• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1240-1247
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• 2003

Water jet nozzle for LCD has been used as a wet cleaning process in many industries. It is necessary for the nozzle to consider cleaning effect and flux. In this paper, we applied the bubble dynamic theory(Rayleight-Plesset equation) to improve the cleaning efficiency. Generally, Rayleigh-Plesset equations for cavitation bubbles are used in analyzing computer simulation for caviting flows. Burst of bubbles causes potential energies and we can use these energies to remove organic and inorganic compounds on the LCD. Therefore, it is necessary to analyze the bubble generations and axiomatic design by computational fluid dynamics(CFD). By comparing the weight matrix of neural networks to the design matrix of axiomatic design, we propose methods to verify designs objectively. The optimal solution could be deduced by the regression analysis using the design parameters.

• 한국염색가공학회지
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• 제25권3호
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• pp.215-222
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• 2013

The purpose of this study is to minimize fading fabrics of surgical gown by repeated severe laundering and sterilization condition. The study showed that the best conditions were reduction cleaning using sulphinic acid derivatives or glucose organic chemicals at $98^{\circ}C$ alkaline solutions. In these conditions, color difference values(dE) were below 1.0 that means unrecognizable color change by repeated laundering and sterilization. If it treated with only laundering, reduction cleaning conditions may adjust over $80^{\circ}C$ alkaline solution. In conclusion, it is needed to select the high-washing fastness dye and reduction cleaning using sulphinic acid derivatives or glucose organic chemicals at $98^{\circ}C$ alkaline solutions for removal unfixed dyes.

• The Journal of Advanced Prosthodontics
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• 제8권3호
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• pp.172-180
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• 2016

PURPOSE. The purpose of this study was to analyze the antimicrobial, antioxidant activity and cytotoxicity of Dendropanax morbifera $L{\acute{e}}veille$ extract for assessing whether Dendropanax morbifera $L{\acute{e}}veille$ can be used for the development of natural mouthwash and denture cleaning solution. MATERIALS AND METHODS. The extract was obtained from branches of Dendropanax morbifera $L{\acute{e}}veille$. The solvent fractions were acquired by fractionating Dendropanax morbifera $L{\acute{e}}veille$ extract using n-hexane, ethyl acetate, chloroform and butanol solvent. Paper disc test was used to evaluate the antimicrobial and antifungal activity of Dendropanax morbifera $L{\acute{e}}veille$ extract and solvent fractions against Streptococcus mutans and Candida albicans. The analysis of antioxidant activity was carried out through DPPH radical scavenging assay. The cytotoxicity of Dendropanax morbifera $L{\acute{e}}veille$ extract was analyzed through MTT assay using normal human oral keratinocytes. RESULTS. Dendropanax morbifera $L{\acute{e}}veille$ extract showed antimicrobial activity against Streptococcus mutans and especially Candida albicans. The solvent fractions of Dendropanax morbifera $L{\acute{e}}veille$ showed strong antimicrobial activity against Streptococcus mutans and Candida albicans in n-hexane and butanol solvent fraction, respectively. Dendropanax morbifera $L{\acute{e}}veille$ extract also showed outstanding antioxidant activity. Butanol, ethyl acetate, and chloroform solvent fraction of Dendropanax morbifera $L{\acute{e}}veille$ tended to have increased antioxidant activity as the concentration increased. Dendropanax morbifera $L{\acute{e}}veille$ extract showed high cell survival rate in cytotoxicity test. CONCLUSION. Dendropanax morbifera $L{\acute{e}}veille$ extract turned out to have antimicrobial, antioxidant activity and cytophilicity. Based on these results, it is expected that Dendropanax morbifera $L{\acute{e}}veille$ is applicable as an ingredient for natural mouthwash and denture cleanser.

• 한국응용과학기술학회지
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• 제16권1호
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• pp.33-40
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• 1999

We used Cu as a representative of metals to be directly adsorbed on the bare Si surface and studied its removal DHF, DHF-$H_2O_2$ and BHF solution. It has been found that Cu ion in DHF adheres on every Si wafer surface that we used in our study (n, p, n+, p+) especially on the n+-Si surface. The DHF-$H_2O_2$ solution is found to be effective in removing metals featuring high electronegativity such as Cu from the p-Si and n-Si wafers. Even when the DHF-$H_2O_2$ solution has Cu ions at the concentration of 1ppm, the solution is found effective in cleaning the wafer. In the case the n+-Si and p+-Si wafers, however, their surfaces get contaminated with Cu When Cu ion of 10ppb remains in the DHF-$H_2O_2$ solution. When BHF is used, Cu in BHF is more likely to contaminate the n+-Si wafer. It is also revealed that the surfactant added to BHF improve wettability onto p-Si, n-Si and p+-Si wafer surface. This effect of the surfactant, however, is not observed on the n+-Si wafer and is increased when it is immersed in the DHF-$H_2O_2$ solution for 10min. The rate of the metallic contamination on the n+-Si wafer is found to be much higher than on the other Si wafers. In order to suppress the metallic contamination on every type of Si surface below 1010atoms/cm2, the metallic concentration in ultra pure water and high-purity DHF which is employed at the final stage of the cleaning process must be lowered below the part per trillion level. The DHF-$H_2O_2$ solution, however, degrades surface roughness on the substrate with the n+ and p+ surfaces. In order to remove metallic impurities on these surfaces, there is no choice at present but to use the $NH_4OH-H_2O_2-H_2O$ and $HCl-H_2O_2-H_2O$ cleaning.

