a long time and difficult to remove by general cleaning agents. The composition of an optimized cleaning agent consisted of alkali, alcohol, glycol and non-ionic surfactant sources was determined by considering the pollutant properties and effect on the damage of the basic metal of collecting plate and so on. The developed cleaning agent solution diluted by 9.1% was applied to the field test, and also the pollutants strongly adhered on collecting plate surfaces were successfully removed by a simple spraying method. The effluent gas purification efficiency of EFC increased significantly by cleaning of collecting plates.

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.45 no.5
• /
• pp.44-51
• /
• 2008

UV lamp systems have been used for cleaning of display panels of TFT LCD or Plasma Display Panel (PDP). However, the needs for high efficient cleaning and low cost made high voltage plasma cleaning techniques to be developed and to be improved. Dielectric-Barrier Discharges (DBDs), also referred to as barrier discharges or silent discharges have been exclusively related to ozone generation for a long time. In this paper, a 6kW high voltage plasma power supply system was developed for LCD cleaning. The 3-phase input voltage is rectified and then inverter system is used to make a high frequency pulse train, which is rectified after passing through a high-power transformer. Finally, hi-directional high voltage pulse switching circuits are used to generate the high voltage plasma. Some experimental results showed the usefulness of atmospheric plasma for LCD panel cleaning.

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.15 no.1
• /
• pp.19-26
• /
• 2005

In previous report, we presented that petroleum based solvents used in dry cleaning shop was almost similar to stoddard solvent defined by ACGIH and NIOSH, and the occupational exposure standard of stoddard solvent could be used in total exposure assessment of those solvents. The specific aim of the this study was to evaluate of the solvent exposure used in commercial dry cleaning shops by using occupational exposure standard of stoddard solvent. We conducted first survey of 8 self-employed dry cleaning shops and 5 factory type dry cleaning shops from July to August, and second survey of the same shops from October to November in 2002. The exposure concentration to the solvent during loading and unloading activity of vented dry cleaning machine was 489.2ppm(GM), 270.3ppm(GM), respectively, which was almost excursion limit(500ppm) of ACGIH, and exceed the ceiling limit(312ppm) of NIOSH. The time-weighted average (TWA) worker exposure to the solvent was 21.3ppm(GM) at self-employed shops, 20.7ppm(GM) at factory type shops on first survey, and 31.1ppm(GM), 33.7ppm(GM), respectively on second survey. The TWA exposure concentration of workers with spotting and cleaning machine operating job was 25.4ppm(GM), which was 2.9 times higher than the TWA exposure concentration, 8.8ppm(GM) of press workers. All TWA exposure concentrations was lower than OEL(100ppm) of stoddard solvent. We found that the most heavy exposure process at dry cleaning was loading, unloading process, and the vent of dry cleaning machine was the main emission source for workers exposure to petroleum based solvent.

• Journal of the Korea Society of Computer and Information
• /
• v.25 no.4
• /
• pp.37-45
• /
• 2020

The development process of deep learning is an iterative task that requires a lot of manual work. Among the steps in the development process, pre-processing of learning data is a very costly task, and is a step that significantly affects the learning results. In the early days of AI's algorithm research, learning data in the form of public DB provided mainly by data scientists were used. The learning data collected in the real environment is mostly the operational data of the sensors and inevitably contains various noises. Accordingly, various data cleaning frameworks and methods for removing noises have been studied. In this paper, we proposed a method for detecting and removing noises from time-series data, such as sensor data, that can occur in the IoT environment. In this method, the linear regression method is used so that the system repeatedly finds noises and provides data that can replace them to clean the learning data. In order to verify the effectiveness of the proposed method, a simulation method was proposed, and a method of determining factors for obtaining optimal cleaning results was proposed.

