• Title/Summary/Keyword: Cleaning

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A Study on the Development of High Density Ozone Water Cleaning System for Herb Medicine (고농도 오존수를 이용한 한약재 세척기기에 대한 연구)

  • Kim, Jeong-Ho;Bang, Byeong-Hun;Lee, Sang-Hwa;Kim, Sung-Hee
    • Journal of Acupuncture Research
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    • v.29 no.2
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    • pp.9-14
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    • 2012
  • Objectives : This study was designed to evaluate the pesticide residue of herb medicine through high density ozone water cleaning system. Materials and Methods : We purchased ginseng(Panax ginseng) on market and sprayed pesticides (Diazinon) on ginseng. We analyzed pesticide residue according to washing methods(untreated, ozone water cleaning, ultrasonic cleaning, Water cleaning). As a result of each washing methods, in ozone water cleaning method pesticide residue was much less remained than in Ultrasonic Cleaning method and water cleaning method. Conclusions : High density ozone water cleaning is the best method for removing pesticides of herbal medicine.

A Study on the Scientific Conservation of Buried-Fabrics form old Tombs -cleaning and ironing- (출토직물의 과학적 보존 처리에 관한 연구 -세탁방법과 다림질 방법-)

  • 배순화;이미식
    • Journal of the Korean Society of Clothing and Textiles
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    • v.23 no.7
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    • pp.987-997
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    • 1999
  • The purpose of this study was finding out the appropriate cleaning method for buried fabrics from old tombs focusing on the conservation of textiles. Cleaning effects and physical properties change depending on cleaning method have been analysed, The following results were obtained from this study : 1. Wet cleaning showed better effect on the cleaning of fabrics compared to solvent cleaning which meant more water-soluble soils existed than oily soils. 2. All the cleaning methods used did not cause any distorsion or shrinkage to the fabrics because fabrics had been stabilized for a long time 3. Addition of detergent to cleaning system decreased the friction of fiber during cleaning rocess so that the damage of fabrics could be minimized., 4. Ironing is an undesirable process because heat remarkably weakened fibers.

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A Study on Optical Analysis and Overprinting Sequence in 2-Color Solid Overprints (2색 중첩 민인쇄의 광학적 해석과 중첩인쇄 순서에 관한 연구)

  • 강상훈
    • Journal of the Korean Graphic Arts Communication Society
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    • v.15 no.2
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    • pp.1-4
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    • 1997
  • Existing cleaning solvent using screen printing are the organic solvents including aromatic compounds carried with poisonous and stench. besides, Cleaning method of current screen printing are for the most part mixed cleaning method of dipping and polish. Using 1,1,1-TCE, CFC-113 alternative system cleaning solvent be substituted for existing cleaning solvent against screen printing ink measured the cleaning efficiency according to gravimetric analysis method and property change of gassamer according to Image Analyzer. Also, Cleaning process system carry with excellent cleaning efficiency studied which was proposed new cleaning process including ultrasonic cleaning process be substituted for existing mixed cleaning method of dipping and polish.

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Electrolyzed Water Cleaning for Semiconductor Manufacturing (전리수를 이용한 반도체 세정 공정)

  • 류근걸;김우혁;이윤배;이종권
    • Journal of the Semiconductor & Display Technology
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    • v.2 no.3
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    • pp.1-6
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    • 2003
  • In the rapid changes of the semiconductor manufacturing technologies for early 21st century, it may be safely said that a kernel of terms is the size increase of Si wafer and the size decrease of semiconductor devices. As the size of Si wafers increases and semiconductor device is miniaturized, the units of cleaning processes increase. A present cleaning technology is based upon RCA cleaning which consumes vast chemicals and ultra pure water (UPW) and is the high temperature process. Therefore, this technology gives rise to environmental issue. To resolve this matter, candidates of advanced cleaning processes have been studied. One of them is to apply the electrolyzed water. In this work, electrolyzed water cleaning was compared with various chemical cleaning, using Si wafer surfaces by changing cleaning temperature and cleaning time, and especially, concentrating upon the contact angle. It was observed that contact angle on surface treated with Electrolyzed water cleaning was $4.4^{\circ}$ without RCA cleaning. Amine series additive of high pKa (negative logarithm of the acidity constant) was used to observe the property changes of cathode water.

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A Study on the Cleaning Method of Excavated Textiles (의영 전의이씨 출토복식의 세척방법에 관한 연구)

  • 박윤미;황은경;정복남
    • The Research Journal of the Costume Culture
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    • v.11 no.6
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    • pp.956-966
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    • 2003
  • The purpose of study is to find out a suitable cleaning method for excavated textiles of Jeon-ui Lee(1570∼1647). The textiles were excavated from her tomb in 1997, and her descendents put them in a box without any treatment and kept them in the warehouse since then. We used two kinds of silk as samples, non-dyed and dyed textile. The experiment was performed by 8 kinds of wet cleaning and dry cleaning methods, an ultrasonic cleaner was used in the wet cleaning, decane and perchloroethylene were used as solvents in the dry cleaning. The use of the ultrasonic cleaner in the wet cleaning method did not show any damage to the fibers of the textiles and it not only cleaned well but also was safe for the fugitive dyes. It resulted in more effective cleaning when the detergent was used together. Therefore, it is effective to use the ultrasonic cleaning on the delicate historical textiles and helpful to the operator's safety and environment.

