• 공기청정기술
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• 제20권4호통권79호
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• pp.44-79
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• 2007

• 공기청정기술
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• 제21권1호통권80호
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• pp.52-55
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• 2008

• 공기청정기술
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• 제11권1호통권40호
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• pp.27-35
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• 1998

• 공기청정기술
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• 제21권2호
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• pp.79-79
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• 2008

• 공기청정기술
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• 제15권3호통권58호
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• pp.92-93
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• 2002

• 반도체디스플레이기술학회지
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• 제11권3호
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• pp.7-11
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• 2012

Among various wet cleaning methods, megasonic and jet spray gained their popularity in single wafer cleaning process for the efficient removal of particulate contaminants from the wafer surface. In the present study, we evaluated these two cleaning methods for particle removal efficiency (PRE) and pattern damage on the aluminum layered wafer surface. Also the effect of $CO_2$ dissolved water in jet spray cleaning is assessed by measuring PRE. It is observed that the jet spray cleaning process is more effective in terms of PRE and pattern damage compared to megasonic cleaning and the mixing of $CO_2$ in the water during jet sprays further increases the PRE. We believe that the outcome of the present study is useful for the semiconductor cleaning process engineers and researchers.

• 한국응용과학기술학회지
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• 제41권1호
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• pp.19-26
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• 2024

Recently, separation membranes have been applied to fields such as water supply, sewage treatment, gray water reuse, and air pollution control. Chemical cleaning technology is attracting attention among the methods of reusing these expensive separation membranes. It was found that the separation membrane could be regenerated using chemical cleaning. Specifically, it was found that the use time of the separation membranes regenerated by chemical cleaning was sustainable for more than 1,700 hours. Additionally, it was found that the flux recovery ratio after chemical cleaning was maintained at least 60%. In addition, the flux recovery ratio of HYDREX 4710, an organic membrane cleaner, and 4703, an inorganic membrane cleaner, was 76% and 62%, respectively, showing the highest flux recovery ratio among the chemicals used. Considering that the target raw water of this study is biological secondary treatment water, it was suggested that chemical cleaning could be actively used to regenerate separation membranes in future water treatment.

• 청정기술
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• 제11권3호
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• pp.129-139
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• 2005

불소 화합물인 TFEA (2,2,2-trifluoroethanol)와 HFE (hydrofluoroether)는 분자 내에 염소를 함유하지 않으므로 오존층을 파괴하지 않으며, HFC, HCFC계 세정제에 비하여 지구온난화 영향력도 낮고, 탄화수소계 세정제보다 열적으로 안정하여 차세대 CFC 대체세정제로 주목받고 있다. 이에 따라 본 연구에서는 CFC-113, 1,1,1-TCE, HCFC-141b 등의 오존파괴물질인 염소계 세정제와 차세대 대체세정제인 TFEA, HFE-7100, HFE-7200의 물성과 세정력을 비교 평가하고, 현재 대체세정제로사용하고 있는 IPA, methanol과의 물성, 세정력을 비교 평가하였다. 또한, TFEA를 기초로 하여 alcohols, HFEs와의 혼합 비수계세정제를 제조하고, 이들의 물리적 성질과 세정력을 측정하여 불소계 화합물의 대체세정제로서의 활용가능성을 평가하였다. 그 결과, TFEA와 HFEs는 현재 주요 기간산업에서 사용하는 다양한 오염물지릉 세정에서 염소계 세정제에 비하여 낮은 세정능력을 보여주었지만, 불소를 함유한 화합물이므로 불소함유 오일의 제거에는 우수한 세정력을 보였다. 또한 TFEA와 alcohols 또는 HFEs를 혼합하여 사용함으로써 플럭스와 절삭유에 대한 세정력을 100%까지 향상시킬 수 있어 불소계 화합물을 적절한 용제 또는 첨가제와 혼합하여 혼합세정제로 사용하면, 세정능력이 우수하고 환경친화적인 비수계세정제를 개발할 수 있을 것으로 기대되었다.

• Membrane and Water Treatment
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• 제12권1호
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• pp.1-9
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• 2021

This study optimized the chemical cleaning process of discarded RO membranes for reuse in less demanding separation processes. The effect of physicochemical parameters, including the temperature, cleaning time, pH of the cleaning solution, and addition of additives, on the cleaning process was investigated. The membrane performance was evaluated by testing the flux recovery rate and salt rejection before and after the cleaning process. High temperatures (45-50 ℃) resulted in a better flux recovery rate of 71% with more than 80% salt rejection. Equal time for acid and base cleaning 3-3 h presented a 72.43% flux recovery rate with salt rejection above 85%. During acid and base cleaning, the best results were achieved at pH values of 3.0 and 12.0, respectively. Moreover, 0.05% concentration of ethylenediaminetetraacetic acid presented 72.3% flux recovery, while 69.2% flux was achieved using sodium dodecyl sulfate with a concentration of 0.5%; both showed >80% salt rejection, indicating no damage to the active layer of the membrane. Conversely, 0.5% concentration of sodium percarbonate showed 83.1% flux recovery and 0.005% concentration of sodium hypochlorite presented 85.2% flux recovery, while a high concentration of these chemicals resulted in oxidation of the membrane that caused a reduction in salt rejection.

• 한국재료학회지
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• 제24권8호
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• pp.429-433
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• 2014

As the fabrication technology used in FPDs(flat-panel displays) advances, the size of these panels is increasing and the pattern size is decreasing to the um range. Accordingly, a cleaning process during the FPD fabrication process is becoming more important to prevent yield reductions. The purpose of this study is to develop a FPD cleaning system and a cleaning process using a two-phase flow. The FPD cleaning system consists of two parts, one being a cleaning part which includes a two-phase flow nozzle, and the other being a drying part which includes an air-knife and a halogen lamp. To evaluate the particle removal efficiency by means of two-phase flow cleaning, silica particles $1.5{\mu}m$ in size were contaminated onto a six-inch silicon wafer and a four-inch glass wafer. We conducted cleaning processes under various conditions, i.e., DI water and nitrogen gas at different pressures, using a two-phase-flow nozzle with a gap distance between the nozzle and the substrate. The drying efficiency was also tested using the air-knife with a change in the gap distance between the air-knife and the substrate to remove the DI water which remained on the substrate after the two-phase-flow cleaning process. We obtained high efficiency in terms of particle removal as well as good drying efficiency through the optimized conditions of the two-phase-flow cleaning and air-knife processes.