• 한국응용과학기술학회지
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• 제14권2호
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• pp.115-122
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• 1997

The field of printing use to pressurization ink using screen gassamer that is called screen printing. Existing cleaning solvent using screen printing are the organic solvents including aromatic compounds carried with poisonous and stench. Besides, cleaning method of current screen printing are for the most part mixed cleaning method of dipping and polish. Using 1,1,1-TCE, CFC-113 alternative system cleaning solvent be substituted for existing cleaning solvent against screen printing ink measured the cleaning efficiency according to gravimetric analysis method and property change of gassamer according to Image Analyzer. Also, Cleaning process system carry with excellent cleaning efficiency studied which was proposed new cleaning process including ultrasonic and vibration cleaning process be substituted for existing mixed cleaning method of dipping and polish.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.139-144
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• 2011

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.

• 한국응용과학기술학회지
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• 제16권3호
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• pp.237-240
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• 1999

This study showed that the optimized cleaning process using non-aqueous cleaning solvents is adaptable in the industrial field for existing 1.1.1-TCE cleaning solvents which is an ozone depleting sustance. Alternative cleaning solvent system substituted for existing cleaning solvent against non-aqueous pollutants(cutting & flux oil), was evaluated for the cleaning efficiency using gravimetric analysis method and surface change of sample by Image analyzer. The results showed that alternative solvents and process had excellent cleaning efficiency.

• 한국레이저가공학회지
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• 제4권2호
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• pp.39-45
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• 2001

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning Performance and time-resolved optical diagnostics are Performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• 한국전기전자재료학회논문지
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• 제22권2호
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• pp.114-118
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• 2009

PVA (polyvinyl alcohol) brush cleaning method is a typical cleaning method for semiconductor cleaning process especially post-CMP cleaning. PVA brush contacts with the wafer surface and abrasive particle, generating the contact rotational torque of the brush, which is the removal mechanism. The brush rotational torque can overcome theoretically the adhesion force generated between the abrasive particle and wafer by zeta potential. However, after CMP (chemical mechanical polishing) process, many particles remained on the wafer because the brush was contaminated in previous post-CMP cleaning step. The abrasive particle on the brush redeposits to the wafer. The level of the brush contamination increased according to the cleaning run time. After cleaning the brush, the level of wafer contamination dramatically decreased. Therefore, the brush cleanliness effect on the cleaning performance and it is important for the brush to be maintained clearly.

• 한국기계가공학회지
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• 제15권1호
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• pp.8-13
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• 2016

The micro drill bit automatic regrinding in-line system is a system that refurbishes drill bits used in a PCB manufacturing process. This system is able to refurbish drill bits with a minimum size of ø0.15-0.075mm that have previously been discarded. Beyond the conventional manual cleaning process using ultrasound, this system adopts a water jet cleaning system, making it capable of cleaning drill bits with a minimum size of ø0.15-0.075mm. This paper analyses various contact pressures applied to the surface of drill bits depending on the shooting pressure of the cleaning device and fluid velocity in order to optimize the nozzle location and to detect structural instability caused by the contact pressures.

• 한국레이저가공학회지
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• 제12권4호
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• pp.17-25
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• 2009

The surface cleaning method based on the laser-induced breakdown (LIB) of gas and subsequent plasma and shock wave generation can remove small particles from solid surfaces. In the laser shock cleaning (LSC) process, a high-power laser pulse induces optical breakdown of the ambient gas above the solid surface covered with contaminant particles. The subsequently created shock wave followed by a high-speed flow stream detaches the particles. In this work, a novel surface cleaning process using laser-induced breakdown of liquid is introduced and demonstrated. LIB of a micro liquid jet increases the shock wave intensity and thus removes smaller particle than the conventional LSC method. Experiments demonstrate that the cleaning force and cleaning efficiency are also increased significantly by this method.

• International Journal of Naval Architecture and Ocean Engineering
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• 제4권4호
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• pp.335-352
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• 2012

An underwater hull cleaning robot can be a desirable choice for the cleaning of large ships. It can make the cleaning process safe and economical. This paper presents a hydrodynamic design of an underwater cleaning robot and its evaluation for an underwater ship hull cleaning robot. The hydrodynamic design process of the robot body is described in detail. Optimal body design process with compromises among conflicting design requirements is given. Experimental results on the hydrodynamic performance of the robot are given.

• 전자공학회논문지 IE
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• 제48권2호
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• pp.47-51
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• 2011

본 논문은 LCD등에 사용되는 유리기판 가공 과정에서 표면에 발생하는 이물질을 제거하기 위한 세정 시스템을 제안한다. 이 세정 공정 시스템은 알카리 전해수의 화학적 세정과 과열 수증기 시스템의 물리적 세정방법을 사용한 세정, 린스, 건조 공정으로 구성된다. 또한 세정 시스템에서 사용되는 알카리 전해수의 화학적 세정효과를 실험을 통해, 알카리 전해수의 세정 효과와 과열 수증기 시스템의 제거효과를 보인다.

• 청정기술
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• 제16권2호
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• pp.103-116
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• 2010

평면 판넬 디스플레이(FPD)산업 중 액정표시장치(LCD) panel 시장은 계속 성장하고 있으며, 대형화와 생산은 해마다 증가하고 생산기술은 향상되고 있다. FPD의 제조공정은 고도의 청정성이 요구되는 공정으로 제조공정 중 세정공정이 30~40%를 차지할 정도로 기술적 생산성 측면에서 매우 중요하다. 그 중 액정주입 후 잔류하는 액정은 미세갭에 잔류하여 제거하기 매우 어렵다. 본 연구에서는 대체세정제의 원료로 많이 이용되고 있는 glycol ether계 용제, glycol dimethyl ether계 용제, 그리고 비이온계면활성제를 사용하여 우수한 세정력, 린스력, 침투력을 갖고 배선에 영향을 주는 이온함량을 최소화한 수계세정제를 개발하여 액정주입 후에 사용되는 panel의 액정 세척에 적용해 보았다. 이에 따라 배합성분들의 혼합비에 따른 세정제의 물성, 세정 효율 및 헹굼성을 측정하여 보았다. 실험 결과에 따르면, 배합세정제는 기존의 세정제보다 높은 습윤지수와 높은 운점을 보였다. 그리고 세정제의 주용제의 구조변화와 오염물로서 액정의 종류에 따라 세정효율이 영향을 미치고 있음이 확인되었다. 또한 최적의 배합세정제는 기존의 세정제에 비하여 동등이상의 세정력을 보여주었고 헹굼성능도 훨씬 우수하였다.