• 한국CDE학회논문집
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• 제5권2호
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• pp.155-167
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• 2000

To be presented is two-dimensional chip-load analysis for cutting-load smoothing which is needed in unmanned machining and high speed machining of sculptured surfaces. Cutter-engagement angle and effective cutting depth are defined as chip-loads which are the geometrical measures corresponding to cutting-load while machining. The extreme values of chip-loads are geometrically derived in the line-line and line-arc-line blocks of the two-dimensional NC-codes. AFA(automatic feedrate adjustment) strategy for cutting-load smoothing is presented based on the chip-load trajectories.

• 한국CDE학회논문집
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• 제5권2호
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• pp.175-183
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• 2000

Proposed in this paper is a model-bated AFA (automatic feedrate-adjustment) method for maintaining smooth cutting-loads (i.e., cutting-force) during 2D-profile milling. Before the cutting-force model was established, some assumptions were verified through a series of preliminary cutting experiments (The results found that the curving-force was independent of the cutting speed and the cutting action at the cutter bosom). From the data obtained during the main cutting experiments, a “chip-load/cutting-force model”representing the cutting-force as a function of the chip-load (i.e., effective cutting-depth) and a feedrate is proposed. Based on the model. an AFA scheme for maintaining smooth cutting-force by adjusting the feedrate (i.e., F-code) according to the changes in chip-load was proposed. To check the validity of the proposed AFA scheme. another set of cutting experiments was conducted by using feedrate-adjusted NC-data while monitoring the actual machining processes using an accelerometer. The experimental results showed that the proposed AFA-scheme was quite effective.

• 한국정밀공학회지
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• 제22권4호
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• pp.68-75
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• 2005

This paper presents a new method for the optimization of feed rate in sculptured surface machining. A NC verification model based on Z-map was utilized to obtain chip load according to feed per tooth. This optimization method can regenerate a new NC program with respect to the commanded cutting conditions and the NC program that was generated from CAM system. The regenerated NC program has not only the same data of the ex-NC program but also the updated feed rate in every block. The new NC data can reduce the cutting time and produce precision products with almost even chip load to the feed per tooth. This method can also reduce tool chipping and make constant tool wear.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.801-805
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• 2000

This paper presents a new method of tool path optimization. A NC verification model based Z-map was utilized to obtain chip load in feed per tooth. This developed software can regenerate a NC program from cutting condition and the NC program that was generated in CAM. The regenerated NC program has not only all same data of the ex-NC program but also the new feed rates in every block. The new NC data can reduce the cutting time and manufacture precision dies with the same chip load in feed per tooth. This method can also prevent tool chipping and make constant tool wear. This paper considered the effects of acceleration and deceleration in feed rate change.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1663-1667
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• 2003

This thesis is on tile development of LD(Laser Diode) chip tester and the control system based on graphical programming language(LabVIEW) to control the equipment. The LD chip tester is used to test the optic power and the optic spectrum of the LD Chip. The emitter size of LD chip and the diameter of the receiver(optic fiber) are very small. Therefore, in order to test each chip precisely, this tester needs high accuracy. However each motion part of the tester could not accomplish hish accuracy due to the limit of the mechanical performance. Hence. an image processing with machine vision was carried out in order to compensate for the error. and also a load test was carried out so as to reduce tile impact of load on chip while the probing motion device is working. The obtained results were within ${\pm}$5$\mu\textrm{m}$ error.

• 한국ITS학회 논문지
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• 제10권1호
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• pp.42-48
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• 2011

본 논문에서는 GaN HEMT (Gallium Nitride High Electron Mobility Transistor) bare-chip을 이용하여 X-대역에서 수동로드 풀(Passive load-pull)을 수행하였다. 열로 인한 특성 변화가 최소화 된 동작 조건을 얻기 위해 드레인 바이어스 전압과 입력 RF 신호를 펄스로 인가하였다. 전자기장 시뮬레이션과 회로 시뮬레이션을 병행하여, 와이어 본딩 효과를 고려하여 드레인 경계면에서의 정확한 임피던스 정합 회로를 구현하였다. 임피던스를 변화시키기 위해 마이크로스트립 라인 스터브의 길이가 조절 가능한 회로를 설계하였다. 펄스 로드 풀 실험 결과 8.5 GHz에서 9.2 GHz 대역에서 최대 42.46 dBm의 출력 전력을 얻었으며, 58.7%의 드레인 효율 특성을 얻었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.537-538
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• 2008

