• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.3
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• pp.28-39
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• 1994

We experimented on memory multichip modules to increase the packing density of memory devices and to improve their electrical characteristics. A 128K$\times$8bit SRAM module was made of four 32K$\times$8bit SRAM memory chips. The memory multichip module was constructed on a low-cost double sided PCB(printed circuit boared) substrate. In the process of fabricating a multichip module. we focused on the improvement of its electrical characteristics. volume, and weight by employing bare memory chips. The characteristics of the bare chip module was compared with that of the module with four packaged chips. We conducted circuit routing with a PCAD program, and found the followings: the routed area for the module with bare memory chips reduced to a quarter of that area for module with packaged memory chips. 1/8 in volume, 1/5 in weight. Signal transmission delay times calculated by using transmission line model was reduced from 0.8 nsec to 0.4 nsec only on the module board, but the coupling coefficinet was not changed. Thus, we realized that the electrical characteristics of multichip packages on PCB board be improved greatly when using bare memory chips.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.7
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• pp.83-90
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• 2004

This paper describes on-board decentralized data acquisition system that acquires and encodes the numerous sensor data distributed on the big flight vehicles efficiently. The system's sub-units which have one encoder unit and several remote units were designed and simulated according to the communication protocols and the control, sequence logics based on the FPGA chip. And we have made the functional verification of the acquisition, collection and formatting of remote analog and digital data for the manufactured hardwares.

• Nuclear Engineering and Technology
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• v.54 no.11
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• pp.3985-3995
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• 2022

The emergence of new nanoscale technologies has imposed significant challenges to designing reliable electronic systems in radiation environments. A few types of radiation like Total Ionizing Dose (TID) can cause permanent damages on such nanoscale electronic devices, and current state-of-the-art technologies to tackle TID make use of expensive radiation-hardened devices. This paper focuses on a novel and different approach: using machine learning algorithms on consumer electronic level Field Programmable Gate Arrays (FPGAs) to tackle TID effects and monitor them to replace before they stop working. This condition has a research challenge to anticipate when the board results in a total failure due to TID effects. We observed internal measurements of FPGA boards under gamma radiation and used three different anomaly detection machine learning (ML) algorithms to detect anomalies in the sensor measurements in a gamma-radiated environment. The statistical results show a highly significant relationship between the gamma radiation exposure levels and the board measurements. Moreover, our anomaly detection results have shown that a One-Class SVM with Radial Basis Function Kernel has an average recall score of 0.95. Also, all anomalies can be detected before the boards are entirely inoperative, i.e. voltages drop to zero and confirmed with a sanity check.

• Journal of the Korean Wood Science and Technology
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• v.36 no.1
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• pp.79-87
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• 2008

Many researchers have studied on rooftop greening that can be installed in abandoned spaces on a building roof. The most important issue in rooftop greening is the soil weight problem. The light greening materials are needed to solve this problem. Therefore, many alternative materials against the soil were investigated for rooftop greening. In this study, the waste wood chips and the waste paper slurry were evaluated as the lightweight vegetation foundation for rooftop greening. It also has a meaning for recycling of waste materials. The mixture ratio of waste wood chips to waste paper slurry for the board (the foundation of greening) was 60 to 40. The wet strength resin and the sizing agent were additionally added with different amount. After the forming of the board, physical and chemical properties were tested with the variation of wet strength resin and sizing agent. As the result of the test, the board with 15% of wet strength resin in the wet condition showed the highest strength. Futhermore, the moisture evaporation loss from the board surface with sizing agent was much lower than that from the board without sizing agent. Therefore, it was clear that the sizing agent was effective for water retention. The change of thickness in the wet condition was less than 1 mm, and it showed that the board is the predominant material on the dimensional stability. The average pH value of the board was ranged from 7.6 to 8.25.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.11a
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• pp.930-935
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• 2005

