• 한국정밀공학회지
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• 제29권3호
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• pp.261-265
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• 2012

In this study, glassy carbon was ground for lens core of glass mold press. Ultraprecision grinding process was applied for machining of core surfaces. During the process, brittle crack occurred because of hard-brittleness of glassy carbon. Author investigated optimized grinding conditions from the viewpoint of ductile mode grinding. Geometrical undeformed chip thickness was adopted for critical chip thickness that enables crack free surface. Machined cores are utilized for biaspheric glass lens fabrication and surfaces of lens were compared for verification of ground surface.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 추계학술대회 논문집
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• pp.16-21
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• 2004

As a new approach to analyze grinding energy, this paper introduces a specific grinding energy model based on the average grain. Using this model, grinding characteristics such as radial and tangential forces, specific grinding energy of SM45C were investigated altering grinding variables such as workpiece velocity(v) and apparent depth of cut(Z) in down-surface grinding. From the experimental results, there is no significant difference between the radial, tangential forces and vertical. horizontal forces because of small contact angle between wheel and workpiece. The specific grinding energy decreases as the maximum undeformed chip thickness increases. But, there is much difference between the specific grinding energies of the existing and the proposed model.

• 한국기계가공학회지
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• 제11권4호
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• pp.7-12
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• 2012

The cutting force for peripheral end-milling considering run-out property was estimated and its result was compared with that of measured one. An experimental coefficient modelling was used for the formulation of theoretical end-milling force by considering the specific cutting force coefficient. Also, the specific cutting force, that is the multiplication of specific cutting force coefficient and uncut chip thickness, was used for the prediction of end-milling force. The end-milling force mechanics with run-out was presented for the estimation of theoretical force in peripheral end-milling by considering the geometric shape of the workpiece part. As a result, the estimated end-milling force shows a good consistency with the measured one. And it can be used for the prediction of force history in end-milling with run-out which incurs different start and exit immersion angle in entering and exiting condition.

• Transactions on Electrical and Electronic Materials
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• 제2권3호
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• pp.28-32
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• 2001

It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2005년도 춘계학술대회 논문집
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• pp.319-323
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• 2005

As a new approach to analyze grinding energy, this paper introduces a specific grinding energy model based on the average grain. Using this model, grinding characteristics such as specific grinding energy of SM45C were investigated with changing variables such as grain size, workpiece velocity(v) and apparent depth of cut(Z) in down-surface grinding. From the experimental results, the specific grinding energy decreases as the maximum undeformed chip thickness increases. And also the specific grinding energy increases as the grit size increases.

• 한국공작기계학회논문집
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• 제14권4호
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• pp.61-68
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• 2005

As a new approach to analyze grinding energy, this paper introduces a specific grinding energy model based on the average grain. Using this model, grinding characteristics such as radial and tangential forces, specific grinding energy of SM45C were investigated with changing grinding variables such as workpiece velocity(v) and apparent depth of cut(Z) in down-surface grinding. From the experimental results, the specific grinding energy decreases as the maximum undeformed chip thickness increases. And there is no significant difference between the specific grinding energies of the existing and the proposed model.

• 한국주거학회:학술대회논문집
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• 한국주거학회 2002년도 추계학술발표대회
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• pp.237-332
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• 2002

We constructed ceiling structure and floor structure for elevation of sound insulation performance of concrete slab of apartment house. And, we wished to measure heavy floor impact sound level and light floor impact sound level of these structure. As the result, light floor impact sound level interception performance of concrete slab was measured by thing that construction work of gypsum baud is important. Heavy floor impact sound level interception performance was measured by thing that it is effective that construct to thickness about 30 millimeters on concrete Slav. It was measured effectively that heavy floor impact sound level interception performance constructs rubber chip to thickness about 30 millimeters on concrete Slav.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.1004-1007
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• 2005

As a new approach to analyze grinding energy, this paper introduces a specific grinding energy model based on the average grain. Using this model, grinding characteristics such as specific grinding energy of SM45C were investigated with changing variables such as grain size of CBN, workpiece velocity(v) and apparent depth of cut(Z) in down-surface grinding. From the experimental results, the specific grinding energy decreases as the maximum undeformed chip thickness increases.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.323-324
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• 2008

• 소음진동
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• 제9권3호
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• pp.477-484
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• 1999

This study aims to present proper thickness of resilient mount and pattern of chips for the improvement of impact sound isolation. To achieve this aim, field tests were performed to evaluate the performance of impact sound isolation of pilot samples using waste tire chips against light and heavy-weight impacter, which samples were installed over concrete slabs of an apartment housing. In this study, the experiments were performed by the impact sound level of floors in KS F 2810 "Method for field measurement of floor impact level". As results, a flooring structure using waste tire chips as a resilient mount, with no relation to chip's types, has enhanced performance by 1~2 degree in light impact sound isolation, while it has improvement in heavy impact sound isolation. And fiber-type chips have better performance than granule-type ones when they overlaid concrete slab with 15~20 mm of thickness. For the improvement of impact sound isolation, it is recommended that insulating materials should be applied at joints between floating floors and walls, or floating floors and a doorframes, and also waterproof papers should be used for the effective thickness of resilient mount.ent mount.