A Study on the Sound Insulation Performance Elevation of Floor Structure that use Rubber chip in Apartment House

고무칩을 이용한 공동주택 바닥구조의 차음성능 향상에 관한 연구

We constructed ceiling structure and floor structure for elevation of sound insulation performance of concrete slab of apartment house. And, we wished to measure heavy floor impact sound level and light floor impact sound level of these structure. As the result, light floor impact sound level interception performance of concrete slab was measured by thing that construction work of gypsum baud is important. Heavy floor impact sound level interception performance was measured by thing that it is effective that construct to thickness about 30 millimeters on concrete Slav. It was measured effectively that heavy floor impact sound level interception performance constructs rubber chip to thickness about 30 millimeters on concrete Slav.