• Design & Manufacturing
• /
• v.18 no.2
• /
• pp.1-8
• /
• 2024

Unlike the roll-to-roll process that uses a steel roll and a nip roll, a vacuum roll can hold and transfer a thin film using a single roll. To precisely manufacture a vacuum roll, a thin outer cylinder must be machined, which is assembled on the outside of the roll and contacts the film via vacuum pressure. In this study, the effects of jaw width and chucking force on the deformation of the outer cylinder during the turning process were investigated using analysis, and a precision machining and burr removal process was developed. The deformation of the outer cylinder decreased almost linearly with increasing jaw width and increased with higher chucking force and larger cylinder diameter. Additionally, the deflection due to the weight of the outer cylinder was approximately three times greater than that caused by film tension. For the machined outer cylinder, a burr removal experiment was conducted, and concentricity and cylindricity were measured. Using a device that removes burrs by rotating a wheel connected to the main shaft at high speed, it was found that burrs generated on the inner diameter could be removed very efficiently. On the vacuum side, the concentricity errors of the inner and outer diameters were 0.015 mm and 0.014 mm, respectively, and on the opposite side, they were 0.006 mm and 0.010 mm, respectively. Additionally, the measurement of Total Indicator Runout (TIR) according to the angle showed that the maximum cylindricity of the outer and inner diameters was 0.02 mm and 0.025 mm, respectively. Finally, through burr-height measurement at the hole boundary, it was found that the heights were within 0.05 mm.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.11 no.2
• /
• pp.17-23
• /
• 2002

A cylindrical capacitance-type spindle displacement sensor was developed and its effectiveness as a system to monitor cutting forces during hard turning was tested in this research. The sensor was installed between the face of spindle cover and the chucking element and measured pure radial motion of the spindle under the condition with presence of roundness error at measured surface. To prove the effectiveness of the developed system hard aiming tests using ceramic inserts and tool steel as workpiece were conducted. The workpiece was hardened up to 65 Rc. The variations of pure radial motion of the spindle ware measured during the cutting tests. The signals from the sensor showed the same pattern of cutting force variations from the tool dynamometer due to the progress of tool wear. As the flank wear of the ceramic tool increased both static component of cutting forces and the amount of center shift of spindle orbit increased, Results from the research showed that the developed sensor could be utilized as an effective and cheap on-line sensing device to monitor cutting conditions and tool performance in the un-manned machining center.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.21-23
• /
• 2011

Uniformity of plasma etching processes critically depends on the wafer temperature and its distribution. The wafer temperature is affected by plasma, chucking force, He back side pressure and the surface temperature of ESC(electrostatic chuck). In this work, 3D mathematical modeling is used to investigate the influence of the geometry of coolant path and the temperature distribution of the ESC surface. The model that has the coolant path with less change of the cross-sectional area and the curvature shows low standard deviation of the ESC surface temperature distribution than the model with the coolant path of the larger surface area and more geometric change.

• Journal of the Semiconductor & Display Technology
• /
• v.11 no.2
• /
• pp.71-74
• /
• 2012

Uniformity of the wafer temperature is one of the important factors in etching process. Plasma, chucking force, backside helium pressure and the surface temperature of ESC(electrostatic chuck) affect the wafer temperature. ESC consists of several layers of structure. Each layer has own thermal resistance and the Si-adhesive layer has highest thermal resistance among them. In this work, the temperature distribution of ESC was analyzed by 3-D FEM with various defects and the thickness deviation of the Si-adhesive layer. The result with Si-adhesive layer with the low center thickness deviation shows modified temperature distribution of ESC surface.

• Advances in robotics research
• /
• v.1 no.1
• /
• pp.1-19
• /
• 2014

Microgripper is an essential device in the micro-operation system. It can convert other types of energy into mechanical energy and produce clamp movement with required chucking force, which enables it a broad application prospect in the domain of tiny components' processing and assembly, biomedicine and optics, etc. The performance of a microgripper is dependent on its power supply, type of drive, mechanism structure, sensing components, and controller. This paper presents a state-of-the-art survey of recent development on flexure-based microgrippers. According to the drive type, the existing microgrippers can be mainly classified as electrostatic microgripper, electrothermal microgripper, electromagnetic microgripper, piezoelectric microgripper, and shape memory alloy microgripper. Additionally, some different mechanisms, sensors, and control methods that are used in microgripper system are reviewed. The key issue of how to choose those components in microgripper system design is also addressed.