• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.5
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• pp.286-292
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• 2004

In this study, an integrated microelectrode array was fabricated on glass slide using microfabrication technology. Probe DNAs consisting of mercaptohexyl moiety at their 5-end were spotted on the gold electrode using micropipette or DNA arrayer utilizing the affinity between gold and sulfur. Cyclic voltammetry in 5mM ferricyanide/ferrocyanide solution at 100 ㎷/s confirmed the immobilization of probe DNA on the gold electrodes. When several DNAs were detected electrochemically, there was a difference between target DNA and control DNA in the anodic peak current values. It was derived from specific binding of Hoechst 33258 to the double stranded DNA due to hybridization of target DNA. It suggested that this DNA chip could recognize the sequence specific genes. It suggested that multichannel electrochemical DNA microarray is useful to develop a portable device for clinical gene diagnostic System.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.55-60
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• 2001

RF MEMS is an exciting emerging technology that has great potential to develop TOC (Transceiver-on-Chip). Applications of the RF MEMS to wireless communications systems are presented. The ability of the RF MEMS technology to enhance the performance and to reduce the size of passive components, in particular, switches, inductors, and tunable capacitors, is addressed. A number of potential wireless system opportunities for the TOC are awaiting the maturation of the RF MEMS technology.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.4
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• pp.145-148
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• 2004

In this study, a DNA chip with a microelectrode array was fabricated using microfabrication technology. Several probe DNAs consisting of mercaptohexyl moiety at their 5' end were immobilized on the gold electrodes by a DNA arrayer. Then target DNAs were hybridized and reacted with Hoechst 33258, which is a DNA minor groove binder and electrochemically active dye. Linear sweep voltammetry or cyclic voltammetry showed a difference between target DNA and control DNA in the anodic peak current values. It was derived from Hoechst 33258 and concentrated at the electrode surface through association with the formed hybrid. This suggested that this DNA chip could recognize the sequence specific genes.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.5
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• pp.56-61
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• 2000

Silicon semiconductor technology agrees that the number of transistors on a chip will keep growing exponentially, and it is pushing technology toward the System-On-Chip. In SoC Design, Specification at system level is key of success. Executable Specification reduces verification time. This Paper describes the design of IMDCT for MPEG Audio Decoder employing system-level design methodology and Executable Specification Methodology in the VHDL simulator with FLI environment.

• TTA Journal
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• s.93
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• pp.88-95
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• 2004

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.274-276
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• 2001

This research aims to develop the multiple channel electrochemical DNA chip using microfabrication technology. At first, we fabricated a high integration type DNA chip array by lithography technology. Several probe DNAs consisting of thiol group at their 5-end were immobilized on the sold electrodes. Then target DNAs were hybridized and reacted. Cyclic voltammetry showed a difference between target DNA and control DNA in the anodic peak current values. Therefore, it is able to detect a plural genes electrochemically after immobilization of a plural probe DNA and hybridization of non-labeling target DNA on the electrodes simultaneously. It suggested that this DNA chip could recognize the sequence specific genes.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.6
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• pp.284-292
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• 2008

The density of Memory has been increased by great challenge for memory technology; therefore, elements of memory become more smaller than before and the sensitivity to faults increases. As a result of these changes, memory testing becomes more complex. In addition, as the number of storage elements per chip increases, the test cost becomes more remarkable as the cost per transistor drops. Recent development in system-on-chip(SoC) technology makes it possible to incorporate large embedded memories into a chip. However, it also complicates the test process, since usually the embedded memories cannot be controlled from the external environment. We present a ARM processor-programmable built-in self-test(BIST) scheme suitable for embedded memory testing in the SoC environment. The proposed BIST circuit can be programmed vis an on-chip microprocessor.

• Journal of Sensor Science and Technology
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• v.12 no.2
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• pp.57-65
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• 2003

When a vision chip for edge detection using CMOS process is designed, there is a necessity to implement local light adaptive-function for detecting distinctive features of an image at a wide range of light intensities. Local light adaptation is to achive the almost same output level by changing the size of receptive-fields of the local horizontal cell layers according to input light intensities, based on the lateral inhibitive-function of the horizontal cell. Thus, the almost same output level can be obtained whether input light intensities are much or less larger than background. In this paper, the horizontal cells using a resistive network which consists of p-MOSFETs were modeled and analyzed, and the local light adaptive-mechanism of the designed vision chip using the resistive network was verified.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.308-313
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• 2002

In end milling process, the undeformed chip section area and cutting forces vary periodically with phase change of the tool. However, the real undeformed chip section area deviates from the geometrically ideal one owing to cutter runout and tool shape error. In this study, a method of estimating the real undeformed chip section area which reflects cutter runout and tool shape error was presented during down end-milling of Inconel 715 using measure cutting forces. Contrary to the up-end milling the value of radial specific cutting resistance, $K_r$, becomes larger as the helix angle increases from $30^{\circ}$ to $40^{\circ}$ and it shows almost same value at $50^{\circ}$ The value of tangential specific cutting resistance, $K_t$ becomes larger as the helix angle increases same as in up-end milling, the $KK_r$, and $K_t$ values show a tendency to decrease with increase of the modified chip section area and this tendency is distinct with helix angle $40^{\circ}$.

• Proceedings of the Korean Society of Veterinary Pathology Conference
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• 2003.10a
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• pp.32-32
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• 2003

Intestinal infections are common in growing pigs and can be caused by multiple pathogens, environmental and management factors [1]. Among the most important viruses in swine enteritis are porcine epidemic diarrhea virus (PEDV), transmissible gastroenteritis virus (TGEV), porcine enteric calicivirus (PECV), porcine group A rotavirus (PRV gp A) and bacteria are Escherichia coli and Salmonella spp. and protozoa is Isospora suis [1]. The DNA chip system can serve as a powerful tool that can be utilized for simultaneous detection of specific pathogenic bacteria strains and viruses [2,3]. The combination of PCR and DNA chip technology will provide a novel method for the detection of porcine enteric pathogens thus revolutionize the diagnosis and management of the disease. The aim of this study is to develop DNA chip system for the rapid and reliable detection of five major porcine enteric pathogens based on oligonucleotide DNA chip hybridization. (omitted)