• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.923-924
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.1051-1052
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• 2009

• Journal of the Korean Ceramic Society
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• v.29 no.12
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• pp.956-962
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• 1992

The predominant sintering mechanisms of low firing temperature ceramic substrate which consists of borosilicate glass containing alumina as a filler are the rearrangement of alumina particles and the viscous flow of glass powders. In this system, sintering condition depends on the volume ratio of alumina to glass and on the particle size. When the substrate contains about 35 vol% alumina filler and the average alumina particle size is 4 $\mu\textrm{m}$, the best firing condition is obtained at the temperature range of 900∼1000$^{\circ}C$. The extensive rearrangement behavior occurs at these conditions, and the optimum sintering condition is attained by smaller size of glass particles, too. The formation of cristobalite during sintering causes the difference of thermal expansion coefficient between the substrate and Si chip. This phenomenon degradates the capacity of Si chip. Therefore, the crystallization should be prevented. In the alumina filled borosilicate glass system, the crystallization does not occur. This effect may have some relation with aluminum ions in alumina. For aluminum ions diffuse into glass matrix during sintering, functiong as network former.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2002.11a
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• pp.17-22
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• 2002

This Waterproofing Material which mainly consisted of 2 components of waste tire chip powder and waste glass powder. This Study is abut development of waterproofing Material, There is not tried in domestic. The most Motive of this Study wishes to recycle resources and get the economic performance for waterproofing Material The result of this Study is as followings. (1) Dense waterproofing floor is formed between waste tire chip by Coupling Agent(the most effective method to encourage adhesive strength and raise cohesion of material by combination.) (2) Expected to bring effect to shorten construction period at spot application potentially space-time in moisture aspect. Also, shortening effect of construction period and spot work are considered to be gone efficiently selecting pre-mix construction method. (3) This development Waterproofing material has elasticity that nature side compatibility of cement ingredient and plastic Emulsion have when utilize and constructs waite resources (being waste tire chip and waste glass powdered).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.10
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• pp.1598-1602
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• 2004

In this paper, we report a microthermostat using PDMS (poly-dimethylsiloxane) and glass. This PDMS/glass chip is able to maintain constant temperature that is necessary for restriction enzyme reaction. Since PDMS is the low-cost and the mass-producible material and has very good biochemical compatibility, PDMS chip has more benefit than general Si chip. Heater was made of Au wiring patterned on Pyrex glass. A reaction chamber has a capacity of about 3 ${mu}ell$. We performed a restriction enzyme reaction by using the fabricated microthermostat and conventional method. Then, with the electrophoresis, we made a comparison between the result from the micro reactor and the one from conventional method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.119-120
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• 2009

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.119-126
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.3
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• pp.561-565
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• 2007

We propose glass and PDMS (polydimethylsiloxane) chips for DNA amplification with continuous-flow PCR (polymerase chain reaction). The PDMS microchannel was fabricated using a negative molding method for sample injection. Three heaters and sensors of ITO (indium-tin-oxide) thin films were fabricated on glass chip. ITO heaters and sensors were calibrated accurately for the temperature control of the liquid flow. ITO heater generated stable heat versus applied power. ITO sensor resistance was changed linearly versus temperature increase as a RTD (resistance temperature detector) sensor. As a result, we enable precision temperature control of continuous-flow PCR chip. Using the continuous-flow PCR chip DNA plasmid pKS-GFP 720 bp was successfully amplified.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.300-301
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• 2006

We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG In the PAD party is decreased. However, in case of compress COG. glass bending of applying heat Panel's PAD part and cell at various temperature produced 20um. But, uniformity of cell gap was not decreased. Therefore, it is considered that applying heat Panel's PAD part and cell could decrease uniformity of cell gap and bending of glass.