• Journal of Power System Engineering
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• v.20 no.1
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• pp.30-35
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• 2016

The objective of this study is to investigate the physicochemical properties of the catalysts and the feasibility of remanufacturing them after removing ash in CDPF using a cleaning agent KOH. Compared with the carbon oxidation ability of fresh CDPF, that of de-ashed CDPF had an insignificant difference due to the low activation energy of CO and $CO_2$. As ash deposited in CDPF was de-ashed with KOH, it had a practical feasibility on remanufacturing point of view, but washcoat was melted about 26%. Further studies were required for the prevention of washcoat loss.

• Journal of Power System Engineering
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• v.19 no.1
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• pp.83-89
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• 2015

A ball strainer screen module, which is used for a condenser tube cleaning system, is a critical mechanical component for maintaining condenser cleanliness. Despite of this importance, not many research have been focused on this module because of its relatively low usage. Employing CFD, this study examines the implication of fluid velocity change and blockage ratio on the ball strainer screen velocity and the static pressure distribution. Through this study, the impact of blockage in the space between ball strainer screen modules is verified. Also, it is found that the ranges of non-dimensional velocity distribution and static pressure distribution decrease as blockage ratio becomes smaller.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.305-310
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• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

• Journal of the Korean Society of Visualization
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• v.19 no.3
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• pp.123-129
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• 2021

Many plants and animals in nature have superhydrophobic surfaces. This superhydrophobic surface has various properties such as self-cleaning, moisture collection, and anti-icing. In this study, the superhydrophobic properties of PTFE surface were treated by plasma etching. There were four important factors that changed the surface properties. Micro-sized protrusions were formed by plasma etching. The most influential parameter was RF Power. The contact angle of the pristine PTFE surface was about 113.8°. The maximum contact angle of the surface after plasma treatment with optimized parameters was about 168.1°. In this case, the sliding angle was quite small about 1°. These properties made it possible to remove droplets easily from the surface. To verify the self-cleaning effect of the surface, graphite was used to contaminate the surface and remove it with water droplets. Graphite particles were easily removed from the optimized surface compared to the pristine surface. As a result, a surface having water repellency and self-cleaning effects could be produced with optimized plasma etching parameters.

• Proceedings of the Korean Nuclear Society Conference
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• 2004.10a
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• pp.785-786
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• 2004

• Proceedings of the Korean Society of Laser Processing Conference
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• 2002.11a
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• pp.65-67
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• 2002

• Clean Technology
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• v.17 no.4
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• pp.306-313
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• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.

• Journal of The Korean Society of Agricultural Engineers
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• v.61 no.4
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• pp.63-73
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• 2019

Coastal and fishing facilities are gradually deteriorating in function due to the continual accumulation of soil sediments, which has affected local economic activities. Currently, there are many methods to remove soil sediments, but these methods are either a temporary solution or require a repetitive removal of the soil sediments, which is a huge financial burden for the maintenance of the facilities. To solve these problems, this study proposed a non-power soil cleaning system and evaluated field applicability by carrying out field model tests. The conditions for the evaluation focused on the drainage-elapsed time and drainage-outflow velocity according to the water level change in the water tank. In the field test, silty clay and sand were separately installed, and sedimentation soil removal test was practiced. As a result, the system was verified to have a sufficient outflow velocity for the removal of soil sediments. In addition, a generalization equation that can be used in different regions of the tide was suggested in this study. These results will greatly contribute to removing soil sediments in ports and dike gate facilities on the southwest coast. Since the system is an eco-friendly technology that does not require additional energy, thus it is expected to contribute to maintenance of sustainable facility performance as well as economic effect in the future.

• Korean Journal of Materials Research
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• v.6 no.8
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• pp.817-824
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• 1996

Removal of Cu impurities on Si substrates using remote H-plasma was investigated. Si substrates were intentionally contaminated by 1ppm ${CuCI}_{2}$, standard chemical solution. To determine the optimal process condition, remote H-plasma cleaning was conducted varying the parameters of rf power, cleaning time and remoteness(the distance between the center of plasma and the surface of Si substrate). After remote H-plasma cleaning was conducted, Si surfaces were analysed by TXRF(total x-ray reflection fluorescence) and AFM(atomic force microscope). The concentration of Cu impurity was reduced by more than a factor of 10 and its RMS roughness was improved by more than 30% after remote H-plasma cleaning. TXRF analysis results show that remote H-plasma cleaning is effective in eliminating Cu impurity on Si surface when it is performed under the optimal process condition. AFM analysis results also verifies that remote H-plasma cleaning makes no damage to the Si surface. The deposition mechanism of Cu impurity may be explained by the redox potential(oxidation-reduction reaction potential) theory. Based on the XPS analysis results we could draw a conclusion that Cu impurities on the Si substrate are removed together with the oxide by a "lift-off" mechanism when the chemical oxide( which forms when Cu ions are adsorbed on the Si surface) is etched off by reactive hydrogen atoms.gen atoms.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10a
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• pp.73-78
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• 1990

As a preliminary study for the application of robots in electrical power company, several case studies in foreign countries, such as a substation patrol robot, a robot for nuclear power facilities, an insulator cleaning robot and a robot system for live-distribution line works, have been carried out for the application of robots. Various application fields, application-related problems, technical difficulties, and the feasibility of applications are studied.