A step-down DC-DC converter with On-chip Compensation for battery-operated portable electronic devices which are designed in 0.18um CMOS standard process. In an effort to improve low load efficiency, this paper proposes the PFM (Pulse Frequency modulation) voltage mode 1MHz switching frequency step-down DC-DC converter with on-chip compensation. Capacitor multiplier method can minimize error amplifier compensation block size by 20%. It allows the compensation block of DC-DC converter be easily integrated on a chip and occupy less layout area. But capacitor multiplier operation reduces DC-DC converter efficiency. As a result, this converter shows maximum efficiency over 87% for the output voltage of 1.8V (input voltage : 3.3V), maximum load current 500mA, and 0.14% output ripple voltage. The total core chip area is $mm^2$.

• 마이크로전자및패키징학회지
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• 제25권1호
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• pp.1-10
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• 2018

최근 플렉서블 OLED, 플렉서블 반도체, 플렉서블 태양전지와 같은 유연전자소자의 개발이 각광을 받고 있다. 유연소자에 밀봉 혹은 봉지(encapsulation) 기술이 매우 필요하며, 봉지 기술은 유연소자의 응력을 완화시키거나, 산소나 습기에 노출되는 것을 방지하기 위해 적용된다. 본 연구는 봉지막(encapsulation layer)이 반도체 칩의 내구성에 미치는 영향을 고찰하였다. 특히 다층 구조 패키지의 칩의 파괴성능에 미치는 영향을 칩의 center crack에 대한 파괴해석을 통하여 살펴보았다. 다층구조 패키지는 폭이 넓어 칩 위로만 봉지막이 덮고있는 "wide chip"과 칩의 폭이 좁아 봉지막이 칩과 기판을 모두 감싸고 있는 "narrow chip"의 모델로 구분하였다. Wide chip모델의 경우 작용하는 하중조건에 상관없이 봉지막의 두께가 두꺼울수록, 강성이 커질수록 칩의 파괴성능은 향상된다. 그러나 narrow chip모델에 인장이 작용할 때 봉지막의 두께가 두껍고 강성이 커질수록 파괴성능은 악화되는데 이는 외부하중이 바로 칩에 작용하지 않고 봉지막을 통하여 전달되기에 봉지막이 강하면 강한 외력이 칩내의 균열에 작용하기 때문이다. Narrow chip모델에 굽힘이 작용할 경우는 봉지막의 강성과 두께에 따라 균열에 미치는 영향이 달라지는데 봉지막의 두께가 작을 때는 봉지막이 없을 때보다 파괴성능이 나쁘지만 강성과 두께의 증가하면neutral axis가 점점 상승하여 균열이 있는 칩이 neutral axis에 가까워지게 되므로 균열에 작용하는 하중의 크기가 급격히 줄어들게 되어 파괴성능은 향상된다. 본 연구는 봉지막이 있는 다층 패키지 구조에 다양한 형태의 하중이 작용할 때 패키지의 파괴성능을 향상시키기 위한 봉지막의 설계가이드로 활용될 수 있다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 춘계학술대회 논문집
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• pp.93-98
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• 2004

A reasonable analysis of cutting force in end milling may give much advantage to improvement of productivity and cutting tool life. In order to analyze cutting force, the cutting dynamics was modelled mathematically by using chip load, cutting geometry, and the relationship between cutting forces and the chip load. Specific cutting constants of the cutting dynamics model were obtained by average cutting forces, tool diameter, cutting speed, feed, axial depth, and radial depth of cut. The effects of the cutting conditions on the specific cutting force constants in milling were studied. The model is verified through comparisons of model predicted cutting forces with measured culling forces obtained from machining experiments

• 한국공작기계학회논문집
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• 제13권4호
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• pp.9-15
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• 2004

A reasonable analysis of cutting force in end milling may give much advantage to improvement of productivity and cutting tool life. In order to analyze cutting force, the cutting dynamics was modelled mathematically by using chip load, cutting geometry, and the relationship between cutting forces and the chip load. The specific cutting constants of the cutting dynamics model were obtained by average cutting forces, tool diameter, cutting speed, feed, axial depth, and radial depth of cut. The model is verified through comparisons of model predicted cutting forces with measured cutting forces obtained from machining experiments. The results showed good agreement and from that we could predict reasonably the cutting forces in end milling.