• Journal of the Korea Academia-Industrial cooperation Society
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• v.4 no.4
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• pp.361-365
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• 2003

A unipolar-type E-chuck was fabricated for the application of holding silicon wafers in the oxide etcher. For the fabrication of the unipolar ESC, core technologies such as coating of polyimide films and anodizing treatment of aluminum surface were developed. The polyimide films were prepared on thin coated copper substrates to minimize the plasma damage during the etch processing. Thin film heater technology was also developed for new type of E-chuck.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.44-48
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• 1996

This paper describes the effects of thermal deformation in electromagnetic chuck on the grinding accuracy. Gringing process is the last machining process and decisive in saving past other machining cost. The thermal deformation of grinding machine is unavoidable and affect seriously ginding accuracy. The thermaldeformation of electromagnetic chuck is one of important thermal problems. Heat generation of magnetic chuck is analyzed and measured. The temperature disturibution in chuck is elliptical form with high temperature in center of chuck. The thermal deformation form of chuck is changed with time to mountain form. The grinding experiment shows that the thermal deformation of magnetic chuck influence strongly machining accuracy as much as the headstock

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.85-89
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• 2018

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials and inner coolant path on the chuck surface. Finally this study suggests the best cooling condition of electrostatic chuck.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.1
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• pp.20-25
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• 2016

Recently, the requirements for high precision and efficiency machining are gradually increased to raise international competitiveness at the industrial fields of automotive and gears. This trend had made effects on the industrial fields in Korea and which needs further studying of high accuracy and efficiency machining. This study is to investigate the effects of Jig type chuck for roundness improvement in CNC turning machining of high stage speed gear. After hobbing machining, Dimensional change before and after heat treatment was very largely generated. In order to solve this problem was to develop a jig type chuck. After the heat treatment, the operation of the chuck which was the most distinguished equipment among Jig type chuck(0.006mm), Scroll type chuck(0.05mm) and Bolt type chuck(0.04mm). Therefore, Jig type chuck was satisfied the requirement from the actual field(0.02mm).

• Journal of the Semiconductor & Display Technology
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• v.8 no.1
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• pp.1-5
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• 2009

Typically, single-wafer wet etching is done by dispensing chemical onto the front and back side of spin wafer. The wafer is fixed by a number of chuck pins, which obstruct the chemical flow and would result in the incomplete removal of the remaining film, which can become a source of contamination in the next process. In this paper, we introduce a novel design of wafer chuck, in which chuck pins are groupped into two and each group of pins fixes the substrate alternatively. Two groups of chuck pins fix the high-speed spin substrate with non contact method using a magnetic material. The actual process has been executed to observe the effectiveness of this new wafer chuck. It was found that the new wafer chuck performed better than the conventional wafer chuck for removing the remaining film from the bevel and edge side of substrate.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.3
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• pp.107-113
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• 1999

The purpose of this study is to analyze multi-size power chuck which can chuck work pieces having various sizes automatically and be used suitably to an exclusive product line in the field of automotive industry. Gripping force, accuracy, and stiffness about the chuck are especially considered for the analysis. MSC/NASTRAN software is used for FEM analysis. Also, the effects of centrifugal force which occurs when chuck body rotates and compressive stresses which occur at contacting area in between chuck body and collet are estimated.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.337-337
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• 2000

This paper describes a Chuck System developed for scaling PDP gas hole on PDP panel glass. There are lots of constraints for designing Chuck System: high temperature, high vacuum, precious motor control etc. A such constraints was considered by design of structure and by selecting of parts and material for Chuck System. The Chuck System was manufactured and assembled after the design process. It was applied on the PDP process unit. For sealing POP hole, precious control of a step motor was important in this system. For this experiment, a step motor, motor driver and micro controller(80196KC) were used.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.116-120
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• 2017

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.5
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• pp.90-95
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• 1999

Chucking for workpieces is very important for productivity and efficiency in lathe operations. In point of productivity top jaws of the chuck should be changed as quickly as possible in order to reduce idle times wherever workpieces are regripped. A quick change power chuck which can change top jaws quickly by using a jaw change handle without any assembly/disassembly processes of screws is analyzed for this study. strength and stiffness of top jaws by centrifugal force are considered for the design. Structural analysis for the chuck is executed and the finite element method is introduced using MSC/NASTRAN software. Also, the performance of the chuck is evaluated by experiments.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.362-362
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• 2010

최근 반도체 산업은 지속적인 design rule 감소로 인해 미세 pattern 공정이 요구되고 있으며, 그 중 photo lithography 공정의 scanner overlay margin 확보가 시급하게 되었다. 본 연구는 scanner 장비의 overlay 능력 개선 item 발굴에 관한 연구로서 6개월간 해당 장비에 대해 overlay monitor를 평가하여 scanner의 기계적 요소가 주는 overlay 영향 기인성 최악의 다섯 가지 budget item을 도출하였다. 본 연구를 통해 도출 된 최악의 다섯 가지 budget item(chuck 간 생김 정도 오차, chuck 간편차, chuck 간 mirror 생길 정도 오차, stage 정확성, 마스크 정렬) 성분들을 monitoring 함으로써 overlay 향상에 크게 기여할 것으로 예상한다.