• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.5
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• pp.492-498
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• 2015

As the integration of circuit components increases steadily, various EMS(Electromagnetic Susceptibility) problems have emerged from integrated circuits and electrical systems. The electromagnetic susceptibility of VCOs(Voltage Controlled Oscillator) is especially critical in RF systems. Therefore, in this paper, through the phase noise theory that models electrical oscillators as linear time variant systems, the EMS characteristics of representative VCO -ring VCO and LC VCO- with 1.2 GHz of reference oscillating frequency are analyzed under the existence of the electromagnetic noise coupled in power supply. An simulation algorithm is developed to extract impulse response function based on the phase noise theory. When there is no supply noise, the magnitude of the jitter of two oscillators were similar to around 2.1 ps, but in presence of supply noise, the jitter was significantly lower in LC VCOs than ring VCOs.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.8 s.338
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• pp.53-60
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• 2005

Recently, sub-micron CMOS technologies have taken the place of III-V materials in a number of areas in integrated circuit designs, in particular even for the applications of gjgabit optical communication applications due to its low cost, high integration level, low power dissipation, and short turn-around time characteristics. In this paper, a four-channel transimpedance amplifier (TIA) array is realized in a standard 0.35mm CMOS technology Each channel includes an optical PIN photodiode and a TIA incorporating the fully differential regulated cascode (RGC) input configuration to achieve effectively enhanced transconductance(gm) and also exploiting the inductive peaking technique to extend the bandwidth. Post-layout simulations show that each TIA demonstrates the mid-band transimpedance gain of 59.3dBW, the -3dB bandwidth of 2.45GHz for 0.5pF photodiode capacitance, and the average noise current spectral density of 18.4pA/sqrt(Hz). The TIA array dissipates 92mw p in total from a single 3.3V supply The four-channel RGC TIA array is suitable for low-power, high-speed optical interconnect applications.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.4
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• pp.357-365
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• 2013

The 4 by 4 series slot sub-array antenna is proposed using substrate integrated waveguide(SIW) technology for 35 GHz of Ka band application. The proposed antenna is realized with multi-layered structure for compact size and easy integration features. 4 by 4 radiating slots are arrayed on top PCB with equal spacing and the feeding SIWs are arranged on middle and bottom PCBs for uniform power distribution. The multi-layered antenna is realized using RT/Duroid 5880 that has dielectric constant of 2.2 and the total antenna size is $750.76mm^2$. The individual parts such as radiators and feeding networks are simulated using full-wave simulator CST MWS. Furthermore, the total sub-array antenna also fabricated and measured the electrical performances such as impedance bandwidth under the criteria of -10 dB(490 MHz), maximum gain(18.02 dBi), sidelobe level(SLL)(-11.0 dB), and cross polarization discrimination (XPD)(-20.16 dB).

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.35 no.9
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• pp.816-825
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• 2007

With a view to building up a program used in conceptual design of liquid rocket engine system, a preliminary performance-based code for an integrated engine system has been developed by incorporating sub-modular programs for each essential engine component. Modular descriptions for each component were formulated mathematically with essential parameters. In the whole iterative circuits for predicting engine performance, matching conditions of mass flow rate and pressure drop through each engine component have been considered. Mass balance calculations at each inter-component boundary are found smoothly converged. All the pressure drops through engine components as a function of mass flow rate are added up to provide turbo-pump outlet condition. In this paper, the flow chart for each iterative circuit and design methodologies are presented. Resultant predictions are validated with real engine data.

• The Journal of Korean Physical Therapy
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• v.13 no.3
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• pp.509-527
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• 2001

The Sun's ray is composed of Infrared(49%), Visible light(40%) and Ultra violet(11%), however the ray getting to the earth is FIR(Far infrared; 60%), IR(Infrared; 20%), and UV(Ultra Violet; 20%). Human beings has utilized FIR already from time immemorial. Hershel found out Infrared for the first time. in the Industrial Revolution the Infrared and FIR had been begun to use making products. In these days, with contemporary science FIR would be begun to clear up the implication in the human body and organic compound. IR classified by wavelength three parts NlR, MIR, FIR. There is FIR which is radiated from healthy human body the wave length is 8-l4m. The human body is composed of proteins which get easily changed by a thermal factor (about 42 $^{\circ}$C over). FIR with low temperature can deeply penetrate on the human body composed things without troublesomes, since FIR has effectively operated on the human body at low temperature (35-40 $^{\circ}$C). When FlR penetrated on the human body. it would inhibit the abnormal genes and cells expression, and then information of DNA and RNA would be reexpressed for arranging DNA and RNA abnormal state. As FlR's receptors in the body, it could be presumed that N-glycosyl linkage of purine and deoxyribose, RNA splicing process, and Heat shock protein. To take the FIR which was a optimized wavewlength and strength, at first, we induced the characteristic algorithm and the computerized programing. Then we formed that the formular of optimized FIR with physical, mathematical logic and theory. especially, Plank, Kirchhoff, Wien, Stefan-Boltzmann's logic and law. In the long run, the formular was induced with integration mathematical, since we had to know the molecular wavelength. Based on the induced formular as above, we programmed the optimized FlR radiating computerized program. In this research, we designed the eletronic circuit f3r interfacing with human body to diagnosis and treatment with FIR sensor which radiated FIR wavelength optimized.

