• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2000년도 춘계학술대회 논문집
• /
• pp.902-906
• /
• 2000

In end milling process the undeformed chip thickness and the cutting force components vary periodically with phase change of the tool. In this study, up end milling process is transformed to the equivalent oblique cutting. The varying undeformed chip thickness and the cutting force components in end milling process are replaced with the equivalent average ones. Then it can be possible to analyze the chip-tool friction and shear process in the shear plane of the end milling process by the equivalent oblique cutting model. According to this analysis, when cutting SM45C steel. 82% of the total energy is consumed in the shear process and the balance is consumed in the friction process.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2000년도 추계학술대회논문집A
• /
• pp.724-729
• /
• 2000

In end milling process the undeformed chip thickness and the cutting force components vary periodically with phase change of the tool. In this study, up end milling process is transformed to the equivalent oblique cutting. The varying undeformed chip thickness and the cutting force components in end milling process are replaced with the equivalent average ones. Then it can be possible to analyze the chip-tool friction and shear process in the shear plane of the end milling process by the equivalent oblique cutting model. According to this analysis, when cutting SM45C steel, 72% of the total energy is consumed in the shear process and the balance is consumed in the friction process.

• 대한기계학회논문집A
• /
• 제25권10호
• /
• pp.1520-1527
• /
• 2001

In end milling process the undeformed chip thickness and the cutting force components vary periodically with phase change of the tool. In this study, up end milling process is transformed to the equivalent oblique cutting. The varying undeformed chip thickness and the cutting force components in end milling process are replaced with the equivalent average ones. Then it can be possible to analyze the chip-tool friction and shear process in the shear plane of the end milling process by the equivalent oblique cutting model. According to this analysis, when cutting SM45C steel, 72% of the total energy is consumed in the shear process and the balance is consumed in the friction process.

• 마이크로전자및패키징학회지
• /
• 제14권3호
• /
• pp.57-64
• /
• 2007

Si 칩에 박막히터를 형성하고 이에 전류를 인가하여 LCD (liquid crystal display) 패널의 유리기판은 가열하지 않으면서 Si 칩만을 선택적으로 가열함으로써 Si 칩을 LCD 패널의 유리기판에 실장 하는 새로운 COG 공정기술을 연구하였다. $5\;mm{\times}5\;mm$ 크기의 Si 칩에 마그네트론 스퍼터링법으로 폭 $150\;{\mu}m$,두께 $0.8\;{\mu}m$, 전체 길이 12.15 mm의 정방형 Cu 박막히터를 형성하였으며, 이에 0.9A의 전류를 60초 동안 인가하여 Si칩의 Sn-3.5Ag 솔더범프를 리플로우 시킴으로써 Si 칩을 유리기판에 COG 본딩하는 것이 가능하였다.

• 한국정밀공학회지
• /
• 제22권4호
• /
• pp.76-83
• /
• 2005

With the acceleration of the miniaturization of products, especially in recent years, machining technologies for these products is in need of improvement. Conventional technologies have limitations in realizing the miniaturization due to the downsizing effects of the tools, which lack sufficient cutting stiffness during machining. The application of ultrasonic vibration is one of the most useful solutions in dealing with the problem. This study focused on the difference of ultrasonic drilling from conventional one in geometrical machining mechanism and the corresponding machining results. In detailed, some mathematical equations for drill cutting edge paths during drilling were extracted and new method to find uncut chip thickness from above equations was suggested. The experiments were carried out through the comparison between the results (disposed chips and internal surface states of holes) of conventional drilling and those of ultrasonic drilling. It was determined that the geometrical paths of cutting edges and analyzed uncut chip thickness agree with the appearance of disposed chips. Furthermore, the change in tool path by ultrasonic vibration resulted in the improvement of surface statement.

• Journal of Welding and Joining
• /
• 제20권4호
• /
• pp.498-504
• /
• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

• 한국정밀공학회지
• /
• 제12권9호
• /
• pp.148-155
• /
• 1995

The object of this study is to achieve a gteater understanding of meterial removal process and its mechanism. In this study, some applications of finite element techniques are applied to analyze the chip formation and cutting heat generation mechanism of metal cutting. To know the effect of cutting parameters, simulations employed some independent cutting variables change, such as constitutive deformation laws of workpiece and tool material, frictional coefficients and tool-chip contact interfaces, cutting speed, tool rake angles, depth of cut and this simulations also include large elastic-plastic defor- mation, adiabetic thermal analysis. Under a usual plane strain assumption, quasi-static, thermal-mechanical coupling analysis generate detailed informations about chip formation process and cutting heat generation mechanism Some cutting parameters are affected to cutting force, plastic deformation of chip, shear plane angle, chip thickness and tool-chip contact length and reaction force on tool, cutting temperature and thermal behavior. Several aspects of the metal cutting process predicted by the finite element analysis provide information about tool shape design and optimal cutting conditions.

• 한국정밀공학회지
• /
• 제31권10호
• /
• pp.865-871
• /
• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• 마이크로전자및패키징학회지
• /
• 제12권4호통권37호
• /
• pp.315-321
• /
• 2005

교류자기장에 의한 유도가열체를 이용하여 LCD 평판 디스플레이 패널의 가열을 최소화하면서 IC 칩을 실장시킬 수 있는 COG 접속기술에 대해 연구하였다. 크기 5mm${\times}$5mm, 두께 $600{\mu}m$의 Cu 도금막으로 제조한 유도가열체에 14 kHz, 230 Oe의 교류자기장을 인가시 60초 이내에 유도가열체의 온도가 Sn-3.5Ag 무연솔더의 리플로우에 필요한 $250^{\circ}C$에 도달하였으며, 유도가열체로부터 2 mm 떨어진 부위에서부터 기판의 온도는 $100^{\circ}C$ 이하로 유지되었다. 이와 같은 Cu 도금막 유도가열체에 14 kHz, 230 Oe의 교류자기장을 120초 동안 인가하여 Sn-3.5Ag 솔더범프를 리플로우 시켜 COG 실장을 하는 것이 가능하였다.

• Design & Manufacturing
• /
• 제16권3호
• /
• pp.58-65
• /
• 2022

Micro-fluidic chip has been fabricated by lithography process on silicon or glass wafer, casting using PDMS, injection molding of thermoplastics or 3D printing, etc. Among these processes, 3D printing can fabricate micro-fluidic chip directly from the design without master or template for fluidic channel fabricated previously. Due to this direct printing, 3D printing provides very fast and economical method for prototyping micro-fluidic chip comparing to conventional fabrication process such as lithography, PDMS casting or injection molding. Although 3D printing is now used more extensively due to this fast and cheap process done automatically by single printing machine, there are some issues on accuracy or surface characteristics, etc. The accuracy of the shape and size of the micro-channel is limited by the resolution of the printing and printing direction or layering direction in case of SLM type of 3D printing using UV curable resin. In this study, the printing direction and thickness of each printing layer are investigated to see the effect on the size, shape and surface of the micro-channel. A set of micro-channels with different size was designed and arrayed orthogonal. Micro-fluidic chips are 3D printed in different directions to the micro-channel, orthogonal, parallel, or skewed. The shape of the cross-section of the micro-channel and the surface of the micro-channel are photographed using optical microscopy. From a series of experiments, an optimal printing direction and process conditions are investigated for 3D printing of micro-fluidic chip.