• Korean Journal of Materials Research
• /
• v.25 no.9
• /
• pp.462-467
• /
• 2015

Pellicle is defined as a thin transparent film stretched over an aluminum (Al) frame that is glued on one side of a photomask. As semiconductor devices are pursuing higher levels of integration and higher resolution patterns, the cleaning of the Al flame surface is becoming a critical step because the contaminants on the Al flame can cause lithography exposure defects on the wafers. In order to remove these contaminants from the Al frame, a highly concentrated nitric acid ($HNO_3$) solution is used. However, it is difficult to fully remove them, which results in an increase in the Al surface roughness. In this paper, the pellicle frame cleaning is investigated using various cleaning solutions. When the mixture of sulfuric acid ($H_2SO_4$), hydrofluoric acid (HF), hydrogen peroxide ($H_2O_2$), and deionized water with ultrasonic is used, a high cleaning efficiency is achieved without $HNO_3$. Thus, this cleaning process is suitable for Al frame cleaning and it can also reduce the use of chemicals.

• Clean Technology
• /
• v.3 no.2
• /
• pp.57-73
• /
• 1997

Metal cleaning process is a technology which removes oil, dust and soil etc. on the surface of metal utilizing cleaning agents. These contaminants disturb the following processes such as plating and painting etc. if they are not removed. Thus, metal cleaning is typically an environmentally hazardous activity. Until recently, vapor degreasers as utilizing chlorinated solvents have been relatively cheap, extraordinarily versatile and waste disposal costs have been perceived as insignificant. Today, however, it is readily apparent that Industry's reliance upon chlorinated solvents as metal cleaners have resulted in a myriad of environmental, health and safety concerns. Therefore, this paper studies on a parameter and a sort of the alternative cleaning agents for the optimum cleaners. Also, a great deal of effort has been devoted to developing alternative metal cleaning technologies in advanced countries and some processes are being commercialized among them. We are going to consider alternative aqueous cleaning agents replacing organic chlorinated solvents and to pursue a domain application through a successful improvement case.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.139-144
• /
• 2011

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.

• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.37 no.3
• /
• pp.17-22
• /
• 2005

The cleaning efficiency of papermaking felt which is contaminated with fiber fines and various micro-materials was investigated and compared between the application of enzyme and commercial detergent. It was found that the cleaning efficiency by the treatment of acidic-based detergent was more efficient than that of alkaline-based one in the conventional commercial detergent. it was also observed that the treatment design of first acidic-based detergent treatment to second alkaline-based detergent procedure was better in the cleaning efficiency, compared to alkaline based-to-acidic based one. The cleaning property of felt with enzyme was resulted in good cleaning efficiency, without any addition of surfactant. Especially, the enzyme treatment under alkaline condition (pH 10) showed a better cleaning result than that under acidic condition(pH 5). The addition of nonionic surfactant to the enzyme increased the cleaning efficiency of felt and decreased the cationic demand of wastewater. These results showed more favour than the application of conventional commercial detergent.

• Safety and Health at Work
• /
• v.6 no.4
• /
• pp.345-352
• /
• 2015

Background: Goal-oriented communication of risk of hazards is necessary in order to reduce risk of workers' exposure to chemicals. Adequate training of workers and enterprise priority setting are essential elements. Cleaning enterprises have many challenges and the existing paradigms influence the risk levels of these enterprises. Methods: Information on organization and enterprises' prioritization in training programs was gathered from cleaning enterprises. A measure of enterprises' conceptual level of importance of chemical health hazards and a model for working out the risk index (RI) indicating enterprises' conceptual risk level was established and used to categorize the enterprises. Results: In 72.3% of cases, training takes place concurrently with task performances and in 67.4% experienced workers conduct the trainings. There is disparity between employers' opinion on competence level of the workers and reality. Lower conceptual level of importance was observed for cleaning enterprises of different sizes compared with regional safety delegates and occupational hygienists. Risk index values show no difference in risk level between small and large enterprises. Conclusion: Training of cleaning workers lacks the prerequisite for suitability and effectiveness to counter risks of chemical health hazards. There is dereliction of duty by management in the sector resulting in a lack of competence among the cleaning workers. Instituting acceptable easily attainable safety competence level for cleaners will conduce to risk reduction, and enforcement of attainment of the competence level would be a positive step.

• Journal of Conservation Science
• /
• v.10 no.1 s.13
• /
• pp.10-20
• /
• 2001

Since the feasibility for the application of laser to the conservation of artworks had been demonstrated by John F. Asmus at 1972 it was known from many experiments that laser cleaning technology Provided superior characteristics over conventional cleaning methods based on mechanical and chemical actions. Then, the research and development of the cleaning technology was carried out strongly in Europe and many successful cleaning applications such as stone, painting, stained glass, paper, leather, and metal have been reported. However this is not familiar as a cleaning tool in the restoration of artworks in oriental countries including Korea. Therefore, this article aims to introduce a laser cleaning technology and its characteristics for the applications to art restoration. The contents in this article include general principles and characteristics of laser, the introduction of laser cleaning technology, and real laser applications for artwork restoration.

• International Journal of Advanced Culture Technology
• /
• v.3 no.2
• /
• pp.25-33
• /
• 2015

This study aims to synthesis the self-cleaning fibers. The nano-titanium dioxide ($TiO_2$) were blend with the polypropylene (grade 561R) at 1wt%, 3wt%, 5wt%, 10wt%, 15wt% and 20wt%. The $TiO_2$-fibers were obtained from single screw extruder. The mechanical, thermal, rheology and self-cleaning properties were also investigated. The results showed that the tensile strength of the $nTiO_2$-PP fibers decreased with increasing of the amount of $TiO_2$. The presents of the $TiO_2$ in the PP fibers significantly showed the improving of the self-cleaning properties under sunlight and 20 watt of UV radiation. The $TiO_2$-PP fibers in presents of $TiO_2$ 20wt% showed the best results of self-cleaning under 5 hours of the sunlight which the similar results were found under 5 hours of 20 watts of UV radiation.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.10
• /
• pp.1023-1028
• /
• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.61 no.1
• /
• pp.94-98
• /
• 2012

The behavior of ozone micro bubble cleaning system was investigated to evaluate the solution as a new method of solar cell wafer cleaning in comparison with former conventional RCA cleaning. We have developed the ozone dissolution system in the ozonated water for more efficient cleaning conditions. The optimized cleaning conditions for solar cell wafer process were 10 ppm of ozone concentration and 12 minutes in cleaning periods, respectively. We have confirmed the cleaning reliability and cell efficiencies after ozone micro bubble cleaning. Using this new cleaning technology, it was possible to obtain higher efficiency, higher productivity, and fast tact time for applying cleaning in the fields on bare ingot wafer, LED wafers as well as the solar cell wafer.

• Air Cleaning Technology
• /
• v.18 no.4 s.71
• /
• pp.82-84
• /
• 2005