In order to synthesis of the materials and modulus for floor impact sound reduction, we investigated effect on dynamic elastic modulus of floor impact sound reduction materials and module made by inorganic porous materials, EVA chips and so on. We find correlation property between dynamic elastic modulus and light-weight impact noise. And we measured the dynamic elastic modulus of materials and module for floor impact sound reduction. And we predicted reduction efficiency on floor Impact Noise of those. The dynamic elastic modulus is reduced by increase of filler contents and filler species. When the materials for floor impact sound reduction is consisted of l5wt% EVA Chip and l5wt% inorganic porous materials, its dynamic elastic material is the lowest. And when the module is consisted of PE (upper side), PS embossing board(lower side) and the materials for floor impact sound reduction(middle), its dynamic elastic material is the lowest.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.4
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• pp.737-746
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• 2009

In this study, we have developed one chip system IC for preventing the overload, detecting an abnormal conditions, and controlling the fire prevention in the intelligent home appliances. For the purpose, a circuit detectable an electric leak for preventing an electric shock, and a circuit detectable arc that has effect directly on the fire are designed. The circuits designed on every block are verified by comparing simulation with bread-boarding using a standard transistors. The system IC is fabricated by using 34 V 2 metal $1.5{\mu}m$ bipolar transistor process from evaluation results. The electrical performances of IC application circuits and the system IC equipped on PCB board are evaluated. It is confirmed that the system IC is well operated for arc and ground fault(GF) signal.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.265-271
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• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.719-720
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• 2006

In the mechanical system, optimization of motion control is very essential in the aspect of automation technique progress. In the servo system, the function of controller is very important but most of the controllers have played only the role of pulse generator because the controller with main function is very expensive. In this thesis, the system was composed of PC, commonly used driver AC servo motor and a produced control board. The PC transmit a gain, a locus data to a driver and controller. At the same time, it converts imformation from the controller and convert them into data and offer an output with graph. The role of a controller is to trasmit a locus data to a driver and counting the pulse on the phase of an encoder to the PC. We have performed the experiment in order to confirm with variable PID parameter capable of the optimization of gain tuning with the counting of feedback control sensor signal with regard to the external interface into the system, such as torque. Based on the experiment result, we have confirmed as follows: First, it was confirmed that we could easily input control factors P.I Gain, constant $K_P,\;K_I$ into PC. Second, not only pulse generator function was possible, but with this pulse it was also possible to count using software with PIC chip. And third, using the multi-purpose PIC micro chip, simple operation and the formation of small size AC Servo Controller was possible.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.4
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• pp.494-502
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• 2001

GPS(Global Positioning System) and GLONASS(GLObal Navigation Satellite System) are basic technologies providing the information of the position and the time, and they have various applications such as navigation, survey, control, and so on. However, each GPS and GLONASS has limited number of visible satellites, and, from the view of strategy, it is undesirable to be heavily dependent on only one system. Thus, GPS/GLONASS combined receiver became required to obtain more precise navigation and system stability. In this paper, the RF front end of GPS/GLONASS combined receiver was fabricated on 130$\times$80 $\textrm{mm}^2$ PCB(Printed Circuit Board), and its system application was shown finally one chip possibility of GLONASS receiver is studied.

• Nuclear Engineering and Technology
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• v.50 no.8
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• pp.1298-1305
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• 2018

The use of System-on-Chip (SoC) solutions in the design of on-board data handling systems is an important step towards further miniaturization in space. However, the Total Ionizing Dose (TID) and Single Event Effects (SEE) characterization of these complex devices present new challenges that are either not fully addressed by current testing guidelines or may result in expensive, cumbersome test configurations. In this paper we report the test setups, procedures and results for TID testing of a SoC microcontroller both using standard $^{60}Co$ and low-energy protons beams. This paper specifically points out the differences in the test methodology and in the challenges between TID testing with proton beam and with the conventional gamma ray irradiation. New test setup and procedures are proposed which are capable of emulating typical mission conditions (clock, bias, software, reprogramming, etc.) while keeping the test setup as simple as possible at the same time.