• Corrosion Science and Technology
• /
• v.9 no.6
• /
• pp.276-280
• /
• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.33 no.2
• /
• pp.171-187
• /
• 2023

Objectives: Aircraft cabin cleaning work is characterized by being performed within a limited time in a narrow and enclosed space. The objective of this study was to evaluate the exposure levels to dust, ultra fine dust(PM2.5) and black carbon(BC) among aircraft cabin cleaners. Methods: Active personal air sampling for respirable dust(n=73) and BC(n=47) was conducted during quick transit cleaning(cabin general and vacuum-specific) and seat cover replacement and total dust and PM2.5 were area-air-sampled as well. Also, size distribution of particle was identified with the cleaning workers targeted. Dusts were collected with PVC filters using gravimetric analysis. The concentration of PM2.5 and the particle size distribution were measured with real-time direct reading portable equipment using light scattering analysis. The concentration of BC was measured by aethalometer(filter-based real-time light absorption analysis instrument). Results: The geometric mean of respirable dust was the highest at vacuum cleaning as 74.4 ㎍/m³, following by replacing seat covers as 49.3 ㎍/m³ and cabin general cleaning as 47.8 ㎍/m³ . The arithmetic mean of PM2.5 was 4.83 ~ 9.89 ㎍/m³ inside the cabin, and 28.5~44.5 ㎍/m³ outside the cabin(from bus and outdoor waiting space). From size distribution, PM_2.5/PM₁₀ ratio was 0.54 at quick transit cleaning and 0.41 at replacing seat covers. The average concentration of BC was 2~7 ㎍/m³, showing a high correlation with the PM2.5 concentration. Conclusions: The hazards concentration levels of aircraft cabin cleaners were very similar to those of roadside outdoor workers. As the main source of pollution is estimated to be diesel vehicles operating at airports, and it is necessary to replace older vehicles, strengthen pollutant emission control regulations, and introduce electric vehicles. In addition, it is necessary to provide as part of airport-inftastructure a stable standby waiting space for aircraft cabin cleaners and introduce a systematic safety and health management system for all workers in the aviation industry.

• Proceedings of the Korea Information Processing Society Conference
• /
• 2002.04a
• /
• pp.631-634
• /
• 2002

In this paper we improved that hump occurrence by increased oxidation thickness, and control field oxide recess$(\leq20nm)$, wet oxidation etch time(19HF, 30sec), STI nitride wet cleaning time(99 HF, 60sec + P 90min) and gate pre-oxidation cleaning time(U10min+19HF, 60sec) to prevent hump occurring at STI channel edge.

• Journal of the Korea Society for Simulation
• /
• v.11 no.1
• /
• pp.23-30
• /
• 2002

An STI(Shallow Trench Isolation) by using a CMP(Chemical Mechanical Polishing) process has been one of the key issues in the device isolation[1] In this paper we fabricated N, P-MOSFEET tall analyse hump characteristics in various rounding oxdation thickness(ex : Skip, 500, 800, 1000$\AA$). As a result we found that hump occurred at STI channel edge region by field oxide recess. and boron segregation(early turn on due to boron segregatiorn at channel edge). Therefore we improved that hump occurrence by increased oxidation thickness, and control field oxide recess( 20nm), wet oxidation etch time(19HF,30sec), STI nitride wet cleaning time(99HF, 60sec+P 90min) and fate pre-oxidation cleaning time (U10min+19HF, 60sec) to prevent hump occurring at STI channel edge.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.15 no.6
• /
• pp.479-485
• /
• 2002

We have investigated the effects of various wafers cleaning on glass/Si bonding using 4 inch Pyrex glass wafers and 4 inch silicon wafers. The various wafer cleaning methods were examined; SPM(sulfuric-peroxide mixture, $H_2SO_4:H_2O_2$ = 4 : 1, $120^{\circ}C$), RCA(company name, $NH_4OH:H_2O_2:H_2O$ = 1 : 1 : 5, $80^{\circ}C$), and combinations of those. The best room temperature bonding result was achieved when wafers were cleaned by SPM followed by RCA cleaning. The minimum increase in surface roughness measured by AFM(atomic force microscope) confirmed such results. During successive heat treatments, the bonding strength was improved with increased annealing temperatures up to $400^{\circ}C$, but debonding was observed at $450^{\circ}C$. The difference in thermal expansion coefficients between glass and Si wafer led debonding. When annealed at fixed temperatures(300 and $400^{\circ}C$), bonding strength was enhanced until 28 hours, but then decreased for further anneal. To find the cause of decrease in bonding strength in excessively long annealing time, the ion distribution at Si surface was investigated using SIMS(secondary ion mass spectrometry). tons such as sodium, which had been existed only in glass before annealing, were found at Si surface for long annealed samples. Decrease in bonding strength can be caused by the diffused sodium ions to pass the glass/si interface. Therefore, maximum bonding strength can be achieved when the cleaning procedure and the ion concentrations at interface are optimized in glass/Si wafer direct bonding.