• The Journal of the Korea institute of electronic communication sciences
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• v.11 no.7
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• pp.665-670
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• 2016

In this paper, we suggest the design of OP-AMP using MOSFET in the operation of sub-threshold condition as a basic unit of an IoT. The sub-threshold operation of MOSFET is useful for an ultra low power consumption of sensor network system in the IoT, because it cause the supply voltage to be reduced. From the simulation result using 0.35 um CMOS process, the supply voltage, VDD can be reduced with 0.6 V, open-loop gain of 43 dB and the power consumption was evaluated with about $1.3{\mu}W$ and the active size for an integration was measured with $64{\mu}m{\times}105{\mu}m$. It is expected that the proposed circuit is applied to the low power sensor network for IoT.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.178-178
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• 2010

With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.1C
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• pp.48-58
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• 2002

As internet traffic increases, the problem that it should be efficiently accepted in to the existing voice network in the pending problem importantly to the existing communication corporations. The feature of next generation exchange network is made up of the form of integration network that connect data traffic(internet service. Etc) with the existing voice network and it can be showed with very diverse aspects according to the constitution time of network or the characteristics of business. The progress strategy that develop the existing circuit based communication network into packet-based communication network can be divided into two in a large scale according to the application position These are VoDSL application method(Technology that packetize access network) and softswitch technology application method(after packetizing relay network, packetizing that into the access network). In this paper, we will deduce the desirable technology that can construct packet-based next generation exchange networks in the structure of the existing communication network environment. We will perform the research on a device to offer the necessary core technique VoSDL service with realistic resolutions primarily.

• The Journal of the Korea Contents Association
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• v.6 no.12
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• pp.40-49
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• 2006

As a promising integrated circuit, wireless communication and micro-computing technology, the technology of sensor network that will lead the information technology industries of the next generation and realize the ubiquitous computing is one of the most active research topics and its research activities are also making today. From now on, each node, the network formation, and even the sensor network itself will interact with the generic network and evolve dynamically according to environmental changes in a process of continual creation and extinction. Therefore, address-internetworking between sensor network and generic network which are used different address mechanism is required. In this paper, we propose a static address-internetworking scheme for interactive networking between a sensor network and the Internet. The proposed scheme that possess a gateway approach to perform the protocol translation from one protocol to another, an overlay approach to constructs an overlay network on the WSNs and enables static internetworking between a sensor network address scheme based on Zigbee and the Internet address scheme based on the Internet Protocol. In addition, we verify the proposed scheme by an interconnection experiment.

• Journal of Biomedical Engineering Research
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• v.31 no.4
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• pp.292-301
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• 2010

To restore visual sensation of blind patients, we have proposed a fully implantable retinal prosthesis comprising an three dimensionally (3D) stacked retinal chip for transforming optical signal to electrical signal, a flexible cable with stimulus electrode array for stimulating retina cells, and coupling coils for power transmission. The 3D stacked retinal chip is consisted of several LSI chips such as photodetector, signal processing circuit, and stimulus current generator. They are vertically stacked and electrically connected using 3D integration technology. Our retinal prosthesis has a small size and lightweight with high resolution, therefore it could increase the patients` quality of life (QOL). For realizing the fully implantable retinal prosthesis, we developed a retinal prosthesis module comprising a retinal prosthesis chip and a flexible cable with stimulus electrode array for generating optimal stimulus current. In this study, we used a 2D retinal chip as a prototype retinal prosthesis chip. We fabricated the polymide-based flexible cable of $20{\mu}m$ thickness where 16 channels Pt stimulus electrode array was formed in the cable. Pt electrode has an impedance of $9.9k{\Omega}$ at 400Hz frequency. The retinal prosthesis chip was mounted on the flexible cable by an epoxy and electrically connected by Au wire. The retinal prosthesis chip was cappted by a silicone to pretect from corrosive environments in an eyeball. Then, the fabricated retinal prosthesis module was implanted into an eyeball of a rabbit. We successfully recorded electrically evoked potential (EEP) elicited from the rabbit brain by the current stimulation supplied from the implanted retinal prosthesis module. EEP amplitude was increased linearly with illumination intensity and irradiation time of incident light. The retinal prosthesis chip was well functioned after implanting into the eyeball of the rabbit.