• 핵의학기술
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• 제13권3호
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• pp.181-184
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• 2009

목적 : 자동 분주기 (TECAN)의 fixed tip 사용 시 충분한 세척에도 불구하고 고농도 검체 뒤에 연이은 검체가 영향을 받는 carryover 현상이 발생되는 경우가 있다. 이는 검사결과가 위 양성으로 나타날 수 있는 위험성이 있으므로 이상유무 판단을 위해 잦은 재검을 실시해야 하는 번거로움이 있다. 따라서 본 연구는 경제성이 높은 fixed tip을 사용하면서 carryover를 방지할 수 있는 방법을 개선하고자 한다. 실험재료 및 방법 : 자동분주기(Tecan)를 이용하여 HBs Ag, HBs Ab, HBc Ab(IgG) 검사를 대상으로 실행하였으며, fixed tip 방식의 분주시스템으로 일반 환자의 검체 분주 후에 생리식염수를 분주 할 수 있도록 배치하였다. 세척 단계는 0.25mol/L NaOH용액을 이용하였으며, 생리식염수의 검사결과 cpm을 측정하여 carryover의 발생 유무를 확인하였다. 또한 3가지 검사를 0.25 mol/L NaOH 용액이 검사에 미치는 영향을 분석하였다. 결과 : 생리식염수 결과는 100% 음성결과를 보였으며, 0.25 mol/L NaOH를 세척액으로 사용한 fixed tip에서 검체분주 시 환자 혈청은 HBc Ab (IgG)검사에서 cut-off zone (cut-off${\pm}$10%)을 제외한 모든 결과에서 기존 외래보고 결과와 동일한 값을 얻었다. 결론 : 생리식염수 검사결과 100% 음성을 보인 것은 실험에서 사용한 세척액으로 fixed tip을 세척하는 방법이 carryover를 방지할 수 있고, 이로 인해 발생하는 위양성을 방지할 수 있었다. 또한, 환자 검체의 결과 값이 기존 보고 결과와 일치함으로 0.25 mol/L NaOH 용액이 간염 검사결과에 영향을 끼치지 않음을 확인하였다. 따라서 본 실험에서 실시한 방법이 disposable tip보다 상대적으로 경제적인 fixed tip을 사용하면서도 carryover가 없는 정확한 결과를 얻을 수 있는 효과적인 방안임을 알 수 있다.

• 한국정밀공학회지
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• 제30권4호
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• pp.390-396
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• 2013

Due to the development of technology, there is a considerable increase in the number of skyscrapers in the world. Accordingly, there are rapid growing requests about maintenances such as cleaning, painting, and inspection. However, it is extremely dangerous working the walls of buildings, and crashes from buildings have accounted for large proportion of constructional accidents. Especially, as the number of buildings with irregular shapes increases, the accident rate during the maintenance work increases each year, and most of the accidents lead to death. An alternative solution must be developed with the commercialization of automatic systems. In this research, a fundamental research has been conducted for drafting and commercializing an automation tool that is carried in the built-in guide system, which can perform cleaning.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 대한기계학회논문집A
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• 제35권5호
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• pp.575-582
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• 2011

클리닝 블레이드는 레이저 프린터 토너 카트리지에 장착된 감광드럼 표면의 잔류 토너를 제거하는 우레탄 재질의 고무부품이다. 기존에는 고무 블레이드의 클리닝 성능과 수명에 대한 다양한 연구들이 수행되었으나, 본 연구에서는 클리닝 성능과 부품간의 간섭에 대한 구속조건들을 모두 만족하면서 클리닝 블레이드에 발생하는 최대응력을 최소화 하는 클리닝 블레이드의 형상최적설계를 수행하였다. 상용 PIDO 툴인 PIAnO 를 이용하여 클리닝 블레이드의 구조해석절차를 통합하고 자동화하였으며, 최적설계를 위해 PIAnO 에서 제공하는 실험계획법과 근사화기법, 최적화 알고리즘을 사용하였다. 최적설계 결과, 초기 모델 대비 최대응력을 32.6% 감소 시킬 수 있는 최적의 설계안을 도출하였으며, 이를 통해 본 연구에서 수행한 최적설계 방법의 유효성을 확인할 수 있었다.

• 상하수도학회지
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• 제31권3호
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• pp.229-236
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• 2017

In this study, a direct contact membrane module was manufactured to be used in a pilot scale membrane distillation process to treat $3m^3/day$ of the digestate produced from anaerobic digestion of livestock manure. In order to investigate the performance of the membrane module, permeate flux was measured with and without spacer inside the module under various condition of temperature difference and cross flow velocity (CFV) through the membrane surfaces. Flux recovery rate after chemical cleaning was also investigated by applying three different cleaning methods. Additionally, thermal energy consumption was theoretically simulated based on actual pilot plant operation conditions. As results, we observed flux of the module with spacer was almost similar to the theoretically predicted value because the installation of spacer reduced the channeling effect inside the module. Under the same operating condition, the permeate flux also increased with increasing temperature difference and CFV. As a result of chemical in-line cleaning using NaOCl and citric acid for the fouled membranes, the recovery rate was 83.7% compared to the initial flux when NaOCl was used alone, and 87% recovery rate was observed when only citric acid was used. However, in the case of using only citric acid, the permeate flux was decreased at a rapid rate. It seemed that a cleaning by NaOCl was more effective to recover the flux of membrane contaminated by the organic matter as compared to a cleaning by citric acid. The total heat energy consumption increased with increasing CFV and temperature difference across the membrane. Thus, further studies should be intensively conducted to obtain a high permeate flux while keeping the energy consumption to a minimum for a practical application of membrane distillation process to treat wastewater.