• Journal of the Korean Applied Science and Technology
• /
• v.14 no.2
• /
• pp.115-122
• /
• 1997

The field of printing use to pressurization ink using screen gassamer that is called screen printing. Existing cleaning solvent using screen printing are the organic solvents including aromatic compounds carried with poisonous and stench. Besides, cleaning method of current screen printing are for the most part mixed cleaning method of dipping and polish. Using 1,1,1-TCE, CFC-113 alternative system cleaning solvent be substituted for existing cleaning solvent against screen printing ink measured the cleaning efficiency according to gravimetric analysis method and property change of gassamer according to Image Analyzer. Also, Cleaning process system carry with excellent cleaning efficiency studied which was proposed new cleaning process including ultrasonic and vibration cleaning process be substituted for existing mixed cleaning method of dipping and polish.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.139-144
• /
• 2011

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.

• Journal of the Korean Applied Science and Technology
• /
• v.16 no.3
• /
• pp.237-240
• /
• 1999

This study showed that the optimized cleaning process using non-aqueous cleaning solvents is adaptable in the industrial field for existing 1.1.1-TCE cleaning solvents which is an ozone depleting sustance. Alternative cleaning solvent system substituted for existing cleaning solvent against non-aqueous pollutants(cutting & flux oil), was evaluated for the cleaning efficiency using gravimetric analysis method and surface change of sample by Image analyzer. The results showed that alternative solvents and process had excellent cleaning efficiency.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.22 no.2
• /
• pp.114-118
• /
• 2009

PVA (polyvinyl alcohol) brush cleaning method is a typical cleaning method for semiconductor cleaning process especially post-CMP cleaning. PVA brush contacts with the wafer surface and abrasive particle, generating the contact rotational torque of the brush, which is the removal mechanism. The brush rotational torque can overcome theoretically the adhesion force generated between the abrasive particle and wafer by zeta potential. However, after CMP (chemical mechanical polishing) process, many particles remained on the wafer because the brush was contaminated in previous post-CMP cleaning step. The abrasive particle on the brush redeposits to the wafer. The level of the brush contamination increased according to the cleaning run time. After cleaning the brush, the level of wafer contamination dramatically decreased. Therefore, the brush cleanliness effect on the cleaning performance and it is important for the brush to be maintained clearly.

• Laser Solutions
• /
• v.4 no.2
• /
• pp.39-45
• /
• 2001

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning Performance and time-resolved optical diagnostics are Performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.15 no.1
• /
• pp.8-13
• /
• 2016

The micro drill bit automatic regrinding in-line system is a system that refurbishes drill bits used in a PCB manufacturing process. This system is able to refurbish drill bits with a minimum size of ø0.15-0.075mm that have previously been discarded. Beyond the conventional manual cleaning process using ultrasound, this system adopts a water jet cleaning system, making it capable of cleaning drill bits with a minimum size of ø0.15-0.075mm. This paper analyses various contact pressures applied to the surface of drill bits depending on the shooting pressure of the cleaning device and fluid velocity in order to optimize the nozzle location and to detect structural instability caused by the contact pressures.

• Laser Solutions
• /
• v.12 no.4
• /
• pp.17-25
• /
• 2009

The surface cleaning method based on the laser-induced breakdown (LIB) of gas and subsequent plasma and shock wave generation can remove small particles from solid surfaces. In the laser shock cleaning (LSC) process, a high-power laser pulse induces optical breakdown of the ambient gas above the solid surface covered with contaminant particles. The subsequently created shock wave followed by a high-speed flow stream detaches the particles. In this work, a novel surface cleaning process using laser-induced breakdown of liquid is introduced and demonstrated. LIB of a micro liquid jet increases the shock wave intensity and thus removes smaller particle than the conventional LSC method. Experiments demonstrate that the cleaning force and cleaning efficiency are also increased significantly by this method.

• International Journal of Naval Architecture and Ocean Engineering
• /
• v.4 no.4
• /
• pp.335-352
• /
• 2012

An underwater hull cleaning robot can be a desirable choice for the cleaning of large ships. It can make the cleaning process safe and economical. This paper presents a hydrodynamic design of an underwater cleaning robot and its evaluation for an underwater ship hull cleaning robot. The hydrodynamic design process of the robot body is described in detail. Optimal body design process with compromises among conflicting design requirements is given. Experimental results on the hydrodynamic performance of the robot are given.

• 전자공학회논문지 IE
• /
• v.48 no.2
• /
• pp.47-51
• /
• 2011

In this paper, we propose the cleaning process system to remove micro-particles, various impurities, unnecessary residues, etc. for liquid crystal display manufacturing processes. This system is structured with cleaning, rinse and drying process using the chemical cleaning of alkaline water and the physical cleaning of SHS(supper heating steam). And we shows cleaning effects of alkaline water and remove effects of SHS.

• Clean Technology
• /
• v.16 no.2
• /
• pp.103-116
• /
• 2010

It has been reported that the LCD panel market in the FPD industry is become growing and its panel size and production capacity are increasing, and its manufacturing technique is improved every year. FPD manufacturing process requires high cleanliness in its overall process. Especially, FPD cleaning process which accounts for 30~40% of total manufacturing process is very important in its technological and productivity aspects. It is difficult to remove residual liquid-crystal in the fine gap after liquid-crystal injection process in the cell. In this study, aqueous cleaning agents with excellent cleaning, rinsing, and penetrating abilities, but minimum ion content for LCD panel were formulated through mixing glycol ether-type and glycol dimethyl ether-type solvents and nonionic surfactants which are widely used as raw materials for alternative cleaning agents because of environmental regulation at home and abroad. And the formulated cleaning agents were applied to clean FPD liquid crystal after its injection in the cell. Physical properties, cleaning efficiencies, and rinsabilities of the formulated cleaning agents with different combination ratios of solvents, surfactants and additives were measured. As experimental results, the formulated cleaning agents showed higher wetting indices and cloud point than the traditional commercial cleaning agent. And it was found that cleaning efficiencies of the formulated cleaning agents were influenced by the structure of main solvents in them and the types of liquid crystal as soil for cleaning. The best cleaning agents among the formulated cleaning agents showed similar cleaning efficiencies and better rinsabilities compared to the conventional cleaning agent.