• Clean Technology
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• v.18 no.3
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• pp.272-279
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• 2012

In this study, an environmental-friendly cleaning agent utilizing organic acids and various additives has been developed and applied to the field for removal of scale deposited on the cleaning beds or distribution reservoirs of the waterworks. As an analytical result of scale on the cleaning beds, we found that it consists of mainly metallic oxides such as $SiO_2$, $Al_2O_3$, $Fe_2O_3$, and MnO. Malic acid, malonic acid, and citric acid showed relatively better solvency on $Al_2O_3$, $Fe_2O_3$, and MnO except $SiO_2$ among various organic acids. Mixed organic acid solutions of malic acid, malonic acid, and citric acid were prepared with certain weight ratios and their solvencies on mixed metal oxides of $Al_2O_3$, $Fe_2O_3$, and MnO were investigated. The experimental results showed that an 10% mixed organic acid solution prepared with weight ratio of malic acid : malonic acid : citric acid = 6 : 2 : 2 were found to have best scale solvency power of about 29%. The formulated cleaning agents with a small amount of nonionic surfactant showed much better solvency on mixed oxides than mixed organic solution alone. Especially, the formulated cleaning agent with 0.2 wt% LA-7 surfactant appeared to have best scale removal efficiency of about 35%. However, the formulated cleaning agent with disinfectants such as NaClO, $H_2O_2$ and $Ca(ClO)_2$ showed poor solvency on mixed oxides. It is inferred that surfactants are able to improve scale removal efficiency due to their capability of emulsification, and disinfectants cause to degrade scale solvency in water because of their oxidation. Based on these basic experimental results, formulated cleaning agents have been prepared with mixed organic acid solution, nonionic surfactants, and disinfectants and successfully applied to removal of scales on the cleaning beds and distribution reservoir at city D waterworks.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.11-15
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• 2004

Scales, accumulated on some parts of semiconductor equipments such as sputters and CVD during the device fabrication processes, often lower the lifetime of the equipments and production yields. Thus, many equipment parts have be cleaned regularly. In this study, an attempt to establish an effective process to remove scales on the sidewall of collimators located inside the chamber of the sputter was made. The EDX analysis revealed that the scales were composed of Ti and TiN with the columnar structure. Through the trial-and-error experiments, it was found that the etching in the $HNO_3$:$H_2SO_4$:$H_2O$=4:2:4 solution for 5.5 hrs at $67^{\circ}C$, after the oxide removal in the HF solution, and the heat-treatment at $700^{\circ}C$ for 1 min., was the most effective process for the scale removal.

• Applied Chemistry for Engineering
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• v.31 no.2
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• pp.193-199
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• 2020

The effects of the composition of the dishwashing detergent on interfaces of the oil (O) and the aqueous (W) solution in addition to the cleaning effects of interfacial properties were investigated. Also, the cleaning power of the oil contaminated on the surface of the dish according to each composition and the residuals of the contaminants and the cleaning agent after the washing rinses were evaluated. The removal of contaminated oil on the solid (S) surface in the composition of the cleaning agents used in this study was strongly related to the interfacial properties between the W/O/S, and was particularly dependent on the forward and backward dynamic contact angles. When both contact angles were low at the same time, the permeability of the cleaning solution was so high that the contaminated oil showed a high removal effect. The smaller the interfacial tension of O/W was, the better emulsification of the contaminated oil, the higher the interfacial tension, and the poorer emulsification were achieved. However, the emulsification effect did not significantly affect the cleaning power. In particular, in the case of the cleaner having low interfacial tension, the cleaning material remained on the surface of the solid after washing.

• Resources Recycling
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• v.30 no.1
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• pp.60-65
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• 2021

The recycling of titanium turning scraps requires the removal of cutting oil and other contaminants remaining on the surface. In this study, an experiment was conducted in which titanium scraps were cleaned by a combination of ultrasonic immersion-steam cleaning and subsequent drying at high temperature. To determine the removal mechanism of cutting oil, the contact angle between titanium surface and cutting oil was measured. The result confirmed the optimum condition of the immersion solution of the titanium turning scraps. In the case of immersion cleaning of Na4P2O7 aqueous solution, the degree of carbon removed in the cutting oil was the highest at 50℃, and it was confirmed that the carbon content obtained from the combination of steam cleaning and ultrasonic immersion-steam cleaning was lower than that from steam cleaning after ultrasonic immersion. The oxidation and decomposition behaviors of cutting oil were investigated using Thermogravimetric analysis (TGA) and the result was applied in the high temperature drying process. From the results of the high temperature drying tests, it was concluded that 200℃ is the optimal drying temperature.

