• Journal of Biomedical Engineering Research
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• v.12 no.3
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• pp.209-214
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• 1991

Digital fetal monitoring system based on the personal computer combined with the digital signal processing (DSP) board was implemented. The DSP board acquires and digitally processes ultra- sound fetal Doppler signal for digital signal conditioning, rectification, low -pass filtering, autocorrealtion function calculation and its peak detection. The personal computer interfaced with the DSP board is in charge of graphic display, hardcopy, data transmission and on -line analysis of fetal heart rate change including on - line warning system, base -line estmation, acceleration, deceleration and variability. It is one of the most suitable situation to apply the DSP chip for siganl conditioning, digital filtering of ultrasound fetal Dopier signal and fetal heart rate estimation using autocorrelation technique .

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• International Journal of Aerospace System Engineering
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• v.1 no.1
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• pp.44-47
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• 2014

This study proposes a development for the nano silver adhesive, which is applicable to high efficiency LED(light-emitting diode) light. The important issue of LED light is heat exhaust from LED. Generally, the middle area of LED light is increased up to 380K. Therefore, the bottleneck between LED chip and heat sink are caused by high temperature. In this work, the adhesive material between LED Chip and heat sink was newly developed for improvement of bottleneck. The nano silver was adopted to solve heat problem of chip on board package for LED light. In order to evaluate the performance of the nano silver adhesive, the thermal analysis was performed. Moreover both adhesive performance and heat exhaust were verified through the prototype test. From the experimental test results, it is found that the developed nano silver adhesive has the high performance.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.25 no.2
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• pp.259-266
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• 2021

USB bus not only works with convenience but also transmits data fast and becomes a standard peripheral interface between FPGA development board and personal computer. In this paper FPGA verification system with slave FIFO interface for Cypress FX3 USB 3 bridge chip was implemented. The designed slave FIFO interface consists of host interface module based on FIFO structure, master bus controller and command decoder and supports streaming communication interface for FX3 bridge chip and memory-mapped input and output interface for user design circuit. The ZestSC3 board with Cypress FX3 USB 3 bridge chip and Xilinx Artix FPGA(XC7A35T-1C5G3241) was used to implement FPGA verification system. It was verified that the FPGA verification system for user design circuit operated correctly under various clock frequencies using GUI software developed by visual C# and C++ DLL. The designed slave FIFO interface for FPGA verification system has modular structure and can be applicable to the different user designs with memory-mapped I/O interface.

• Proceedings of the KOSOMBE Conference
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• v.1996 no.11
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• pp.273-276
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• 1996

In the Total Artificial Heart (TAH) and Ventricular Assist Device (VAD), the size implanting the internal controller into human body is very serious problem. Hence, we need the size reduction of that controller for safe implantation. Using PSD302 chip for microcontroller-based applications, we could decrease the number of components in the digital control board and miniaturize the digital control board. We could replace a ROM, RAM, and a latch with that single chip, so the size of the newly developed board could be half the previous board.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.7-14
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• 2017

The effect of high temperature-moisture on corrosion and mechanical properties for Sn-0.7Cu, Sn-3.0Ag-0.5Cu (SAC305) solders on flexible substrate was studied using Highly Accelerated Temperature/Humidity Stress Test (HAST) followed by three-point bending test. Both Sn-0.7Cu and SAC305 solders produced the internal $SnO_2$ oxides. Corrosion occurred between the solder and water film near flexible circuit board/copper component. For the SAC305 solder with Ag content, furthermore, octahedral corrosion products were formed near Ag3Sn. For the SAC305 and Sn-0.7Cu solders, the amount of internal oxide increased with the HAST time and the amount of internal oxides was mostly constant regardless of Ag content. The size of the internal oxide was larger for the Sn-0.7Cu solder. Despite of different size of the internal oxide, the fracture time during three-point bending test was not significantly changed. It was because the bending crack was always initiated from the three-point corner of the chip. However, the crack propagation depended on the oxides between the flexible circuit board and the Cu chip. The fracture time of the three-point bending test was dependent more on the crack initiation than on the crack propagation.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.401-407
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• 2014

There are increasing interests in COB (Chip On Board) that densely arranged many LED chips on one board in order to solve the heat issue. There are many problems being on the rise: the lifespan decreases as the temperature of LED devices increases; Red Shift phenomenon, in which wave length of spectral line moves from original wave length to long wave length, occurs; and optical power decreases as $T_j$ increases. In order to resolve such problems, this study selected the optimum thickness and length of Fin, planned the second Heat sink that is optimum for COB LED with 15W, and analyzed thermal mode by Solid Works Flow Simulation through 15W COB packaging with the planned Heat sink. 15W COB down-light Heat sink that is produced based on this analysis was utilized to analyze thermal mode through contact thermometer and electrical properties through Kelthley 2430.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.1
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• pp.215-221
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• 2016

In this thesis we introduce a large quantity of input interface system using a low cost single chip microcontroller which is consists of walking board with 1600 switches, RS485 communication for switch data communication and PC application software for walking pattern analysis. When a pedestrian walks on the walking board, the pattern analysis of foot pressed switches can be utilized on diverse divisions of sports and industry such as walking physical therapy, dancing, a large quantity of sensors interface system, etc.