• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.144-149
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• 2013

In this research, we developed a biosensor to detect lung cancer-specific biomarker using Anodic Aluminum Oxide (AAO) chip based on interference and nano surface plasmon resonance (nanoSPR). The nano-porous AAO chip was fabricated $2{\mu}m$ of pore-depth by two-step anodizing method for surface uniformity. NanoSPR has sensitivity to the refractive index (RI) of the surrounding medium and also provides simple and label-free detection when specific antibodies are immobilized to the Au-deposited surface of nano-porous AAO chip. To detect the lung cancer-specific biomarker, antibodies were immobilized on the surface of the chip by Self Assembled Monolayer (SAM) method. Since then lung cancer-specific biomarker was applied atop the antibodies immobilized layer. The specific reaction of the antigen-antibody contributed to the change in the refractive index that cause shift of resonance spectrum in the interference pattern. The Limit of Detection (LOD) was 1 fg/ml by using our nano-porous AAO biosensor chip.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.1B
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• pp.62-67
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• 2010

Our research group has investigated that RFID tag packaging development and RFID tag flip chip bonding method influences on the industry-environmental customized RFID tag development that has applications to various industry environmental conditions. RFID tag flip chip bonding is consisting with wire bonding, ultrasonic bonding, heat plate bonding, and laser bonding and those methods are also depending on the different RFID tag development. Our research data shows that, among the various industrial environments such as an extremely high temperature, cryogenic, high-humidity, flexible, high-durable, development of RFID tag in an extremely high temperature is inappropriate for laser bonding method, converting of heat energy as absorbing light energy or heat plate bonding method of straight heat transferring manner, on the other hand, is suitable for wire bonding method which directly connect bump to pattern using wire.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.6
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• pp.518-521
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• 2019

In this paper, an active antenna module operating in the 60 GHz band is designed and fabricated by combining a commercial transmitter chip and patch array antenna. The designed module is composed of an antenna PCB and a PCB with a transmitter chip. The frequency-control and bias-control signals are applied to the transmitter chip, using an Arduino kit. A baseband I/Q signal is also applied to the chip. A ring hybrid balun converts the output of the transmitter module to a single output, which is the output of the transmitter chip that outputs a differential output. The output is delivered to the $2{\times}4$ microstrip patch array antenna PCB as a micro-computer connector. The radiation pattern of the millimeter-wave signal of the final output is compared with the simulation results. The measured radiation patterns of the fabricated active antenna module confirm that the positions of the 3 dB beam width and null point agree well with the simulation results.

• Electrical & Electronic Materials
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• v.10 no.4
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• pp.349-354
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• 1997

This paper aims at studying the improvement of test method for t-weight sensitive fault (t-wsf) detect. The development of RAM fabrication technology results in not only the increase at device density on chips but also the decrease in line widths in VLSI. But, the chip size that was large and complex is shortened and simplified while the cost of chips remains at the present level, in many cases, even lowering. First of all, The testing patterns for RAM fault detect, which is apt to be complicated , need to be simplified. This new testing method made use of Local Lower Bound (L.L.B) which has the memory with the beginning pattern of 0(l) and the finishing pattern of 0(1). The proposed testing patterns can detect all of RAM faults which contain stuck-at faults, coupling faults. The number of operation is 6N at 1-weight sensitive fault, 9,5N at 2-weight sensitive fault, 7N at 3-weight sensitive fault, and 3N at 4-weight sensitive fault. This test techniques can reduce the number of test pattern in memory cells, saving much more time in test, This testing patterns can detect all static weight sensitive faults and pattern sensitive faults in RAM.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.178-184
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• 2006

Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.27-31
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• 2003

RF characteristics of CPW(coplanar waveguide) pattern with bonding pads used in flip-chip packaging of GaAs is studied in the frequency range of 1 GHz to 35 GHz. Simulation, fabrication and evaluation are performed for the proposed patterns. Measurement results show proposed patterns have similar properties of $S_{11}$below -31 dB and $S_{21}$ above -0.19 dB with typical CPW In addition RF properties are improved with the increase of width of ground line. This indicates CPW structure with bonding pads keeps RF characteristics of typical CPW.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05c
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• pp.55-58
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• 2001