• Clean Technology
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• v.19 no.3
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• pp.219-225
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• 2013

Environment-friendly and surfactant-free aqueous cleaning agents have been developed in order to solve various problems generated by surfactants in the aqueous cleaning agents. Aqueous surfactant-free cleaning agents, S-1 and S-2 have been formulated with water-soluble solvents such as propylene glycol and propylene glycol ether on their main components and with some additives. These solvents were chosen because of their good solubility in water and excellent solubility of fluxes which are major contaminants of printed circuit board in the electronic industry. Physical properties of the formulated and the imported cleaning agents were measured to predict their cleaning performance, and their cleaning abilities of flux and solder contaminants were evaluated under the various ultrasonic frequencies by a gravimetric method. The measurement results show that the physical properties of cleaning agent V are generally similar with those of formulated cleaning agents S-1 and S-2. Both the cleaning agent V and the formulated cleaning agents S-1 and S-2 showed similar trends that their pH decrease in the beginning and then increases later on with the increase of their dilution in water. It is considered that the wetting indices of the cleaning agents calculated with experimental values do not not have any influence on their cleaning ability. In ultrasonic cleaning tests under three ultrasonic frequencies of 28, 45, and 100 kHz, their best performances of cleaning solder and flux were obtained at 45 kHz and 28 kHz, respectively, and the cleaning performance of the formulated cleaning agents S-1 and S-2 was better than that of the cleaning agent V. However, in the case of the recommended diluted concentration of 25 wt% cleaning solution, the cleaning performance of the cleaner V for solder and flux was better in the initial stage of cleaning compared to the formulated cleaners. And it may be concluded that the formulated cleaning agents S-1 and S-2 can be applied to cleaning of solder and flux in the industry, based on the experimental results in this study.

• Applied Chemistry for Engineering
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• v.29 no.2
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• pp.229-236
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• 2018

A customized cleaning agent was investigated for improving the performance decreased by the pollution of collecting plates in an electric fume collector (EFC) which was developed and applied for the purification of effluent gas including oil mist from the textile industry. The pollutants on the surface of collecting plates were blackened by the condensation of oil mist for a long time and difficult to remove by general cleaning agents. The composition of an optimized cleaning agent consisted of alkali, alcohol, glycol and non-ionic surfactant sources was determined by considering the pollutant properties and effect on the damage of the basic metal of collecting plate and so on. The developed cleaning agent solution diluted by 9.1% was applied to the field test, and also the pollutants strongly adhered on collecting plate surfaces were successfully removed by a simple spraying method. The effluent gas purification efficiency of EFC increased significantly by cleaning of collecting plates.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2003.11a
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• pp.149-152
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• 2003

• Membrane Journal
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• v.28 no.1
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• pp.62-66
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• 2018

In this study the cleaning spherical beads with same density as water were fabricated. Bead moving velocity was measured with respect to the aeration rate and bead concentration in water reservoir. The permeation experiments for FR (filtration and relaxation) and SFCO (sinusoidal filtration continuous operation) modes were simultaneously carried out under the condition of 1 to 3% cleaning spherical bead concentration, 20 LMH and 500 mL/min aeration rate in the MLSS 8,000 mg/L activated sludge solution. The used membrane was the $90cm^2$ effective area and $0.4{\mu}m$ nominal pore size flat membrane. The TMP (transmembrane pressure) decreased as the bead concentration increased, and was shown most effective in FR mode with 2% bead concentration.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.99-106
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• 2011

Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1240-1247
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• 2003

Water jet nozzle for LCD has been used as a wet cleaning process in many industries. It is necessary for the nozzle to consider cleaning effect and flux. In this paper, we applied the bubble dynamic theory(Rayleight-Plesset equation) to improve the cleaning efficiency. Generally, Rayleigh-Plesset equations for cavitation bubbles are used in analyzing computer simulation for caviting flows. Burst of bubbles causes potential energies and we can use these energies to remove organic and inorganic compounds on the LCD. Therefore, it is necessary to analyze the bubble generations and axiomatic design by computational fluid dynamics(CFD). By comparing the weight matrix of neural networks to the design matrix of axiomatic design, we propose methods to verify designs objectively. The optimal solution could be deduced by the regression analysis using the design parameters.