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Effect of PVA Brush Contamination on Post-CMP Cleaning Performance (Post-CMP Cleaning에서 PVA 브러시 오염이 세정 효율에 미치는 영향)

  • Cho, Han-Chul;Yuh, Min-Jong;Kim, Suk-Joo;Jeong, Hae-Do
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.2
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    • pp.114-118
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    • 2009
  • PVA (polyvinyl alcohol) brush cleaning method is a typical cleaning method for semiconductor cleaning process especially post-CMP cleaning. PVA brush contacts with the wafer surface and abrasive particle, generating the contact rotational torque of the brush, which is the removal mechanism. The brush rotational torque can overcome theoretically the adhesion force generated between the abrasive particle and wafer by zeta potential. However, after CMP (chemical mechanical polishing) process, many particles remained on the wafer because the brush was contaminated in previous post-CMP cleaning step. The abrasive particle on the brush redeposits to the wafer. The level of the brush contamination increased according to the cleaning run time. After cleaning the brush, the level of wafer contamination dramatically decreased. Therefore, the brush cleanliness effect on the cleaning performance and it is important for the brush to be maintained clearly.

Path Planning for Cleaning Robots Using Virtual Map (가상지도를 이용한 청소로봇 경로계획)

  • Kim, Hyung-Il
    • Journal of the Korea Society of Computer and Information
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    • v.14 no.11
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    • pp.31-40
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    • 2009
  • The most common cleaning methods of cleaning robot can be divided into two categories: the random and the boustrophedon method. A cleaning robot using the random method moves straight until it bumps into an obstacle. If it collides with an obstacle, the cleaning robot turns a specific angle and continues moving straight. Therefore, the random method often tends to clean the already clean area repeatedly. In addition, it takes a long time to complete cleaning. A cleaning robot using the boustrophedon method moves straight until it collides with an obstacle. If it meets an obstacle, the cleaning robot moves to the next uncleaned space through turning and moving ahead. when resuming cleaning from the new region, a cleaning robot moves in the direction opposite to the direction of the previous cleaning. Because the boustrophedon method cleans a cleaning space more densely, its performance is excellent in an obstacle-free space or a small space. However, In a space with obstacles or a complex structure, it takes a long time to complete the cleaning work. Cleaning should be systematically approached with a good understanding of the work area. The virtual map-based cleaning robot proposed in this paper cleaned a work space efficiently. The efficiency of the proposed method was measured through simulation.

Deriving the Performance Requirements of a Window Cleaning Apparatus through Technology Survey (기술조사를 통한 창문청소장치의 요구성능 도출)

  • Kim, Kyoon-Tai;Jun, Young-Hun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2016.10a
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    • pp.162-163
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    • 2016
  • Conventional window cleaning method has a number of limitations, for example, workers dependent and high crash risk. The purpose of this study is to derive the performance requirements of a window cleaning apparatus through technology survey. For this, we investigated the domestic and international patents related to window cleaning, and interviewed experts in the field of window cleaning and mechanical design. Through this research, we have proposed performance requirements of the window cleaning apparatus.

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Laser Cleaning : Introduction and Applications

  • Lee, Jong-Myoung;Ken Watkins
    • Laser Solutions
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    • v.3 no.1
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    • pp.2-11
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    • 2000
  • Laser cleaning has begun to attract a considerable amount of interest recently as a new cleaning technique among scientists and engineers. The unique characteristics of laser cleaning are currently finding successful applications in industry, in medicine as well as in the world of art conservation. This paper takes an overview of the laser cleaning technique itself including basic principles and characteristics, and provides an account of current trends especially with regard to practical applications. Experience with its successful applications in various fields shows that laser cleaning may be about to emerge as a real alternative to conventional cleaning methods.

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Study on the Cleaning Screen Printing using Alternative Cleaning Solvent of 1,1,1-TCE, CFC-113 (1,1,1-TCE, CFC-113 대체세정제를 이용한 스크린인쇄 세정연구)

  • Lee, Ki-Chang;Yoon, Cheol-Hun;Hwang, Sung-Kwy;Oh, Se-Young;Lee, Seok-Woo;Ryu, Jung-Wok
    • Journal of the Korean Applied Science and Technology
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    • v.14 no.2
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    • pp.115-122
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    • 1997
  • The field of printing use to pressurization ink using screen gassamer that is called screen printing. Existing cleaning solvent using screen printing are the organic solvents including aromatic compounds carried with poisonous and stench. Besides, cleaning method of current screen printing are for the most part mixed cleaning method of dipping and polish. Using 1,1,1-TCE, CFC-113 alternative system cleaning solvent be substituted for existing cleaning solvent against screen printing ink measured the cleaning efficiency according to gravimetric analysis method and property change of gassamer according to Image Analyzer. Also, Cleaning process system carry with excellent cleaning efficiency studied which was proposed new cleaning process including ultrasonic and vibration cleaning process be substituted for existing mixed cleaning method of dipping and polish.