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http://dx.doi.org/10.5781/JWJ.2017.35.3.2

Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints  

Kim, Jeonga (Department of Materials Science and Engineering, Pusan National University)
Park, Yujin (Department of Materials Science and Engineering, Pusan National University)
Oh, Chul Min (Components and Materials Physics Research Center, Korea Electronic Technology Institute)
Hong, Won Sik (Components and Materials Physics Research Center, Korea Electronic Technology Institute)
Ko, Yong-Ho (Microjoining Center, Korea Institute of Industrial Technology)
Ahn, Sungdo (Microjoining Center, Korea Institute of Industrial Technology)
Kang, Namhyun (Department of Materials Science and Engineering, Pusan National University)
Publication Information
Journal of Welding and Joining / v.35, no.3, 2017 , pp. 7-14 More about this Journal
Abstract
The effect of high temperature-moisture on corrosion and mechanical properties for Sn-0.7Cu, Sn-3.0Ag-0.5Cu (SAC305) solders on flexible substrate was studied using Highly Accelerated Temperature/Humidity Stress Test (HAST) followed by three-point bending test. Both Sn-0.7Cu and SAC305 solders produced the internal $SnO_2$ oxides. Corrosion occurred between the solder and water film near flexible circuit board/copper component. For the SAC305 solder with Ag content, furthermore, octahedral corrosion products were formed near Ag3Sn. For the SAC305 and Sn-0.7Cu solders, the amount of internal oxide increased with the HAST time and the amount of internal oxides was mostly constant regardless of Ag content. The size of the internal oxide was larger for the Sn-0.7Cu solder. Despite of different size of the internal oxide, the fracture time during three-point bending test was not significantly changed. It was because the bending crack was always initiated from the three-point corner of the chip. However, the crack propagation depended on the oxides between the flexible circuit board and the Cu chip. The fracture time of the three-point bending test was dependent more on the crack initiation than on the crack propagation.
Keywords
Lead-free; Solder joint; Corrosion; Three-point bending; Flexible circuit board;
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Times Cited By KSCI : 3  (Citation Analysis)
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