In this paper, we present the results of the design and fabrication of the VCO(Voltage controlled Oscillator) using RF circuit simulator GENESYS and electromagnetic field simulator EMpower Frequency range is fabricated VCO is 850 MHz ~ 950 MHz, which is used Colpitts Circuit. the fabricated VCO is consisted of resonator, oscillator and MSL(Microstrip Line) is used in LC tuning circuit.(operated by negative feedback) MSL(Microstrip Line), Varactor(Plastic package), low noise TR(SOT-23), chip inductor(1608), chip capacitor(1005), chip resistance(1005). 1005 type is used for sample fabrication of VCO. In the fabrication process, circuit pattern is screen printed on the alumina substrates of over 99.9% purity. Center frequency of the sample VCO is 850MHz at $V_T=1.5V$, while the simulated value was 1.0GHz at $V_T=1.5V$. Variable frequency range of the sample is 860~950MHz in contrast to the 1068~1100MHz of the simulated values.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05c
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• pp.153-156
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• 2001

In this paper, we present the results of the design and fabrication of the VCO(Voltage controlled Oscillator) using RF circuit simulator GENESYS and electromagnetic field simulator EMpower Frequency range is fabricated VCO is 850 MHz ~ 950 MHz, which is used Colpitts Circuit. the fabricated VCO is consisted of resonator, oscillator and MSL(Microstrip Line) is used in LC tuning circuit.(operated by negative feedback) MSL(Microstrip Line), Varactor(Plastic package), low noise TR(SOT-23), chip inductor(1608), chip capacitor(1005), chip resistance(1005). 1005 type is used for sample fabrication of VCO. In the fabrication process, circuit pattern is screen printed on the alumina substrates of over 99.9% purity. Center frequency of the sample VCO is 850MHz at $V_T$=1.5V, while the simulated value was 1.0GHz at $V_T$=1.5V. Variable frequency range of the sample is 860~950MHz in contrast to the 1068~1100MHz of the simulated values.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.11
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• pp.1198-1206
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• 2003

In this paper, a MMIC waveguide mixer module based upon the novel suggested mode converter for wave-guide-to-microstrip transition was fabricated and measured. The insertion and return losses of the mode converter was optimized by compensating the discontinuity effect between ridge and microstrip with the modification of 50 $\Omega$ microstrip line pattern. Due to the low loss nature of the mode converter, a millimeter wave MMIC mixer chip can be successfully applied as a waveguide module for mmW waveguide communication system. The measured results of the module showed the successful MMIC chip application in waveguide and the negligible degradation of the supplied chip specification.

• Journal of Institute of Control, Robotics and Systems
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• v.12 no.6
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• pp.539-546
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• 2006

The Air Quality Sensor(AQS), located near the fresh air inlet, serves to reduce the amount of pollution entering the vehicle cabin through the HVAC(heating, ventilating, and air conditioning) system by sending a signal to close the fresh air inlet door/ventilation flap when the vehicle enters a high pollution area. The sensor module which includes two independent sensing elements for responding to diesel and gasoline exhaust gases, and temperature sensor and humidity sensor was designed for intelligent AQS in automobile. With this sensor module, AVR microcontroller was designed with back propagation neural network to a powerful gas/vapor pattern recognition when the motor vehicles pass a pollution area. Momentum back propagation algorithm was used in this study instead of normal backpropagation to reduce the teaming time of neural network. The signal from neural network was modified to control the inlet of automobile and display the result or alarm the situation in this study. One chip microcontroller, ATmega 128L(ATmega Ltd., USA) was used for the control and display. And our developed system can intelligently reduce the malfunction of AQS from the dampness of air or dense fog with the backpropagation neural network and the input sensor module with four sensing elements such as reducing gas sensing element, oxidizing gas sensing element, temperature sensing element and humidity sensing element.